序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
1 低挥发性有机溶剂粘合剂 CN98805817.0 1998-05-27 CN1259160A 2000-07-05 C·D·康吉里奥; A·M·欧拉
发明涉及一种低VOC溶剂粘合剂,包括至少两种有机溶剂和热塑性树脂的混合物。按ASTM D3828-87方法测定,粘合剂的闪点至少为100°F较为理想,本发明的低VOC溶剂基粘合剂的溶剂共混物的挥发速度较传统溶剂基粘合剂中溶剂共混物挥发速度显著降低。此外,本新型溶剂基粘合剂易于涂布,价格合理,且无须加热、紫外光照射或其它机械设备就可在适当时间内固化。另外,新型低VOC溶剂基粘合剂在金属和非金属容器中具有很好的储存稳定性
2 氯化聚氯乙烯承压设备的施胶方法 CN201610286765.5 2016-04-29 CN105736885A 2016-07-06 辛明亮; 李茂东; 林华义; 肖玉刚; 杨波; 黄国家
发明涉及一种氯化聚氯乙烯承压设备的施胶方法,所述氯化聚氯乙烯承压设备包括氯化聚氯乙烯承压管道和氯化聚氯乙烯承压管件。本发明施胶方法处理后的氯化聚氯乙烯承压设备,粘接效果佳,具有高粘接强度,密封性能以及成品的可靠性好,可以满足氯化聚氯乙烯相关产品标准中承压强度的要求。
3 PVC管道及其制备方法 CN201410563023.3 2014-10-21 CN104455882A 2015-03-25 伍克军
发明公开了一种PVC管道及其制备方法,所述PVC管道包括多个PVC管,且相邻的两个PVC管通过胶黏剂粘合而成;其中,所述胶黏剂含有过氯乙烯树脂、聚氯乙烯树脂、乙酸丁酯、环己、二氯乙烷、醇酸树脂、邻苯二甲酸二丁酯和轻质。通过该方法制得的PVC管道具有优异的压爆破强度,且该制备方法步骤简单、原料易得。
4 低挥发性有机溶剂粘合剂 CN98805817.0 1998-05-27 CN1122694C 2003-10-01 C·D·康吉里奥; A·M·欧拉
发明涉及一种低VOC溶剂粘合剂,包括至少两种有机溶剂和热塑性树脂的混合物。按ASTM D3828-87方法测定,粘合剂的闪点至少为100°F较为理想,本发明的低VOC溶剂基粘合剂的溶剂共混物的挥发速度较传统溶剂基粘合剂中溶剂共混物挥发速度显著降低。此外,本新型溶剂基粘合剂易于涂布,价格合理,且无须加热、紫外光照射或其它机械设备就可在适当时间内固化。另外,新型低VOC溶剂基粘合剂在金属和非金属容器中具有很好的储存稳定性
5 低挥发性有机溶剂基础粘合剂 CN97114713.2 1997-07-18 CN1172837A 1998-02-11 C·D·康格里奥; A·M·奥拉
发明涉及含至少两种有机溶剂混合物和热塑性树脂的低VOC溶剂为基础粘合剂。本发明的低VOC溶剂为基础的粘合剂与传统的溶剂为基础的粘合剂相比,蒸发速度大大降低。此外,此新的低VOC溶剂为基础的粘合剂易于涂施、成本低、可在合理的时间内固化,同时不用加热、紫外线或其它机械装置。
6 Hardenable adhesive agent paint JP7469382 1982-05-06 JPS57192478A 1982-11-26 NORISU AARU REGIYU; MAIRON SHIYAPIRO
A curable urethane adhesive composition having a high green strength consisting essentially of a mixture of an isocyanate terminated ricinoleate prepolymer and chlorinated polyvinyl chloride curable by reaction with compounds having reactive hydrogens such as water, amines, polyols, urethanes, ureas and the like.
7 PVC-BASED ADHESIVE SUITABLE FOR BONDING PVC PIPES AND USE OF SAID ADHESIVE EP13710594.6 2013-02-12 EP2814893A1 2014-12-24 BIERENS, Johannes Petrus Maria; KLERKS, Johannes Patricius Maria
The present invention relates to a PVC-based adhesive for bonding of pipes made of PVC, comprising: CPVC with a chlorine-percentage of at least 60 wt.%, wherein the CPVC is obtainable by chlorination of a u PVC having a K-value of at most 55, and a solvent comprising one or more aliphatic compounds having a hydrocarbon ring and at least two ether groups in the ring structure. Further, the present invention relates to the use of said adhesive.
8 LOW VOLATILE ORGANIC SOLVENT BASED ADHESIVE EP98926087.2 1998-05-27 EP0986619B1 2004-09-01 CONGELIO, Carmen, D.; OLAH, Andrew, M.
The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100 DEG F. when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.
9 SOLVENT CEMENT FOR BONDING THERMOPLASTIC RESIN ARTICLES US14862751 2015-09-23 US20160115358A1 2016-04-28 Wei-Young Wu; Andreas Schneider
The present invention relates to a solvent cement for bonding articles made of a thermoplastic resin, a method of bonding articles made of a thermoplastic resin to one another and the use of a solvent cement for bonding articles made of a thermoplastic resin.
10 Low volatile organic solvent based adhesive US133949 1998-08-14 US5962560A 1999-10-05 Carmen D. Congelio; Andrew M. Olah
The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100.degree. F. when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.
11 Microencapsulatable solvent adhesive composition and method for coupling conduits US9105 1998-01-20 US5922798A 1999-07-13 Mark A. Roesch; David A. Maccarone; Gary F. Hillenbrand; Morris F. Newsom
A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.
