| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 热固性树脂组合物及用其形成的预浸料及层叠板 | CN201110444876.1 | 2007-09-10 | CN102558505A | 2012-07-11 | 土川信次; 小竹智彦; 秋山雅则 |
| 本发明提供热固性树脂组合物及用其形成的预浸料及层叠板，所述热固性组合物含有(A)通过特定方法制造的具有酸性取代基和不饱和马来酰亚胺基的固化剂、(B)双氰胺、(C)含有特定单体单元的共聚树脂及(D)环氧树脂。本发明的热固性树脂组合物在对金属箔的胶粘性、耐热性、耐湿性、阻燃性、附着到金属时的耐热性、介电常数及介质损耗角正切的所有方面保持了均衡，毒性低且安全性及作业环境优异，因此可以使用该热固性树脂组合物得到具有优异性能的预浸料及层叠板。 | ||||||
| 2 | 环氧树脂组合物、半固化片、覆金属层压板、多层印刷布线板 | CN200880122476.5 | 2008-07-29 | CN101910237A | 2010-12-08 | 藤泽洋之; 田宫裕记 |
| 本发明提供钻孔加工性、成型性、层间粘着性优异，且能够良好地进行除胶渣处理的环氧树脂组合物。本发明涉及含有环氧树脂、固化剂、无机填料的环氧树脂组合物。作为环氧树脂，使用具有二环戊二烯骨架的环氧树脂和具有酚醛清漆骨架的环氧树脂。作为固化剂，使用具有联苯骨架的酚醛树脂固化剂。作为无机填料，使用通过环氧硅烷进行过表面处理的球状二氧化硅和氢氧化铝。相对于环氧树脂组合物的总量，上述球状二氧化硅的含量是20～50质量％。相对于上述球状二氧化硅的总量，氢氧化铝的含量是2～15质量％。 | ||||||
| 3 | 一种无卤树脂组合物及用其制作的预浸料与层压板 | CN201410631941.5 | 2014-11-11 | CN104448702B | 2017-05-24 | 李辉; 方克洪 |
| 本发明涉及一种无卤树脂组合物及用其制作的预浸料与层压板，所述的无卤树脂组合物按重量份包括如下组分：环氧树脂50‑100份；苯并噁嗪20‑70份；聚苯醚5‑40份；苯丙烯‑马来酸酐5‑40份；无卤阻燃剂10‑60份；固化促进剂0.2‑5份；填料20‑100份。用所述无卤树脂组合物制作的预浸料与层压板，具有低介电常数、低介质损耗、优异的阻燃性、耐热性、粘结性及耐湿性等综合性能，适合在无卤高多层电路板中使用。 | ||||||
| 4 | DOPO衍生物与环氧树脂组合物于高频基板上应用 | CN201410629878.1 | 2014-11-10 | CN105566851A | 2016-05-11 | 谢东颖; 沈琦; 吕荣哲 |
| 一种复合材料、用其制作的高频电路基板及其制作方法。该复合材料包括固体组分如下：DOPO(9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物)衍生化合物10-70重量份，固化剂10-50重量份，一种或多种环氧树脂10-90重量份以及无机填充材10-40重量份。本发明的无卤低介电树脂组合物，采用了高纯度的DOPO(9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物)衍生物以细微小颗粒分散于组成物中，不仅不会降低组合物的交联程度，反而增加耐热性与耐燃性。用该树脂组合物所制成的印刷电路板用预浸料和覆铜箔层压板，具有优良的介电性能，高玻璃化转变温度，可以满足印刷电路覆铜板行业电子信号传输的高频化和信息处理的高速化需求。 | ||||||
| 5 | 覆铜板用高CTI无卤环氧树脂组合物及其应用 | CN201410515073.4 | 2014-09-29 | CN104292753A | 2015-01-21 | 吴永光; 林仁宗; 宋黄明 |
| 本发明公开了一种覆铜板用高CTI无卤环氧树脂组合物及其应用，按重量份数计算，其配方由以下组分组成：无卤含磷环氧树脂100～140份、双环戊二烯类酚醛环氧树脂10～35份、苯并恶嗪32～60份、酚醛树脂1～5份、促进剂0.05～0.5份、填料25～70份。依本发明所制得的铜箔基板，可达到高CTI(CTI≧500V)、高耐热(Tg≧150℃，PCT,2h>6min)、阻燃达UL-94V0级的要求，广泛应用于电机电器、白色家电等的电子材料。 | ||||||
| 6 | DOPO衍生物与环氧树脂组合物于高频基板上应用 | CN201611103953.6 | 2014-11-10 | CN106751499A | 2017-05-31 | 谢东颖; 沈琦; 吕荣哲 |
| 一种复合材料、用其制作的高频电路基板及其制作方法。该复合材料包括固体组分如下：DOPO(9,10‑二氢‑9‑氧杂‑10‑磷杂菲‑10‑氧化物)衍生化合物10‑70重量份，固化剂10‑50重量份，一种或多种环氧树脂10‑90重量份以及无机填充材10‑40重量份。本发明的无卤低介电树脂组合物，采用了高纯度的DOPO(9,10‑二氢‑9‑氧杂‑10‑磷杂菲‑10‑氧化物)衍生物以细微小颗粒分散于组成物中，不仅不会降低组合物的交联程度，反而增加耐热性与耐燃性。用该树脂组合物所制成的印刷电路板用预浸料和覆铜箔层压板，具有优良的介电性能，高玻璃化转变温度，可以满足印刷电路覆铜板行业电子信号传输的高频化和信息处理的高速化需求。 | ||||||
| 7 | 覆铜板用高CTI无卤环氧树脂组合物及其应用 | CN201410515073.4 | 2014-09-29 | CN104292753B | 2017-05-03 | 吴永光; 林仁宗; 宋黄明 |
| 本发明公开了一种覆铜板用高CTI无卤环氧树脂组合物及其应用，按重量份数计算，其配方由以下组分组成：无卤含磷环氧树脂100～140份、双环戊二烯类酚醛环氧树脂10～35份、苯并恶嗪32～60份、酚醛树脂1～5份、促进剂0.05～0.5份、填料25～70份。依本发明所制得的铜箔基板，可达到高CTI(CTI≧500V)、高耐热(Tg≧150℃，PCT,2h>6min)、阻燃达UL‑94V0级的要求，广泛应用于电机电器、白色家电等的电子材料。 | ||||||
| 8 | 一种无卤树脂组合物及用其制作的预浸料与层压板 | CN201410631941.5 | 2014-11-11 | CN104448702A | 2015-03-25 | 李辉; 方克洪 |
| 本发明涉及一种无卤树脂组合物及用其制作的预浸料与层压板，所述的无卤树脂组合物按重量份包括如下组分：环氧树脂50-100份；苯并噁嗪20-70份；聚苯醚5-40份；苯丙烯-马来酸酐5-40份；无卤阻燃剂10-60份；固化促进剂0.2-5份；填料20-100份。用所述无卤树脂组合物制作的预浸料与层压板，具有低介电常数、低介质损耗、优异的阻燃性、耐热性、粘结性及耐湿性等综合性能，适合在无卤高多层电路板中使用。 | ||||||
| 9 | Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board | US15130943 | 2016-04-16 | US09681541B2 | 2017-06-13 | Toshiyuki Higashida; Hidetsugu Motobe; Daisuke Nii |
| Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive. | ||||||
| 10 | THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME | US15428734 | 2017-02-09 | US20170156207A1 | 2017-06-01 | Shinji Tsuchikawa; Tomohiko Kotake; Masanori Akiyama |
| The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition. | ||||||
