| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 水处理系统和具有阴极保护的水加热器和水处理方法 | CN03809429.0 | 2003-04-09 | CN100575268C | 2009-12-30 | 克里斯蒂安·皮埃尔 |
| 一种水加热器包括限定水加热室壳体，所述壳体的至少一部分是金属的；以及设置在壳体中用于加热水的金属加热元件，其中壳体的金属部分和金属加热元件电连接，壳体的金属部分是阴极，金属加热元件是阳极，电流从金属加热元件流出，通过水，到达壳体的金属部分。还公开了一种用于处理水的系统，其包括水加热器和设置在壳体中用于收集从水中沉积的固体沉积物的收集器。还公开了用于加热和处理水的方法。 | ||||||
| 2 | 半导体聚合体系、其利用装置以及其在控制腐蚀方面的用途 | CN02811467.1 | 2002-06-07 | CN1242097C | 2006-02-15 | 大卫B·道林 |
| 为了提供更广泛系列的半导体元件和一种可以防止同腐蚀环境接触的金属组织表面受腐蚀的体系，本发明提供了一种将有机涂料、电子及半导体技术结合的半导体体系，该体系包括：a)半导体有机聚合物涂料，至少同部分表面接触；和b)电子滤波器，用于过滤腐蚀杂波，及一种使用该体系防止腐蚀的方法。 | ||||||
| 3 | 用于减少和/或防止空间天气诱导的腐蚀的控制设备、系统和方法 | CN200680014490.4 | 2006-03-17 | CN101184869B | 2013-06-26 | 大卫·B.·道林; 法尔塞德·霍拉米; 约瑟夫·G.·米歇尔斯; 迈克尔·帕纳修克 |
| 本发明提供一种设备、系统、方法和计算机程序产品，旨在控制与腐蚀环境接触并涂覆半导体涂层的导电结构的腐蚀，特别是空间天气诱导的腐蚀，其中，该腐蚀是由可控滤波器(898)和相应的电子控制单元(899)控制的，该电子控制单元被设置为与至少一个与空间天气对导电结构影响相关的测量参数相对应来处理和调节可控滤波器。 | ||||||
| 4 | 具有电化隔离的车轮组件 | CN201010577042.3 | 2010-10-19 | CN102039779A | 2011-05-04 | R·M·克莱伯; R·维尔马 |
| 本发明涉及具有电化隔离的车轮组件。示例性实施例包括一种将外轮部分与轮毂电化隔离的产品和方法。中心轮部分可含有电化活性低于外轮部分的材料，并且可通过互锁装置连接到外轮部分上。 | ||||||
| 5 | 成膜装置用结构部件及其清洗方法 | CN200480002352.5 | 2004-02-18 | CN100476037C | 2009-04-08 | 平田招佑; 矶田伸二; 门肋丰; 虫明克彦 |
| 本发明提供了一种成膜装置用结构部件以及该结构部件的清洗方法。所述装置具有能够用比以往更少的时间剥离去除形成在结构部件上的附着膜d，减轻由于清洗液s造成的构造上的损坏。通过溶射、蒸镀、溅镀、层压(laminating)等方法在母材金属(1)的表面形成在电化学性上比所述结构部件的母材(1)金属贱的金属膜层(2)。或采用上述溶射等方法，通过在金属膜层(2)的表面形成在电化学性上比上述母材金属(1)贵的第2金属膜层(3)，从而使金属膜层(2)在与母材金属(1)或第2金属膜层(3)之间形成局部电池，可使母材金属(1)自身不受清洗液的损伤，以极短的时间剥离堆积在母材金属(1)上的附着膜d。 | ||||||
| 6 | 用于减少和/或防止空间天气诱导的腐蚀的控制设备、系统和方法 | CN200680014490.4 | 2006-03-17 | CN101184869A | 2008-05-21 | 大卫·B.·道林; 法尔塞德·霍拉米; 约瑟夫·G.·米歇尔斯; 迈克尔·帕纳修克 |
| 本发明提供一种设备、系统、方法和计算机程序产品，旨在控制与腐蚀环境接触并涂覆半导体涂层的导电结构的腐蚀，特别是空间天气诱导的腐蚀，其中，该腐蚀是由可控滤波器(898)和相应的电子控制单元(899)控制的，该电子控制单元被设置为与至少一个与空间天气对导电结构影响相关的测量参数相对应来处理和调节可控滤波器。 | ||||||
| 7 | 半导体聚合体系、其利用装置以及其在控制腐蚀方面的用途 | CN02811467.1 | 2002-06-07 | CN1526036A | 2004-09-01 | 大卫B·道林 |
| 为了提供更广泛系列的半导体元件和一种可以防止同腐蚀环境接触的金属组织表面受腐蚀的体系，本发明提供了一种将有机涂料、电子及半导体技术结合的半导体体系，该体系包括：a)半导体有机聚合物涂料，至少同部分表面接触；和b)电子滤波器，用于过滤腐蚀杂波，及一种使用该体系防止腐蚀的方法。 | ||||||
| 8 | 篮筐型正极 | CN201580032599.X | 2015-06-18 | CN106460224A | 2017-02-22 | 上仲秀哉; 白泽教太; 山口博幸; 大六野裕太; 难波秀德 |
| 篮筐型正极在镀浴中容纳镀覆原料粒，用于钢带的电镀。篮筐型正极具备与钢带相对配置的Ti制的网状部件，网状部件含有铂族元素。网状部件含有铂族元素时，能够防止网状部件的腐蚀，能够提高网状部件的寿命。 | ||||||
| 9 | 具有电化隔离的车轮组件 | CN201010577042.3 | 2010-10-19 | CN102039779B | 2013-12-04 | R·M·克莱伯; R·维尔马 |
| 本发明涉及具有电化隔离的车轮组件。示例性实施例包括一种将外轮部分与轮毂电化隔离的产品和方法。中心轮部分可含有电化活性低于外轮部分的材料，并且可通过互锁装置连接到外轮部分上。 | ||||||
| 10 | 抑制金属腐蚀的方法 | CN200510069527.0 | 2005-05-12 | CN1699625B | 2010-11-03 | 麦克·E·路易斯 |
| 本发明主要提供一种在金属物体整体表面上感应一表面电流以防止该金属物体腐蚀的方法。该表面电流可通过直接或间接施加具有由电路产生的AC分量的电波形被感应。金属主体和DC电压源(电池)的负端子接地。DC电压源的正端子连接至将低电压DC的电波形传至连接至金属主体的传导端子的电子电路。感应表面电流的替代方法包括经由金属主体的直接电容放电，或在金属主体上电磁场的移动，或通过产生附着于发射天线的RF信号以使发射信号由该金属主体接收。 | ||||||
| 11 | 成膜装置用结构部件及其清洗方法 | CN200480002352.5 | 2004-02-18 | CN1738926A | 2006-02-22 | 平田招佑; 矶田伸二; 门肋丰; 虫明克彦 |
| 本发明提供了一种成膜装置用结构部件以及该结构部件的清洗方法。所述装置具有能够用比以往更少的时间剥离去除形成在结构部件上的附着膜d，减轻由于清洗液s造成的构造上的损坏。通过溶射、蒸镀、溅镀、层压(laminating)等方法在母材金属(1)的表面形成在电化学性上比所述结构部件的母材(1)金属贱的金属膜层(2)。或采用上述溶射等方法，通过在金属膜层(2)的表面形成在电化学性上比上述母材金属(1)贵的第2金属膜层(3)，从而使金属膜层(2)在与母材金属(1)或第2金属膜层(3)之间形成局部电池，可使母材金属(1)自身不受清洗液的损伤，以极短的时间剥离堆积在母材金属(1)上的附着膜d。 | ||||||
| 12 | 抑制金属腐蚀的方法 | CN200510069527.0 | 2005-05-12 | CN1699625A | 2005-11-23 | 麦克·E·路易斯 |
| 本发明主要提供一种在金属物体整体表面上感应一表面电流以防止该金属物体腐蚀的方法。该表面电流可通过直接或间接施加具有由电路产生的AC分量的电波形被感应。金属主体和DC电压源(电池)的负端子接地。DC电压源的正端子连接至将低电压DC的电波形传至连接至金属主体的传导端子的电子电路。感应表面电流的替代方法包括经由金属主体的直接电容放电，或在金属主体上电磁场的移动，或通过产生附着于发射天线的RF信号以使发射信号由该金属主体接收。 | ||||||
