子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 81 | Nitrile rubber blends for fixing metal parts to plastics | US11321325 | 2005-12-29 | US07569640B2 | 2009-08-04 | Marc Husemann; Frank Hannemann; Matthias Koop |
| An adhesive sheet comprising at least one heat-activatable adhesive based on a blend of at least one nitrile rubber S1 and at least one nitrile rubber S2, said at least one nitrile rubber S1 having an acrylonitrile fraction of not more than 25% by weight and said at least one nitrile rubber S2 having an acrylonitrile fraction of not less than 30% by weight, and at least one reactive resin. | ||||||
| 82 | Adhesive tapes | US739930 | 1996-10-30 | US5683806A | 1997-11-04 | Yukinori Sakumoto; Shigeyuki Yokoyama; Akihiro Shibuya; Atsushi Koshimura |
| An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising (i) a resol type phenol resin, and (ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol. | ||||||
| 83 | Adhesive tape for electronic parts and liquid adhesive | US623090 | 1996-03-28 | US5609956A | 1997-03-11 | Yukinori Sakumoto; Takeshi Hashimoto; Takeshi Nishigaya; Fumiyoshi Yamanashi |
| Adhesive tapes which can be adhered and cured at a relatively low temperature, keeps enough electric insulation in case of adhering to the leadframe of semiconductor devices. The adhesive tape comprises a releasing film and an adhesive layer provided on a surface of said releasing film, said adhesive layer being semi-cured into a B-stage and composed of:(a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight and an amino equivalent of 500-10,000, represented by the formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and(b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in a range of 10 to 900 parts by weight, and said adhesive layer being composed of at least two semi-cured layers having each a different status of semi-cure. | ||||||
| 84 | Adhesive tape for electronic parts and liquid adhesive | US462365 | 1995-06-05 | US5510189A | 1996-04-23 | Yukinori Sakumoto; Takeshi Hashimoto; Katsuji Nakaba; Masaharu Kobayashi; Takeshi Nishigaya; Fumiyoshi Yamanashi |
| This invention is to provide a liquid adhesive of the present invention can be adhered and cured at a relatively low temperature and have sufficient heat resistance and reliability, etc., and an adhesive tape using the same.The liquid adhesive of this invention is obtainable by dissolving (a) a piperazinylethylaminocarbonyl-containing butadiene-acrylonitrile copolymer having a weight average molecular weight of 10,000-200,000, an acrylonitrile content of 5-50% by weight, and an amino equivalent of 500-10,000, represented by the following formula (I): ##STR1## wherein, k, m, and n are molar ratios and taking n as 1, k is a number of 3-175, and m is a number of 0.3 to 93; and (b) a compound having at least two maleimide groups, the ratio of component (b) based on 100 parts by weight of component (a) being in the range of 10 to 900 parts by weight. This is applied to one or both surfaces of a heat resistant film or one surface of a release film to form an adhesive layer, thereby obtaining an adhesive tape for electronic parts. | ||||||
| 85 | Adhesive tapes | US814236 | 1991-12-23 | US5277972A | 1994-01-11 | Yukinori Sakumoto; Shigeyuki Yokoyama; Akihiro Shibuya; Atsushi Koshimura |
