| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 161 | MODULAR DATA CENTER | US13839709 | 2013-03-15 | US20140190198A1 | 2014-07-10 | William Slessman; Steve Durand; Rose Gilbert; Andreas Zoll |
| Described are methods, systems, and apparatus, including computer program products, relating to an air module and control thereof. An air module can include a controller, an air intake module configured to receive first air from a first air source and to receive second air from a second air source, an evaporative cooling module in fluid communication with the air intake module, and a mechanical cooling module in fluid communication with the evaporative cooling module. The controller can be configured to cause the intake module to mix the first air and the second air to form intake air, and selectively cool the intake air to form supply air by at least one of causing the evaporative cooling module to selectively cool the intake air, and causing the mechanical cooling module to selectively cool the intake. | ||||||
| 162 | Distributed refrigeration system with optional storage module and controller | US11769989 | 2007-06-28 | US08336322B2 | 2012-12-25 | Nihat O. Cur; Steven John Kuehl; John Joseph Vonderhaar; Diego Barone; Lorenzo Bianchi |
| A distributed refrigeration appliance system in a residential kitchen and other locations in a dwelling including multiple separate refrigeration appliance modules, a central cooling system and a cooling circuit. The system can also include one or more satellite stations having a heat exchanger and arranged for supplying chilled air to one or more refrigeration appliance modules. One or more refrigeration appliance modules can include a thermal cascade cooling device to cool the module to lower temperatures than the cooling circuit can attain. One or more refrigeration appliance modules can be refrigeration/storage modules that can provide refrigerated, unconditioned or heated storage space. The central cooling system can be a vapor compression system having a refrigerant circuit connecting the modules. Alternately, the central cooling system can cool a secondary cooling medium circuit. The refrigeration system can also have more than one refrigeration machine providing cooling to the secondary refrigeration loop. | ||||||
| 163 | UTILITIES GRID FOR DISTRIBUTED REFRIGERATION SYSTEM | US13432047 | 2012-03-28 | US20120186279A1 | 2012-07-26 | NIHAT O. CUR; STEVEN J. KUEHL |
| A distributed refrigeration appliance system for use in a residential kitchen and other locations in a dwelling and includes multiple separate refrigeration appliance modules, a central cooling system and a cooling circuit. The system can include one or more satellite stations having a heat exchanger for supplying chilled air to one or more refrigeration appliance modules. One or more refrigeration appliance modules can include a thermal cascade cooling device to cool the module to lower temperatures than the cooling circuit can attain. One or more refrigeration appliance modules can be refrigeration/storage modules that can provide refrigerated, unconditioned or heated storage space. The central cooling system can be a vapor compression system having a refrigerant circuit connecting the modules. Alternately, the central cooling system can cool a secondary cooling medium circuit. The refrigeration system can have more than one refrigeration machine providing cooling to the secondary refrigeration loop. | ||||||
| 164 | Refrigeration System for Compact Equipment | US13262338 | 2010-03-30 | US20120090343A1 | 2012-04-19 | Paulo Rogerio Carrara Couto; Guilherme Borges Ribeiro |
| The present invention provides a refrigeration system for compact equipment, particularly of the type including electronic circuits and internally provided with a heat source to be cooled, said refrigeration system including a heat dissipation device mounted in the equipment and including a heat absorbing portion, which absorbs heat from the heat source, and a heat dissipation portion accessible from the outside of the equipment and which releases the heat to the exterior of the equipment; and an auxiliary refrigeration circuit external to the equipment and having: a heat absorbing means to be selectively coupled to the heat dissipation portion so as to receive therefrom, by conduction, at least part of the heat received from the heat source and dissipated by said heat dissipation portion; and a heat dissipation means which releases the heat to the environment external to the equipment. | ||||||
| 165 | TECHNIQUES FOR INDIRECT COLD TEMPERATURE THERMAL ENERGY STORAGE | US13187829 | 2011-07-21 | US20120047891A1 | 2012-03-01 | Matthew Rosenfeld |
| During off-peak operation of a power plant operating on a thermodynamic cycle wherein heat is rejected to an ambient fluid, heat is removed from a cold temperature storage medium. The cold temperature storage medium is stored until the power plant is experiencing a peak period. During the peak period, the stored cold temperature storage medium is used to absorb heat from the ambient fluid prior to heat rejection from the thermodynamic cycle to the ambient fluid, to improve performance of the thermodynamic cycle. In another aspect, the stored cold temperature storage medium is mixed with the ambient fluid prior to heat rejection from the thermodynamic cycle to the ambient fluid. Corresponding systems, apparatuses, retrofit methods, design and control techniques are also disclosed. | ||||||
| 166 | Thermoelectric fluid heat exchange system | US11679103 | 2007-02-26 | US08001794B2 | 2011-08-23 | Robert Windisch |