| 13 | 水处理系统和具有阴极保护的水加热器和水处理方法 | CN03809429.0 | 2003-04-09 | CN1649795A | 2005-08-03 | 克里斯蒂安·皮埃尔 |
| 一种水加热器包括限定水加热室壳体，所述壳体的至少一部分是金属的；以及设置在壳体中用于加热水的金属加热元件，其中壳体的金属部分和金属加热元件电连接，壳体的金属部分是阴极，金属加热元件是阳极，电流从金属加热元件流出，通过水，到达壳体的金属部分。还公开了一种用于处理水的系统，其包括水加热器和设置在壳体中用于收集从水中沉积的固体沉积物的收集器。还公开了用于加热和处理水的方法。 | ||||||
| 14 | A METHOD OF INSTALLING AN UNBONDED FLEXIBLE PIPE | US15525782 | 2015-11-09 | US20180298705A1 | 2018-10-18 | Jonas Gudme; Adam Rubin; Marie Haahr |
| The present invention relates to a method of installing an unbonded flexible pipe with a bore for transportation of fluid wherein the unbonded flexible pipe comprises an outer sheath, an inner sealing sheath inside the outer polymer sheath, an annulus between said outer sheath and said inner sealing sheath and at least one metallic armor layer comprising iron located in said annulus, wherein the method comprises filling at least a part of the annulus with a corrosion promoting liquid before or after installing the unbonded flexible pipe between a first installation and a second installation. | ||||||
| 15 | Components for a film-forming device and method for cleaning the same | US10538856 | 2004-02-18 | US08216654B2 | 2012-07-10 | Akisuke Hirata; Shinji Isoda; Yutaka Kadowaki; Katsuhiko Mushiake |
| There are provided a film forming equipment component having a structure in which an deposited film d formed on the component can be separated from the component for a time period shorter than the prior art to reduce damage due to a cleaning fluid S, and a method of cleaning such a component. A metal film layer 2 electrochemically less noble than the matrix metal material 1 of the aforementioned component is formed on the surface of the matrix metal material 1 through thermal spraying, vapor depositing, sputtering, laminating or other process. Alternatively, a second metal film layer 3 electrochemically more noble than the aforementioned matrix metal material 1 is formed on the surface of the metal film layer 2 through said thermal spraying or other process. Thus, a local cell is formed between the metal film layer 2 and the matrix metal material 1 or the second metal film layer 3. Therefore, the deposited film d can be separated from the matrix metal material 1 for an extremely shortened time period, without damaging the matrix metal material 1 itself from the cleaning fluid S. | ||||||
| 16 | Clamp for securing components | US12805391 | 2010-07-28 | US20120006948A1 | 2012-01-12 | Helmut Hiss; Jochen Caspari |
| 2. A clamp for securing components, in particular string-like or linear structural members, like pipelines, hoses, or cables, having at least one clamp part (3), of which the outer contour (4) delimits at least partially a receiving space (5) for receiving the respective component, at least one clamp part (3) having a mechanism (6) for minimizing corrosion, in particular, crevice corrosion, at every component that is held, is characterized in that the mechanism has at least one sacrificial element (7) that is visibly consumed with the onset of corrosion and continued duration of use of the clamp fastener and that the respective sacrificial element (7) is placed, as an independent component, on the outer contour (4) of the assignable clamp part (3). | ||||||
| 17 | Process for cathodic protection of electrode material | US12708358 | 2010-02-18 | US08034229B2 | 2011-10-11 | Dao Min Zhou; Amy Hines; James Singleton Little; Robert J. Greenberg |