| An adhesive tape for electronic parts, comprising (a) a heat resistant base film, and (b) an adhesive layer laminated on at least one surface of said base film, said adhesive layer comprising(i) a resol type phenol resin, and(ii) an acrylonitrile/butadiene copolymer, in a proportion of from 100 to 500 parts by weight of said resol type phenol resin per 100 parts by weight of said acrylonitrile/butadiene copolymer, said resol type phenol resin being selected from the group consisting of bisphenol A type resins, alkylphenol type resins, phenol type resins and their co-condensed type phenol resins which contain as the phenol component at least one member selected from the group consisting of bisphenol A, alkylphenols and phenol. | ||||||
| 86 | Hydrocarbon resistant sealant composition | US561356 | 1990-08-01 | US5134182A | 1992-07-28 | Kwang-Ho Chu |
| A composition based upon a blend of lower alkyl or lower alkoxyalkyl polyacrylate ester elastomers with one or more materials selected from liquid butadiene acrylonitrile copolymers and halogenated fire-retardant plasticizers. Blends with the liquid butadiene acrylonitrile copolymers include from about 5 to about 50% by weight of the copolymer and from about 50 to about 95% by weight of the polyacrylate ester elastomer. Blends with the halogenated fire-retardant plasticizer include from about 5 to about 100 parts by weight of the halogenated fire-retardant plasticizer per 100 parts of the polyacrylate ester elastomer. Hydrocarbon-resistant sealant compositions further contain effective amounts of one or more plasticizers in amounts effective to plasticize the blend together with one or more reinforcing materials. Flame-resistant sealant compositions utilize phosphate ester plasticizers and further contain one or more flame-retardant materials including alumina trihydrate, magnesium carbonate and magnesium hydroxide hydrate. | ||||||
| 87 | Adhesive clad insulating substrate used for producing printed circuit boards | US824726 | 1986-01-31 | US4837086A | 1989-06-06 | Hiroshi Takahashi; Naohiro Morozumi; Shin Takanezawa; Kiyoshi Nakao |
| An insulating substrate having a layer of an adhesive composition comprising (A) a modified phenolic resin and (B) acrylonitrile-butadiene rubber on at least one surface of a substrate is suitable for producing printed circuit boards having excellent solder heat resistance by an additive process. | ||||||
| 88 | Self-adhesive tape | US41180 | 1979-05-21 | US4272573A | 1981-06-09 | Richard Ewald; Klaus Freiberg |
| A self-adhesive tape particularly suitable for use in the building industry for joining and sealing PVC sheets, comprising 100 parts by weight of a vinyl chloride/vinylisobutylether copolymer, from 100 to 400 parts by weight of a mixture of nitrile rubber and a polyvinylchloride homopolymer, from 60 to 230 parts by weight of a plasticizer consisting of one or more esters of phthalic acid, and from 4 to 70 parts by weight of a resinous plasticizer which is an aromatic polyether, an epoxy resin or a mixture thereof, and which imparts adhesive properties to the composition. | ||||||
| 89 | Adhesive composition | US772882 | 1977-02-28 | US4160757A | 1979-07-10 | Toshio Honda; Yukio Fukuura; Shoji Tanaka; Itsuo Tanuma; Yoshikatsu Suzuki; Hikaru Ishikawa |
| An adhesive composition which shows improved stickiness and adhesive property at room temperature and exhibits an excellent adhering ability in a short time is prepared by compounding(a) an acrylonitrile-containing copolymer having carbon-to-carbon double bond(b) a phenol-polysulfide resin(c) a metal oxide, and(d) a polyfunctional electrophilic reactive compound containing at least two electrophilic reactive groups. | ||||||
| 90 | Solid adherend substrates bonded with rubber cement compositions | US750942 | 1976-12-15 | US4112160A | 1978-09-05 | Yuji Kako; Toyoji Kikuga; Akira Toko |