| A thermoelectric heat exchange system for fluids comprising a pumping device, configured to deliver a fluid; a fluid inlet system in fluid communication with the pumping device; a fluid outlet system in fluid communication with the pumping device; a reservoir in fluid communication with the pumping device, and configured to hold a fluid; and a heat exchange system in fluid communication with the fluid delivery system, including: a heat exchange plate in fluid communication with the fluid system, comprising a channel system wherein the width of the channel system is about an order of magnitude greater than the depth of the channel system; a thermoelectric cooling module in thermal communication with the heat exchange plate; and a heat sink in communication with the thermoelectric cooling module, and configured to dissipate heat from the thermoelectric cooling module. | ||||||
| 167 | METHODS AND SYSTEMS FOR CONTROLLING INTEGRATED AIR CONDITIONING SYSTEMS | US12674135 | 2007-09-18 | US20110094246A1 | 2011-04-28 | Batung Pham; Pierre Delpech; Philippe Rigal |
| An integrated air conditioning system having a first air conditioning unit having a first evaporator with a first input and a first output; a second air conditioning unit having a second evaporator with a second input and a second output; a first conduit fluidly connecting the first input with the second output; a second conduit fluidly connecting the second input with the first output. The first and second conduits and the first and second evaporators form a working fluid circuit. | ||||||
| 168 | Hybrid thermoelectric-vapor compression system | US11990591 | 2005-08-15 | US07926294B2 | 2011-04-19 | Chung-Yi Tsai; Rakesh Radhakrishnan; Xiaomei Yu |
| A heating and cooling system to maintain an area at a desired temperature including a thermoelectric device (102), a vapor compression system (106), and a control system (104) operably connected to the thermoelectric device (102) and the vapor compression system (106). | ||||||
| 169 | Cooling and heating systems and methods utilizing thermo-electric devices | US12014786 | 2008-01-16 | US07866164B2 | 2011-01-11 | Douglas T. Rice |
| In one embodiment, a cooling and heating system includes a heat exchanger, a thermoelectric cooler coupled to the heat exchanger and operable to cool or heat a fluid within the heat exchanger, a heat transfer device, an input conduit coupled between the heat exchanger and the heat transfer device, a return conduit coupled between the heat exchanger and the heat transfer device, and a pump operable to transport the fluid through the input conduit, the heat exchanger, the return conduit, and the heat transfer device. Thermal energy existing within the fluid, while flowing through the heat transfer device, is utilized to heat or cool an environment adjacent the heat transfer device. | ||||||
| 170 | Cooling Infrastructure Leveraging a Combination of Free and Solar Cooling | US12479798 | 2009-06-06 | US20100307171A1 | 2010-12-09 | Hendrik F. Hamann; Madhusudan K. Iyengar; Theodore G. van Kessel |
| Energy-efficient data center cooling techniques that utilize free cooling and/or solar cooling are provided. In one aspect, a cooling system is provided including a cooling tower; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the cooling tower, through one or more of the modular refrigeration chiller units or through a combination thereof. Another cooling system is provided including a solar cooling unit; one or more modular refrigeration chiller units; and a water loop that can be selectively directed through the solar cooling unit, through one or more of the modular refrigeration chiller units or through a combination thereof. | ||||||
| 171 | Heat-dissipating module and electronic device having the same | US12417343 | 2009-04-02 | US07843694B2 | 2010-11-30 | Chuan Yi Liang; Ming Chang Wu |
| An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop. | ||||||
| 172 | THERMOELECTRIC COOLER FOR ECONOMIZED REFRIGERANT CYCLE PERFORMANCE BOOST | US12597975 | 2007-06-19 | US20100122540A1 | 2010-05-20 | Michael F. Taras; Alexander Lifson |
| A refrigerant system incorporates an economizer circuit, and a thermoelectric cooler to provide a performance boost to the conventional economized refrigerant system. A thermoelectric cooler cools the refrigerant either directly in a main refrigerant circuit, or in an economized circuit, or both. | ||||||
| 173 | HEAT-DISSIPATING MODULE AND ELECTRONIC DEVICE HAVING THE SAME | US12417343 | 2009-04-02 | US20100079952A1 | 2010-04-01 | Chuan Yi Liang; Ming Chang Wu |
| An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop. | ||||||
| 174 | Cooling system and method | US11562805 | 2006-11-22 | US07658079B2 | 2010-02-09 | Peter F. Bailey; Walter C. Joncas; Gregory W. Dodge |
| The present invention related to cooling systems. More specifically, the present invention relates to a system for cooling one or more parts of a building and or processes comprising a compressor, a condenser having an inlet and an outlet and a plurality of condenser cooling fans, a receiver, a liquid refrigerant pump, an expansion device, an evaporator, the evaporator being surrounded by a chiller barrel having a cooled water return and a chilled water supply line, and refrigerant line means interconnecting the compressor, condenser, expansion device and evaporator in series, in a closed loop for circulating refrigerant therethrough; means for switching the cooling system between free cooling and mechanical cooling and means for actively floating the head pressure in both mechanical and free cooling modes. | ||||||