| The invention is a process for cathodic protection of electrodes wherein negative bias is applied on the electrode. The negative bias is obtained by asymmetric current pulse, which is obtained by negative phase pulsing with higher amplitude than that of the anodic phase. The asymmetric current pulse is obtained by negative phase pulsing with wider pulse width than that of the anodic phase. The asymmetric current pulse may also be obtained by negative phase pulsing with both higher amplitude and wider pulse width than that of the anodic phase. The invention further relates to a process for cathodic protection of electrodes, wherein negative bias is applied on the electrode, and the negative bias is obtained by asymmetric current pulse, where the asymmetric current pulse is obtained by negative phase pulsing with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains. | ||||||
| 18 | Process for cathodic protection of electrode materials | US11924349 | 2007-10-25 | US07638032B2 | 2009-12-29 | Dao Min Zhou; Amy Hines; James Singleton Little; Robert J. Greenberg |
| The present invention relates to a process for cathodic protection of electrode or electrode materials wherein negative bias is applied on the electrode. the negative bias is obtained by asymmetric current pulse. The asymmetric current pulse is obtained by performing negative phase with higher amplitude. The asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The asymmetric current pulse is obtained by performing negative phase with higher amplitude and with wider pulse width than that of the anodic phase. The present invention further relates to a process for cathodic protection of electrode or electrode materials, wherein negative bias is applied on the electrode, wherein the negative bias is obtained by asymmetric current pulse, wherein the asymmetric current pulse is obtained by performing negative phase with wider pulse width than that of the anodic phase. The wider pulse width is obtained by pulse trains. | ||||||
| 19 | Semiconductor device manufacturing apparatus and operating method thereof | US11473159 | 2006-06-23 | US07556711B2 | 2009-07-07 | Hidenori Miyoshi |
| A semiconductor device manufacturing apparatus is disclosed. The semiconductor device manufacturing apparatus applies a process to a semiconductor wafer by supplying a vapor of a corrosive liquid source to a processing container. An electrode is immersed in a storing container which stores the corrosive liquid source. The main material of the electrode is a metal whose ionization tendency is less than that of a metal of the storing container, and a protection current is applied between them by a DC power source. Or another electrode is used. The main material of the electrode is a metal whose ionization tendency is greater than that of the metal of the storing container and the metal of the electrode does not damage the semiconductor wafer. A protection current is applied between the storing container and the electrode by utilizing the difference of the ionization tendency between them. | ||||||
| 20 | Semiconductive corrosion and fouling control apparatus, system, and method | US10978352 | 2004-11-02 | US20050109635A1 | 2005-05-26 | David Dowling; Farshad Khorrami |
| An apparatus, system, method and computer program product directed to controlling corrosion of a conductive structure in contact with a corrosive environment and coated with a semiconductive coating, where the corrosion is controlled by a controllable filter and a corresponding electronic control unit configured to process at least one stored or measured parameter. | ||||||
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