| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | Compositions containing hollow microspheres | US94500 | 1993-07-20 | US5384345A | 1995-01-24 | Paul E. Naton |
| A composition is described with comprises a mixture of(A) from about 5% to about 60% by weight of at least one water-insoluble polymer;(B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and(C) from about 20% to about 85% of at least one volatile organic liquid which is a solvent for the polymer of (A).The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low VOC compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter. | ||||||
| 2 | Compositions containing hollow microsperes | US85185292 | 1992-03-16 | US5317038A | 1994-05-31 | NATON PAUL E |
| A composition is described with comprises a mixture of (A) from about 5% to about 60% by weight of at least one water-insoluble polymer; (B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and (C) from about 20% to about 70% of at least one volatile organic liquid which is a solvent for the polymer of (A). The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low VOC compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter. | ||||||
| 3 | Compositions containing hollow microspheres | US196890 | 1994-02-10 | US5407983A | 1995-04-18 | Paul E. Naton |
| A composition is described with comprises a mixture of(A) from about 5% to about 60% by weight of at least one water-insoluble polymer;(B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and(C) from about 20% to about 70% of at least one volatile organic liquid which is a solvent for the polymer of (A).The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low V(olatile) O(rganic) C(hemical) compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter. | ||||||
| 4 | Vinyl paste sealant composition | US3772237D | 1972-05-17 | US3772237A | 1973-11-13 | BULLMAN A |
| THE INVENTION ENCOMPASSES A VINYL PASTE SEALANT WHICH POSSESSES EXCELLENT PHYSICAL PROPERTIES AND ADHESION TO A VARIETY OF SUBSTRATES. THE CRITICAL INGREDIENTS OF THE SEALANT ARE A VINYL DISPERSION RESIN, A VINYL BLENDING RESIN, A KETONEALDEHYDE CONDENSATION RESIN; A FILLER, A PLASTICIZER AND A NH2-ORGANO-FUNCTIONAL SILANE ADHESION PROMOTER.
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| 5 | Composition containing a halogenated vinyl polymer and a copolymer bearing associative groups | US12991218 | 2009-05-05 | US20110065866A1 | 2011-03-17 | Ludwik Leibler; Francois Genes Tournilhac; Nicolas Dufaure; Manuel Hidalgo |
| The present invention relates to a composition comprising: (a) at least one halogenated vinyl polymer and (b) at least one copolymer containing (i) units derived from a first monomer (A) rendering said copolymer compatible with said halogenated vinyl polymer and (ii) units derived from a second monomer (B) bearing at least one given associative group. The present invention also relates to the use of such a copolymer bearing associative groups, for improving certain properties of a halogenated vinyl polymer. The invention finally relates to the uses of the aforementioned composition. | ||||||
| 6 | Method of bonding and bonding compositions | US246690 | 1994-05-20 | US5416142A | 1995-05-16 | Charles N. Bush; Paul F. Naton |
| A method of adhesively bonding or welding a first plastic surface to a second plastic surface is described which comprises the steps of:(I) applying to the first surface or second surface or both surfaces, a composition which is free of hollow microspheres and comprises a mixture of(A) from about 5% to about 60% by weight of at least one water-insoluble polymer selected from ABS, PVC, CPVC or mixtures thereof;(B) from about 1% to about 60% by weight of at least one water-insoluble polymer selected from acrylic polymers, vinyl aromatic polymers and vinylpyrrolidone polymers; and(C) from about 10% up to about 90% by weight of at least one volatile organic liquid which is a solvent for polymers (A) and (B);(II) contacting the first surface with the second surface; and(III) allowing the adhesive composition to form a bond or weld between the first surface and the second surface.The invention also relates to compositions which comprise a mixture of components (A) through (C) as defined above. | ||||||
| 7 | JPS5036859B1 - | JP2858672 | 1972-03-23 | JPS5036859B1 | 1975-11-28 | |
| 8 | COMPOSITION RENFERMANT UN POLYMÈRE VINYLIQUE HALOGÉNÉ ET UN COPOLYMÈRE PORTEUR DE GROUPES ASSOCIATIFS. | EP09750040.9 | 2009-05-05 | EP2274377B1 | 2012-02-01 | LEIBLER, Ludwik; TOURNILHAC, François-Genes; DUFAURE, Nicolas; HIDALGO, Manuel |
| The present invention relates to a composition comprising: (a) at least one halogenated vinyl polymer and (b) at least one copolymer containing (i) units derived from a first monomer (A) rendering said copolymer compatible with said halogenated vinyl polymer and (ii) units derived from a second monomer (B) bearing at least one given associative group. The present invention also relates to the use of such a copolymer bearing associative groups, for improving certain properties of a halogenated vinyl polymer. The invention finally relates to the uses of the aforementioned composition. | ||||||
| 9 | COMPOSITION RENFERMANT UN POLYMÈRE VINYLIQUE HALOGÉNÉ ET UN COPOLYMÈRE PORTEUR DE GROUPES ASSOCIATIFS. | EP09750040.9 | 2009-05-05 | EP2274377A1 | 2011-01-19 | LEIBLER, Ludwik; TOURNILHAC, François-Genes; DUFAURE, Nicolas; HIDALGO, Manuel |
| The present invention relates to a composition comprising: (a) at least one halogenated vinyl polymer and (b) at least one copolymer containing (i) units derived from a first monomer (A) rendering said copolymer compatible with said halogenated vinyl polymer and (ii) units derived from a second monomer (B) bearing at least one given associative group. The present invention also relates to the use of such a copolymer bearing associative groups, for improving certain properties of a halogenated vinyl polymer. The invention finally relates to the uses of the aforementioned composition. | ||||||
| 10 | Compositions containing hollow microspheres | EP92121451.6 | 1992-12-17 | EP0547593A1 | 1993-06-23 | Naton, Paul E. |
A composition is described with comprises a mixture of
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| 11 | 회로 기판 제조용 시아네이트 에스테르계 수지 조성물 | KR1020120143418 | 2012-12-11 | KR1020130066526A | 2013-06-20 | 박영석; 박순용; 장세명 |
| PURPOSE: An adhesive resin composition is provided to have a low dielectric rate and low dielectric loss coefficient, thereby manufacturing a circuit board with improved electric performance. CONSTITUTION: An adhesive resin composition comprises 100.0 parts by weight of a cyanate ester resin; 10-90 parts by weight of fluorine-based resin powder dispersed in the cyanate ester resin; and 1-80 parts by weight of rubber component. The fluorine-based resin powder has a number average particle diameter of 10 microns or less. The cyanate ester resin is a bifunctional cyanate ester, bifunctional aromatic cyanate ester, or mixtures thereof. | ||||||
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