| 175 | FREE-COOLING LIMITATION CONTROL FOR AIR CONDITIONING SYSTEMS | US12520831 | 2006-12-21 | US20100023166A1 | 2010-01-28 | Julien Chessel; Pierre Delpech; Damien Poux |
| An air conditioning system having a cooling mode and a free-cooling mode. The system includes a refrigeration circuit have a compressor, a pump, an expansion device having a variable opening, and a controller. The controller selectively operates the system in the cooling mode by circulating and compressing a refrigerant through the refrigeration circuit via said compressor, or in the free-cooling mode by circulating the refrigerant through the refrigeration circuit via the pump. A free-cooling limitation and variation sequence resides on said controller and varies the variable opening based at least upon a differential temperature. | ||||||
| 176 | Methods and devices for polarized samples for use in MRI | US11591846 | 2006-11-02 | US07631507B2 | 2009-12-15 | Ernst Wolfgang Stautner |
| A method and an apparatus for producing hyperpolarized samples for use in magnetic resonance imaging (MRI) are provided. The apparatus comprises an ultra-compact cryogen-free cryostat structure for use in polarizing a sample of selected material, wherein the cryostat structure comprises a central bore being adapted to be evacuated to create a vacuum region, and a cooling device inserted in the central bore or optionally close to the central bore for maintaining a selected temperature of the sample. | ||||||
| 177 | Thermoelectric device based refrigerant subcooling | US11991332 | 2005-08-29 | US20090266084A1 | 2009-10-29 | Rakesh Radhakrishnan; Xiaomei Yu; Gregory M. Dobbs; David Tew; Michael K. Sahm; Chung-Yi Tsai |
| A subcooler (15) for a vapor compression cycle having a refrigerant. The subcooler (15) including a conduit (45) and one or more thermoelectric modules (17). The conduit (45) being in fluid communication with the vapor compression cycle for flow of the refrigerant therethrough. Each of the one or more thermoelectric modules (17) has a cold side in thermal communication with an inner volume of the conduit (45) for subcooling the refrigerant. | ||||||
| 178 | Cooling system and method | US11742986 | 2007-05-01 | US07581409B2 | 2009-09-01 | Peter F. Bailey; Walter C. Joncas; Gregory W. Dodge |
| The present invention related to cooling systems. More specifically, the present invention relates to a system for cooling one or more parts of a building and or processes comprising a compressor, a condenser having an inlet and an outlet and a plurality of condenser cooling fans, a receiver, a liquid refrigerant pump, an expansion device, an evaporator, the evaporator being surrounded by a chiller barrel having a cooled water return and a chilled water supply line, and refrigerant line means interconnecting the compressor, condenser, expansion device and evaporator in series, in a closed loop for circulating refrigerant therethrough; means for switching the cooling system between free cooling and mechanical cooling and means for actively floating the head pressure in both mechanical and free cooling modes. | ||||||
| 179 | Cooling apparatus for articles operated at low temperature | US11113200 | 2005-04-25 | US07571616B2 | 2009-08-11 | Kazunori Yamanaka; Teru Nakanishi |
| A cooling apparatus for articles operated at low temperatures comprises a refrigerating machine and a cold head provided in the refrigerating machine. A first Peltier element is thermally contacted and fixed with the cold head, and a second Peltier element is thermally contacted and fixed with the cold head. A first article can be arranged with the first Peltier element with being thermally contacted therewith, and a second article can be arranged with the second Peltier element with being thermally contacted therewith. The cold head is cooled to low temperatures by the refrigerating machine, and temperatures of the first article and the second article each is further controlled by the first Peltier element and the second Peltier element, respectively, to thereby cool the articles to different temperatures. | ||||||
| 180 | Cryogenic liquefying/refrigerating method and system | US11748729 | 2007-05-15 | US07540171B2 | 2009-06-02 | Nobumi Ino; Takayuki Kishi; Toshio Nishio; Akito Machida; Yoshimitsu Sekiya; Masami Kohama; Masato Noguchi |
| Cryogenic liquefying/refrigerating method and system, wherein temperature of gas-to-be-liquefied at the inlet of the compressor for compressing the gas is reduced by cooling the gas discharged from the compressor using a high-efficiency chemical refrigerating machine and vapor compression refrigerating machine before the gas is introduced to a multiple stage heat exchanger thereby reducing power input to the compressor and improving liquefying/refrigerating efficiency. Gas-to-be-liquefied compressed by a compressor is cooled by aftercooler, and further cooled by an adsorption refrigerating machine which utilizes waste heat generated in the compressor and by an ammonia refrigerating machine 40, then the high pressure gas is introduced to a multiple-stage heat exchanger where it is cooled by low pressure low temperature gas separated from a mixture of liquid and gas generated by adiabatically expanding the high pressure gas through an expansion valve 30 and returning to the compressor, and a portion of the high pressure gas is expanded adiabatically by expansion turbines in mid-course of flowing of the high pressure gas through the stages of the heat exchanger to be joined with the low pressure low temperature gas returning to the compressor. | ||||||
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