| 11 | Thermosetting resin composition and prepreg and laminate obtained with the same | US12443260 | 2007-09-10 | US09603244B2 | 2017-03-21 | Shinji Tsuchikawa; Tomohiko Kotake; Masanori Akiyama |
| The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition. | ||||||
| 12 | CURABLE EPOXY COMPOSITION, FILM, LAMINATED FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COMPOSITE | US14777910 | 2014-03-19 | US20160297921A1 | 2016-10-13 | Natsuko Shindo; Makoto Fujimura |
| A curable epoxy composition comprising a polyvalent epoxy compound (A) which has a condensed polycyclic structure and/or biphenyl structure, an aromatic and/or alicyclic polyvalent glycidyl ester compound (B), and an active ester compound (C) is provided. According to the present invention, a curable epoxy composition which can form an electrical insulating layer which is excellent in desmearing ability, electrical characteristics, and heat resistance can be provided. | ||||||
| 13 | PHENOXYCYCLOTRIPHOSPHAZENE ACTIVE ESTER, HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF | US15027369 | 2014-06-13 | US20160244471A1 | 2016-08-25 | Yueshan HE |
| The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol. % of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible. | ||||||
| 14 | Epoxy resin composition, prepreg, and metal-clad laminate and multilayered printed wiring board | US12735235 | 2008-07-29 | US08846799B2 | 2014-09-30 | Hiroyuki Fujisawa; Hiroki Tamiya |
| The present invention provides an epoxy resin composition exhibiting good workability in drilling, molding, and desmearing as well as good interlayer adhesion strength. This epoxy resin composition comprises an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin is composed of a dicyclopentadiene-based epoxy resin and a novolac-based epoxy resin. The curing agent is a biphenyl-based phenol resin. The inorganic filler is composed of aluminum hydroxide and granular silica having an epoxy-silane treated surface. The epoxy resin composition contains 20 to 50% by weight of the granular silica. The epoxy resin composition contains 2 to 15% by weight, based on total weight of granular silica, of the aluminum hydroxide. | ||||||
| 15 | DOPO derivative and composite of epoxy applied in high-frequency substrate | US14927493 | 2015-10-30 | US09956742B2 | 2018-05-01 | Tung-Ying Hsieh; Qi Shen; Jung-Che Lu |
| A composite, a high-frequency circuit substrate using the same and method thereof are discussed. The composite includes the following solid components: a DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative compound of 10-70 wt %, a curing agent of 10-50 wt %, one or more epoxy of 10-90 wt % and an inorganic filling material of 10-40 wt %. The non-halogen low dielectric epoxy composite uses a high-purity DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative as tiny particles dispersing in the composite. The crosslinking yield of the composite is not reduced, while the heat resistance and flame retardancy are increased. The prepreg and copper foil covered laminate for use in printed circuit board, made from the epoxy composite, has great dielectric property and high glass transition temperature (GTT), satisfying the need of high frequency in electronic signal transmission and high speed in data processing of the industry of copper covered printed circuit board. | ||||||
| 16 | Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed Circuit Board Containing the Same | US15318787 | 2016-09-08 | US20170298218A1 | 2017-10-19 | Hui LI; Kehong FANG; Yongjing XU |