12 Low VOC (volatile organic compounds), solvent-based CPVC pipe adhesives which maintain joint adhesive performance US299791 1994-08-31 US5470894A 1995-11-28 Naresh D. Patel; Mark D. Brown
A CPVC adhesive for joining CPVC pipes comprises: (a) about 18 to 28 wt % CPVC resin; (b) a high vapor pressure solvent comprising about 15 to 35 wt % tetrahydrofuran and 0 to about 30 wt % methyl ethyl ketone; and (c) a low vapor pressure solvent comprising about 20 to 45 wt % cyclohexanone, 0 to about 30 wt % N-methyl pyrrolidone, and 0 to 10 wt % dibasic esters (a mixture of refined dimethyl esters of adipic, glutaric, and succinic acids). The VOC level of the CPVC adhesive composition of the invention is at or below the allowed maximum value of 450 g/l, yet the adhesive meets or exceeds required performance standards, such as hydrostatic burst strength and hydrostatic sustained pressure test.
13 Low VOC (volatile organic compounds), solvent-based thermoplastic pipe adhesives which maintain joint adhesive performance US837810 1992-02-18 US5252634A 1993-10-12 Naresh D. Patel; Mark W. Brown
A low volatile organic compound emitting thermoplastic pipe adhesive includes a resin, one or more solvents, a low specific gravity filler such as hollow ceramic spheres and a thixotropic agent for maintaining the homogeneity of the adhesive mixture.
14 Adhesive consisting essentially of an isocyanate terminated ricinoleate prepolymer and a chlorinated polyvinyl chloride US261589 1981-05-07 US4340682A 1982-07-20 Norris R. Legue; Myron Shapiro
A curable urethane adhesive composition having a high green strength consisting essentially of a mixture of an isocyanate terminated ricinoleate prepolymer and chlorinated polyvinyl chloride curable by reaction with compounds having reactive hydrogens such as water, amines, polyols, urethanes, ureas and the like.
15 Stabilized adhesive solutions for polyvinyl chloride US3726826D 1972-02-29 US3726826A 1973-04-10 KNIGHT E
A SOLUTION OF POST-CHLORINATED POLYVINYL CHLORIDE RESIN IN TETRAHYDROFURAN, AN ADHESIVE, IS STABILIZED AGAINST GELLING BY INCLUDING THEREIN A SMALL AMOUNT OF 1,2-BUTYLENE OXIDE, ETHYL ACETATE OR MIXTURES THEREOF.
16 Low volatile organic solvent-based adhesives JP50256099 1998-05-27 JP2002510344A 2002-04-02 オラー、アンドリュー・エム; コンジェリオ、カルメン・ディー
(57)【要約】 本発明は少なくとも二種類の有機溶媒の混合物と熱可塑性樹脂からなる低VOC溶媒系接着剤に関する。 該接着剤の引火点がASTM D3828−87に従って測定されたときに少なくとも100°Fであることが望ましい。 本発明の低VOC溶媒系接着剤の溶媒混合物は溶媒接着剤中の慣用の溶媒混合物よりも実質的に低い速度で揮発する。 さらに、この新規な低VOC溶媒系接着剤は簡単に塗布でき、経済性に優れ、そして熱、紫外線または他の機械装置を使用せずに適当な時間内で硬化する。 加えて、この新規な低VOC溶媒系接着剤は金属製容器と非金属製容器の両方で良好な貯蔵安定性を有する。
17 Adhesive based on lowly volatile organic solvent JP30838396 1996-11-19 JPH1036811A 1998-02-10 CONGELIO CARMEN D; OLAH ANDREW M
PROBLEM TO BE SOLVED: To obtain an adhesive having lower volatility than conventional adhesives and useful for joining thermoplastic materials by combining volatile organic solvents and a thermoplastic resin so as to provide a specified VOC level. SOLUTION: This adhesive has a VOC level of at most 450g/l when measured according to the South Coast Air Quality Management District 316A and consists of two volatile organic solvents comprising a first organic solvent preferably comprising N-methyl-2-pyrrolidone and a second organic solvent preferably selected from pimelic acid, monomethyl glutarate, monomethyl pimelate, monomethyl azelate, monomethyl sebacate, monoethyl adipate, dimethyl succinate, dimethyl glutarate, dimethyl adipate, etc., and a thermoplastic resin preferably selected from (chlorinated) PVC, ABS and PS.
18 JPH0122878B2 - JP7469382 1982-05-06 JPH0122878B2 1989-04-28 NORISU AARU REGYU; MAIRON SHAPIRO
A curable urethane adhesive composition having a high green strength consisting essentially of a mixture of an isocyanate terminated ricinoleate prepolymer and chlorinated polyvinyl chloride curable by reaction with compounds having reactive hydrogens such as water, amines, polyols, urethanes, ureas and the like.
19 Low volatile organic solvent based adhesive EP96118601.2 1996-11-20 EP0819748A3 2000-08-23 Congelio, Carmen D.; Olah, Andrew M.

The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. The low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices.

20 LOW VOLATILE ORGANIC SOLVENT BASED ADHESIVE EP98926087.2 1998-05-27 EP0986619A1 2000-03-22 CONGELIO, Carmen, D.; OLAH, Andrew, M.
The present invention relates to a low VOC solvent based adhesive comprising a mixture of at least two organic solvents and a thermoplastic resin. Desirably the adhesive has a flash point of at least 100 DEG F. when measured in accordance with ASTM D3828-87. The solvent blend of the low VOC solvent based adhesive of the instant invention volatilizes at substantially reduced rates as compared to conventional solvent blends in solvent based adhesives. Furthermore, this novel low VOC solvent based adhesive is easy to apply, cost effective, and cures within a reasonable time without the use of heat, ultraviolet light or other mechanical devices. In addition, the novel low VOC solvent based adhesive has good storage stability in metal or non-metal containers.
QQ群二维码
意见反馈