An adhesive material for aging prevention which can eliminate problems of conventional compositions for aging prevention and can prevent a crosslinked rubber from aging; and a method of preventing a crosslinked rubber from aging. The adhesive material for aging prevention comprises 100 parts by mass of at least one polymer ingredient selected from the group consisting of rubbers, thermoplastic elastomers, and resins and 5-50 parts by mass of an antidegradant. The method of preventing crosslinked-rubber aging comprises applying an adhesive material for aging prevention comprising at least one polymer ingredient selected from the group consisting of rubbers, thermoplastic elastomers, and resins and an antidegradant to a crosslinked rubber to allow the antidegradant to migrate to the crosslinked rubber and thereby prevent the crosslinked rubber from aging.

[Problem] To provide a conductive adhesive composition capable of preventing conductivity from decreasing by corrosion of metal particles even after it is used or stored at high temperatures and high humidities for a long period of time, without impairing the conductivity of the metal powder.

[Means for Solving the Problem] Provided is a conductive adhesive composition including a metal powder dispersed in an adhesive resin, the adhesive resin containing a volatile corrosion-inhibitor, wherein the volatile corrosion-inhibitor is preferably at least one member selected from the group consisting of dicyclohexylammonium cyclohexanecarboxylate, monoethanolamine benzoate, and cyclohexylamine benzoate.

Conductive adhesives, which do not have the problem of migration in conductive metals upon application of a voltage and which exhibit low resistance values, are provided.

One embodiment of the present invention relates to a conductive adhesive comprising a conductive filler and a resin, characterized in that the conductive filler comprises an alloy powder of silver and tin and further contains an additive comprising at least one member selected from among a chelator, an antioxidant, and a metal surfactant. Additives that can be used are chelators such as hydroxyquinolines, salicylidene aminothiophenols or phenanthrolines, antioxidants such as hydroquinones or benzotriazoles, and metal surfactants such as organic acids, acid anhydrides or organic acid salts.

An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 µm and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.

The present invention relates to a pressure-sensitive adhesive composition containing a non-halogen, non-intumescent flame-retardant system comprising at least one flame-retardant agent with the provisos that the flame-retardant system does not comprise Sb₂O₃ or does not consist only of alumina trihydrate.

A wetness indicating hot-melt adhesive which changes color in response to the presence of moisture is disclosed, which contains 20 to 70 wt. % of polymer, about 28 to 10 wt. % of which is water sensitive polymer; 25 to 60% of organic acid which is selected from a high acid fatty acid, or rosin acid, or a combination thereof; 0 to 40% of water soluble wax; 0 to 60 wt. of glycerlo monostearate; 0 to 55 wt. % of hydrogenated castor oil; 0 to 15 wt. % of polyalkylene wax; 0 to 60 wt. % of com­patible plasticizer; and a wetness indicating agent which changes the color of the composition in response to moisture therein. The time of response of the color change can be controlled from about one second to a somewhat larger value as desired.

The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. Namely, it is an electrically conductive composition, which contains at least a sulfide compound represented by R-S-R' (wherein R is an organic group containing at least carbon; R' is an organic group that is the same as or different from R; and R and R' may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film, each of which are produced using the electrically conductive composition, as well as a dicing die bonding film, which is obtained by bonding the conductive bonding film with an adhesive tape, are provided.

A tamperproof dosage form for oral administration comprising a cap and a body each comprising an outer surface and an inner surface, the cap and body being arranged to telescopically engage with each other such that an overlap region is formed between a portion of the outer surface of the body and a portion of the inner surface of the cap, said overlap region comprising an overlap length extending parallel to a centerline of said dosage form, wherein an adhesive substance is comprised throughout at least a portion of the overlap length bonding said cap to said body. The adhesive substance being essentially free of organic solvent.