| The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards. | ||||||
| 17 | SIZING COMPOSITION FOR REINFORCING FIBRES AND APPLICATIONS THEREOF | US15117756 | 2015-02-11 | US20160355645A1 | 2016-12-08 | Arnaud Martin; Brigitte Defoort; Xavier Coqueret |
| A sizing composition for reinforcing fibres is provided which makes it possible to improve the adhesion of these fibres with respect to an organic matrix that forms, with them, a part made of a composite material and that results from the chain transfer polymerization of a curable resin. The sizing composition includes a polybutadiene prepolymer comprising at least two epoxide functions, a cross-linking agent comprising at least two reactive functions, at least one of which is a thiol function; and a catalyst comprising at least one tertiary amine function. The sizing composition may be used in the following fields of use: aeronautical, aerospace, railway, naval and motor vehicle industries, for example, for the production of structural, engine, passenger compartment or body work parts; arms industry, for example, for the production of parts incorporated into the composition of missiles or missile launch tubes; sports and leisure goods industry, for example, for the production of goods intended for water sports and board sports. | ||||||
| 18 | REACTIVE POLYMERIC MIXTURE | US13500814 | 2010-10-07 | US20120259028A1 | 2012-10-11 | Peter Plimmer; Christopher Tanner |
| The present invention relates to a reactive mixture, comprising poly(hydroxyalkanoic acid) or copolymer thereof and a reactive composition adapted such that a relatively rubbery phase is formed once reacted. Preferably the reactive composition is polymeric and comprises at least first and second reactable components which preferably contain epoxide moieties and carboxylic moieties respectively. The present invention also relates to a method for providing a reactive mixture, the method comprising the steps of combining poly(hydroxyalkanoic acid) or copolymer thereof, a first polymer having epoxide moieties and a second polymer having carboxylic moieties.The invention also relates to a method for controlling the melt viscosity of a polymeric mass during melt processing. | ||||||
| 19 | THERMOSETTING RESIN COMPOSITION AND PREPREG AND LAMINATE OBTAINED WITH THE SAME | US12443260 | 2007-09-10 | US20100143728A1 | 2010-06-10 | Shinji Tsuchikawa; Tomohiko Kotake; Masanori Akiyama |
| The present invention provides a thermosetting resin composition comprising (A) a curing agent having an acidic substituent and an unsaturated maleimide group which is produced by a specific method, (B) a 6-substituted guanamine compound and/or dicyandiamide, (C) a copolymer resin comprising specific monomer units and (D) an epoxy resin and a prepreg and a laminated plate which are prepared by using the same. The thermosetting resin composition of the present invention is balanced in all of a copper foil adhesive property, a heat resistance, a moisture absorption, a flame resistance, a metal-stuck heat resistance, a relative dielectric constant and a dielectric loss tangent. They have a low toxicity and are excellent in a safety and a working environment, and therefore a prepreg and a laminated plate which have excellent performances are obtained by using the above thermosetting resin composition. | ||||||
| 20 | 硬化性エポキシ組成物、フィルム、積層フィルム、プリプレグ、積層体、硬化物、及び複合体 | JP2015508651 | 2014-03-27 | JP6357697B2 | 2018-07-18 | 藤村 誠; 立石 洋平; 坂野 豪 |
QQ群二维码
意见反馈
意见反馈