子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | レゾール型変性フェノール樹脂組成物、その製造方法および接着剤 | JP2017510174 | 2016-03-31 | JPWO2016159218A1 | 2018-02-01 | 身深 元 |
| 本発明によれば、ジメチルフェノール類によって変性された下記一般式(1)で表される構造単位Aと、下記一般式(2)で表される構造単位Bと、を有するレゾール型変性フェノール樹脂を含むレゾール型変性フェノール樹脂組成物が提供される。【化1】(式(1)において、mは、1以上の整数である。mが1である場合、Rは、メチロール基である。mが2以上である場合、Rは独立して、水素原子またはメチロール基であり、かつ少なくとも1つのRがメチロール基である。)【化2】(式(2)において、nは、1以上の整数である。nが1である場合、Rは、メチロール基である。nが2以上である場合、Rは独立して、水素原子またはメチロール基であり、かつ少なくとも1つのRがメチロール基である。) | ||||||
| 142 | Mechanical and anti-corrosion protective vinyl tape | JP2013547576 | 2011-12-22 | JP2014505766A | 2014-03-06 | アランテス， ヴァネッサ コレア; ミツオ エム． ヤマシタ， |
| 約３０．７〜約３４．０％（重量／重量）の固形ブタジエンアクリロニトリルゴム（ＮＢＲ）、約０．５７〜約０．６３％（重量／重量）の酸化防止剤、約９．７〜約１２．９％（重量／重量）の炭化水素樹脂、約１．５２〜約１．６８％（重量／重量）の酸化亜鉛、約８．７〜約９．５％（重量／重量）の液状ブタジエンアクリロニトリルゴム（ＮＢＲ）、約４．０〜約４．４％（重量／重量）のアルミニウムヒドロシリケート、約５．５〜約７．５％（重量／重量）のフタル酸ジイソノニル、約０．６６〜約０．７４％（重量／重量）のカーボンブラック、約１．５〜約１．７％（重量／重量）の非晶質シリカ、及び約２５．８〜約３８．８％（重量／重量）のマグネシウム・カルシウム炭酸塩の組成のニトリルゴム系接着剤で積層されたビニル製の基部を有するテープを含む、主に修理及び保守の場合に使用される防食鋼管保護用感圧テープ。 テープは、凹凸面に適合する良好な能力、良好な弾性、良好な耐衝撃性、優れた管接着性、及び良好な陰極剥離を示す。 テープは、理想的には、管とテープの接着部分との間の接着性を改善するプライマーと共に使用される。
【選択図】なし |
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| 143 | Rubber-metal laminate | JP2009255845 | 2009-11-09 | JP4877380B2 | 2012-02-15 | 敏弘 東良 |
| Disclosed is a rubber metal laminate comprising NBR and metal that are bonded to each other through an adhesive comprising novolak-type and resol-type phenol resins, NBR, white carbon, and a vinyltrialkoxysilane coupling agent having an alkoxyl group containing two or more carbon atoms. As the adhesive, a mixed solution of a phenol resin-based adhesive solution and a rubber paste that is an organic solvent solution of an NBR compound comprising NBR, white carbon, and a silane coupling agent is specifically used. The rubber metal laminate has excellent friction and wear resistance characteristics at high temperatures and less decrease in adhesive strength after immersion in water or an antifreeze solution, and is capable of effectively preventing peeling, etc., caused thereby. | ||||||
| 144 | 接着剤組成物及び接合方法 | JP2009534262 | 2008-09-05 | JPWO2009041248A1 | 2011-01-20 | 佑基 比舎; 公彦 依田 |
| 高い接着性と秒単位の高速硬化性を有し、高温高湿試験をはじめとする耐久性試験にて、高い保持率を呈する接着剤組成物を提供する。(A)アクリロニトリル含量10〜30%のニトリルブタジエンラバー、(B)重合可能な(メタ)アクリル系液状組成物、(C)有機過酸化物、及び(D)アミン構造を有する塩基性化合物を含有する第一剤と、(E)アミンとアルデヒドの反応縮合物、及び(F)銅を含む還元剤を含有する第二剤とからなることを特徴とする二剤型の接着剤組成物であり、好ましくは、第一液に光重合開始剤を含有することを特徴とする接着剤組成物、それを用いた接合方法。 | ||||||
| 145 | Multilayer adhesive film for die stacking | JP2008545559 | 2005-12-15 | JP2009520051A | 2009-05-21 | ジン，ファイル |
| An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000. | ||||||
| 146 | For bonding the electronic components and the strip-shaped conductors together, adhesive strip based on heat can activate and carboxylated nitrile rubber | JP2007541931 | 2005-11-11 | JP2008522391A | 2008-06-26 | クラビンケル，トルステン; リング，クリステイアン |
| 接着剤が少なくともａ）酸または酸無水物で改変されたアクリロニトリル−ブタジエンコポリマ−、及びｂ）エポキシ樹脂、
からなる、但し２成分ａ／ｂの重量比が１．５より大きく且つ更なる非ポリマ−硬化剤を使用しない、フレキシブル導体トラックを製造且つ更に加工するための熱で活性化できる接着テープ。 |
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| 147 | Electronic components for the adhesive tape | JP9591795 | 1995-03-30 | JP2896751B2 | 1999-05-31 | SAKUMOTO YUKINORI; HASHIMOTO TAKESHI; NISHIGAYA TAKESHI; YAMANASHI FUMYOSHI |
| Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of: (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight and an amino equivalent of 500-10,000, represented by the formula (I): <IMAGE> (I) wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in a range of 10 to 900 parts by weight, and said adhesive layer being composed of at least two semi-cured layers having each a different status of semi-cure. | ||||||
| 148 | Nitrile emulsion polymer adhesion has been improved | JP31446589 | 1989-12-05 | JP2873243B2 | 1999-03-24 | OOGASUTO HENRII JOOJENSEN JUNIA |
| 149 | Adhesive tape for electronic part and liquid adhesive | JP28620493 | 1993-10-22 | JPH07126591A | 1995-05-16 | SAKUMOTO YUKINORI; HASHIMOTO TAKESHI; NAKABA KATSUJI; KOBAYASHI MASAHARU; NISHIGAYA TAKESHI; YAMANASHI FUMIYOSHI |
| PURPOSE:To obtain an adhesive tape for an electronic part with which adhesion and curing can be performed at a relatively low temp. and which has enough heat resistance and reliability by using an adhesive contg. a piperazinylethylaminocarbonyl group-contg. butadiene-acrylonitrile copolymer and a specified maleimide compd. CONSTITUTION:The adhesive used for the adhesive tape is constituted of a piperazinylethylaminocarbonyl group-contg. butadiene-acrylonitrile copolymer (a) with a wt. -average MW of 10,000-200,000, an acrylonitrile content of 5-50wt.%, and an amino equivalent of 500-10,000 and expressed by formula I (wherein k, m and n are each a molar ratio and k=3-175, m=0.3-93 and n=1) and a compd. (b) contg. at least two maleimide groups selected from compd. of formulas II, III and IV. 10-900 pts.wt. component (b) is compounded with 100 pts.wt. component (a). This adhesive layer is laminated on at least one face of a heat-resistance film. | ||||||
| 150 | Printed wiring board substrate for adhesive | JP1962485 | 1985-02-04 | JPH0710967B2 | 1995-02-08 | 直洋 両角; 紀代史 中尾; 伸 高根沢; 高橋 宏 |
| An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process. | ||||||
| 151 | Nitrile emulsion polymer improved in adhesiveness | JP31446589 | 1989-12-05 | JPH02269137A | 1990-11-02 | OOGASUTO HENRII JIYOOJIENSEN J |
| PURPOSE: To obtain a nitrile emulsion polymer improved in adhesiveness and being useful as an adhesive or a coating agent for electrical circuit boards by using a nitrile rubber composition containing an anionic emulsification aid reacted with a cationic polymer coagulant. CONSTITUTION: This invention provides a dried nitrile rubber emulsion latex composition obtained by preparing by using 0.75-1.5 wt. equivalents, desirably 0.85-1.25 wt. equivalents, more desirably 0.951.05 wt.pt. cationic polymer coagulant (B) selected among a quaternized poly(alkylenepolyamine), a quanternized poly(hydroxyalkylenepolyamine), a quaternized poly(carbonylalkylenepolyamine) and a quaternized polymer obtained from a 1-5C dialkylamine and epichlorohydrin per wt. equivalent anionic emulsification aid (A) and comprising a nitrile rubber latex in which component A reacted with component B is incorporated. COPYRIGHT: (C)1990,JPO | ||||||