| Rubber cement compositions which consist of rubbers and multi- (three and more) functional phenol-aldehyde modified bifunctional phenol resins, which are made by first obtaining the bifunctional phenolic resin by condensing 1 mole of bifunctional phenol with 0.5 to 3.0 moles of aldehydes in the presence of an alkaline catalyst, and then co-condensing 0.05 to 2.5 moles of multifunctional (three and more) phenols against 1 mol of the bifunctional phenols in the above-mentioned resin in the presence of an acidic catalyst, said co-condensed resin having a number average molecular weight of 700 - 1900, a resin melting point of 80.degree. - 160.degree. C, being curable and also being soluble in aromatic hydrocarbon solvents. | ||||||
| 91 | Flexible adhesive composition and method for utilizing same and article formed therefrom | US444263 | 1974-02-21 | US3932689A | 1976-01-13 | Tsutomu Watanabe; Sigenori Yamaoka; Kochi Tanaka |
| This invention provides an adhesive composition for use in flexible printed circuits, comprising a phenol-formaldehyde resin, a polyepoxy compound, an acrylonitrile-butadiene copolymer and/or a polyvinylacetal resin, and a styrenic copolymer containing as structural units maleic anhydride and/or an alkyl maleate. Being excellent in adhesive strength, flow property, rapid curability, and heat resistance after curing, the present composition is especially suitable for the continuous bonding of insulating plastic films, particularly a polyimide film, to conductor foils by use of a roll-laminator and gives heat-resistant metal-clad laminates excellent for flexible printed circuits which can be soldered at high temperatures. This invention further provides an adhesive composition having added thereto a compound consisting of an anhydride or a half-ester of cyclohexenepolycarboxylic acid in order to increase the flow property and adhesive strength of the adhesive composition at the time of bonding by means of a roll-laminator. All of the aforesaid adhesive composition not only permit the economical and technically advantageous production of laminates for heat resistant flexible printed circuits, but also can serve as an adhesive for either an overlay film for use in highly heat-resistant flexible printed circuits or an interlayer adhesive film. | ||||||
| 92 | Butadiene-acrylonitrile alternating copolymer solution-type adhesive | US40517673 | 1973-10-10 | US3917554A | 1975-11-04 | INOUE SAKAE; YONEYAMA KEN; KIKUCHI MOTOKAZU; KATAOKA NOBUYUKI |
| A butadiene-acrylonitrile alternating copolymer solution-type adhesive having 5-50 parts by weight of an adhesive composition composed of 100 parts by weight of a butadiene-acrylonitrile alternating copolymer having a degree of alternation of not lower than 92 and an intrinsic viscosity of not lower than 1.0 and containing no gel, which is prepared from butadiene and acrylonitrile in the presence of a catalyst consisting of a component (A) of a compound of metals of the groups IV-b and V-b in the Periodic Table and a component (B) of an organoaluminum compound, and 30-100 parts by weight of a phenol resin dissolved in 100 parts by weight of a solvent. This solution-type adhesive has excellent adhesion and storage stability and is used for adhering rubbers, plastics, fibers, woods and metals.
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| 93 | Adhesive composition and plastic film covered fiberboard products produced therewith | US24428462 | 1962-12-13 | US3217830A | 1965-11-16 | HOELZER ROBERT J |