| 152 | Adhesive for use in printed-circuit board | JP1962485 | 1985-02-04 | JPS61179282A | 1986-08-11 | TAKAHASHI HIROSHI; MOROZUMI NAOHIRO; TAKANEZAWA SHIN; NAKAO KIYOSHI |
| PURPOSE:To provide the titled adhesive having an excellent soldering heat resistance and suitable for use in a printed-circuit board, which comprises as essential ingredients a specific modified resin and an acrylonitrile-butadiene rubber. CONSTITUTION:A modified resin (A) is prepared by condensation of (a) a resin obtained by an addition reaction of p-substituted alkylphenol with 0.2-0.8mol, based on 1mol of the p-substituted alkylphenol, of at least one alkylphenol selected from p-phenylphenol and p-cumylphenol, etc., and 1.3mol or more, based on 1mol of the alkylphenol, of an aldehyde in the presence of a basic catalyst, with (b) 0.2-15wt% of a phenol or an amine having a reactivity to the aldehyde higher than that of the alkylphenol. 70-7 parts (by weight on a dry basis; the same applies hereinafter) of component (A) is mixed with (B) 30-93 parts of acrylonitrile-butadiene rubber and, if necessary, (C) 0.001-2.5wt%, based on the solid content of the adhesive, of a catalyst for plating comprising a compound of a noble metal, e.g., Pt or Pd, (D) an inorganic filler, etc. | ||||||
| 153 | Anaerobic low temperature hardenable rubber composition | JP13864380 | 1980-10-03 | JPS5665065A | 1981-06-02 | JIEEMUSU PII MORAN JIYUNIA; BAABARA BII ROGUBIN; FUREDERITSUKU EFU NIYUUBAASU |
| 154 | SELBSTTRAGENDER KLEBEKÖRPER FÜR STRUKTURELLE VERKLEBUNGEN | EP16819862.0 | 2016-12-16 | EP3390562A1 | 2018-10-24 | XU-RABL, Rui; GÖSSI, Matthias; FINTER, Jürgen |
| The invention relates to a composition comprising at least one structural adhesive and at least one chemically crosslinked elastomer based on a silane-functional, non-polar polymer, said elastomer being provided in the form of a penetrating polymer network in the structural adhesive. Self-supporting adhesive bodies, particularly in the form of adhesive tapes, can be produced from such compositions and can be used for structural bonds and to reinforce metal structures. | ||||||
| 155 | A STRUCTURAL ADHESIVE SHEET SPECIFICALLY FOR USE IN A MIRROR BASE OF AN AUTOMOBILE INTERIOR REAR-VIEW MIRROR AND A METHOD FOR PRODUCING THE SAME | EP12846942.6 | 2012-11-09 | EP2776526A1 | 2014-09-17 | ZHANG, Deheng; KONG, Junshi; LI, Wenli; WU, Huan; YANG, Yajuan |
| The present invention provides a structural adhesive sheet specifically for use in a mirror base of an automobile interior rear-view mirror and a method for producing the same, said structural adhesive sheet comprises in parts by weight of 20-100 parts of a nitrile-butadiene rubber, 10-70 parts of a partially cured polysulfide adhesive, 5-40 parts of a bisphenol A type epoxy resin, 0.1-2.5 parts of a crosslinking agent, 0.2-2.5 parts of a softening agent, 3-20 parts of a curing agent, 1-10 parts of an accelerator, 20-100 parts of an inorganic filler, and 0.1-3.0 parts of a silane coupling agent. The structural adhesive sheet of the present invention is obtained by subjecting the above-mentioned components to a compounding process and an extrusion film forming process. The advantages of said structural adhesive sheet include good film-forming property, and simple curing process, while having high structural strength, good toughness, and excellent heat-resistance and cold-resistance after cured. | ||||||
| 156 | HITZE-AKTIVIERT VERKLEBBARES FLÄCHENELEMENT | EP07822289.0 | 2007-11-07 | EP2087056B1 | 2011-05-25 | HUSEMANN, Marc; HANNEMANN, Frank; KOOP, Matthias |
| 157 | HITZE-AKTIVIERT VERKLEBBARES FLÄCHENELEMENT | EP07822289.0 | 2007-11-07 | EP2087056A1 | 2009-08-12 | HUSEMANN, Marc; HANNEMANN, Frank; KOOP, Matthias |
| A heat-activated adhesive-bondable sheet-like element is described with a first adhesive mass and a second adhesive mass, the element being suitable for the adhesive bonding of objects with metal surface to objects with plastics surface, and, even at low temperatures, can give a stable and mechanically strong adhesive bond. This is achieved via use of particular, mutually matched combinations of different adhesive masses based on synthetic nitrile rubbers and reactive resins. | ||||||
| 158 | MULTI-LAYER ADHESIVE FILM FOR DIE STACKING | EP05855018 | 2005-12-15 | EP1960189A4 | 2009-01-28 | JIN HWAIL |
| An adhesive film for die stacking at least two neighboring semiconductor dies containing metal wire bonds, comprises (a) Layer-1 adhesive, which comes in contact with the first semiconductor die and is capable of flowing around the metal wire bonds of that first semiconductor die at die attach temperatures, and (b) Layer-2 adhesive, which comes in contact with the second semiconductor die, in which Layer-2 adhesive comprises 30-85 weight % thermoplastic rubber with a glass transition temperature of less than 25° C. and a weight average molecular weight of greater than 100,000. | ||||||
| 159 | HITZEAKTIVIERBARES KLEBEBAND AUF DER BASIS VON NITRILKAUTSCHUK UND POLYVINYLBUTYRAL FÜR DIE VERKLEBUNG VON ELEKTRONISCHEN BAUTEILEN UND LEITERBAHNEN | EP05808150.6 | 2005-11-11 | EP1819794A1 | 2007-08-22 | RING, Christian; KRAWINKEL, Thorsten |
| The invention relates to an adhesive strip that can be activated by heat and is used for the production and subsequent processing of flexible strip conductors. Said adhesive strip has an adhesive mass consisting of at least a) an acrylic nitrile butadiene copolymer having a weight percentage of between 40 and 80, b) a polyvinyl acetal having a weight percentage of between 2 and 30, c) an epoxide resin having a weight percentage of between 10 and 50, and d) a hardener. The epoxide groups are chemically cross-linked with the hardener at high temperatures. | ||||||
| 160 | HITZEAKTIVIERBARES KLEBEBAND AUF BASIS CARBOXYLIERTER NITRILKAUTSCHUKE FÜR DIE VERKLEBUNG VON ELEKTRONISCHEN BAUTEILEN UND LEITERBAHNEN | EP05808149.8 | 2005-11-11 | EP1819793A1 | 2007-08-22 | KRAWINKEL, Thorsten; RING, Christian |
| The invention relates to an adhesive strip that can be activated by heat and is used for the production and subsequent processing of flexible strip conductors. Said adhesive strip has an adhesive mass consisting of at least a) an acrylic nitrile butadiene copolymer modified by acid or acid anhydride, and b) an epoxide resin. The weight ratio of the two constituents a/b is larger than 1.5 and no additional non-polymer hardeners are used. | ||||||
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