| An adhesive composition comprises in thixotropic aqueous emulsion 100 parts of a natural thermoplastic resin derived from hardwood and having a softening point as determined by A.S.T.M. ring and ball of at least 100 DEG C., 200 to 300 parts of a rubbery synthetic butadieneacrylonitrile copolymer derived from 28 to 38% acrylonitrile and 62-72% of butadiene and prepared in the absence of a grease-like substance, 15 to 30 parts of a normally solid dicyclosubstituted phthalate and up to 20 parts of a greaseless synthetic detergent as emulsifier. The greaseless detergent may be an anionic or a non-ionic detergent while there may also be present up to 15 parts of a proteinaceous material, e.g. ammonium caseinate and the pH of the emulsion may be less than 8.7, preferably 8.3 to 8.5. | ||||||
| 94 | Adhesive for attaching copper foils to other objects comprising a butadieneacrylonitrile copolymer, a phenolaldehyde resin and a monocarboxylic acid | US73721058 | 1958-05-23 | US3044977A | 1962-07-17 | THOMAS COE |
| A thermosetting adhesive for attaching copper foil to another object contains a copolymer of butadiene and acrylonitrile, a phenol-aldehyde type resin and an aliphatic monocarboxylic, or hydroxyl or chlorine substituted monocarboxylic, acid, containing 1-4 carbon atoms, e.g. formic, acetic, lactic, monochloracetic, propionic or butyric acid. The resin may be a condensate of phenol, cresol, xylenol or resorcinol with formaldehyde, acetaldehyde or butyraldehyde; hexamethylene tetramine may be added as a thermosetting agent. The ratio of copolymer to resin may be 20-200%. the acid may form 5-60% of the mixture. According to an example a formulation of 80 parts of ABR having 25 parts of acrylonitrile to 75 parts of butadiene, 100 parts of a cresol-formaldehyde and 15 parts of formic acid dissolved in 800 parts of methyl ethyl ketone is smeared on copper foil untreated for removal of oxide or fat, the ketone is volatilized by heating at 130 DEG C. for 30 min., the sotreated foil is placed on a stack of layers of paper impregnated with a hardenable phenolaldehyde resin, and the assembly is heated for 30 min. at 160 DEG C. in a press. | ||||||
| 95 | Adhesive composition and method of making | US13369249 | 1949-12-17 | US2575265A | 1951-11-13 | FIEDLER LEON F; LEAKEY PAUL J |
| 96 | Adhesive compositions | US49329843 | 1943-07-02 | US2379552A | 1945-07-03 | JAN TEPPEMA; MANNING JOSEPH F |
| 97 | Adhesives | US49329943 | 1943-07-02 | US2367629A | 1945-01-16 | JAN TEPPEMA; MANNING JOSEPH F |
| 98 | 半導体装置製造用接着シート及びそれを用いた半導体装置の製造方法 | JP2017017490 | 2017-02-02 | JP2018123254A | 2018-08-09 | 近藤 恭史; 市川 貴勝; 岩崎 昌司; 付 文峰; 松永 佑規 |
| 【課題】熱を受けても十分かつ安定に貼着し、容易に剥離できる接着シートの提供。 【解決手段】カルボキシル基含有アクリロニトリル−ブタジエン共重合体(a)と、式(1)で表される構造を有するエポキシ樹脂(b)と、マレイミド基を2個以上含有する化合物(c)と、反応性シロキサン化合物(d)と、を含有する接着剤層。 【選択図】なし |
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| 99 | 導電性接着剤組成物、導電性接着シート及びそれを用いた配線デバイス | JP2016076060 | 2016-09-05 | JPWO2017043455A1 | 2018-06-28 | 梅原 整裕; 伊藤 大史 |
| 【課題】 例えば、フレキシブル配線デバイスを作製する場合、導電性補強板とフレキシブル配線板とを導電性接着剤組成物層を介して、本硬化接着する際に、本硬化接着時間を短縮すると、その後のリフロー半田付け工程において、積層体に剥がれ等の接着性関する問題を生じる場合があった。 【解決手段】 カルボキシル基を有するNBRと、エポキシ樹脂と、硬化剤と、導電性材料とを、構成要素として、該カルボキシル基を有するNBRの重量平均分子量を5000〜1000000、ニトリル単量体単位含有量を5〜45質量%とすることで、本硬化時間を短縮したとしても積層体に剥がれ等の問題を生じない導電性接着剤組成物を提供することが出来る。 【選択図】なし |
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| 100 | 難燃性接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板 | JP2015537866 | 2014-09-08 | JPWO2015041085A1 | 2017-03-02 | 優 高嶋; 祐弥 沖村; 成志 山田 |
| 本発明の難燃性接着剤組成物は、カルボキシル基含有スチレン系エラストマーと、エポキシ樹脂と、下記一般式(1)で表される構造単位を含むリン含有オリゴマーとを含有し、カルボキシル基含有スチレン系エラストマーを100質量部とした場合に、エポキシ樹脂の含有量は1〜20質量部であり、リン含有オリゴマーの含有量は10〜50質量部である。【化1】(式中、R1及びR2は、それぞれ、独立して、水素原子又はメチル基であり、nは1〜20の整数である。) | ||||||
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