子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 201 | Molecular compounds having complementary surfaces to targets | US10055837 | 2001-10-26 | US06884842B2 | 2005-04-26 | David S. Soane; Stephen E. Barry; Andrew Goodwin; David A. Offord; Michael G. Perrott |
| Synthetic polymer complements (SPCs) are provided, as well as methods for their synthesis and use. The SPCs may have surfaces that include functional groups that are complementary to surface sites of targets such as nanostructures or macromolecular targets, and may be capable of specifically interacting with such targets. The positions of the functional groups in one embodiment are stabilized by a polymer network. The SPCs are formed by contacting the target with a set of monomers which self-assemble on the target, and then are polymerized into a network to form the synthetic polymer complement. At least a portion of the surface of the resulting SPC thus may include an imprint of the target. The complex of the SPC and the target may be the desired product. Alternatively, the target is released, for example, by controllably expanding and contracting the crosslinked network. The SPC is isolated and used in many applications. | ||||||
| 202 | Processes for the purification of higher diamondoids and compositions comprising such diamondoids | US10052636 | 2002-01-17 | US06861569B2 | 2005-03-01 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are processes for the recovery and purification of higher diamondoids from a hydrocarbonaceous feedstock. Specifically disclosed is a multi-step recovery process for obtaining diamondoid compositions enhanced in tetramantane components and other higher diamondoid components. Also disclosed are compositions comprising at least about 10 weight percent of non-ionized tetramantane components and other higher diamondoid components and at least about 0.5 weight percent of non-ionized pentamantane components and other higher diamondoid components based on the total weight of diamondoid components present. | ||||||
| 203 | Polymerizable higher diamondoid derivatives | US10046486 | 2002-01-16 | US06858700B2 | 2005-02-22 | Jeremy E. Dahl; Robert M. Carlson; Shenggao Liu |
| Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers. | ||||||
| 204 | Compositions comprising octamantanes and processes for their separation | US10012546 | 2001-12-12 | US06831202B2 | 2004-12-14 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are compositions comprising one or more octamantanes. Specifically disclosed are compositions comprising 25 to 100 weight percent of one or more octamantanes. Also disclosed are novel processes for the separation and isolation of octamantane components into recoverable fractions from a feedstock containing at least a higher diamondoid component which contains one or more octamantane components. | ||||||
| 205 | Diamondoid-containing low dielectric constant materials | US10784915 | 2004-02-24 | US20040198049A1 | 2004-10-07 | Jeremy E. Dahl; Robert M. Carlson; Shenggao Liu |
| Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated circuit multilevel interconnects, thermally conductive adhesive films, thermally conductive films in thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission cathodes. The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, peritamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecarnantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite. | ||||||
| 206 | Diamondoid-containing field emission devices | US10784885 | 2004-02-24 | US20040198048A1 | 2004-10-07 | Jeremy E. Dahl; Robert M. Carlson; Shenggao Liu |
| Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated circuit multilevel interconnects, thermally conductive adhesive films, thermally conductive films in thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission cathodes. The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite. | ||||||
| 207 | Molecular compounds having complementary surfaces to targets | US10055837 | 2001-10-26 | US20030153001A1 | 2003-08-14 | David S. Soane; Stephen E. Barry; Andrew Goodwin; David A. Offord; Michael G. Perrott |
| Synthetic polymer complements (SPCs) are provided, as well as methods for their synthesis and use. The SPCs may have surfaces that include functional groups that are complementary to surface sites of targets such as nanostructures or macromolecular targets, and may be capable of specifically interacting with such targets. The positions of the functional groups in one embodiment are stabilized by a polymer network. The SPCs are formed by contacting the target with a set of monomers which self-assemble on the target, and then are polymerized into a network to form the synthetic polymer complement. At least a portion of the surface of the resulting SPC thus may include an imprint of the target. The complex of the SPC and the target may be the desired product. Alternatively, the target is released, for example, by controllably expanding and contracting the crosslinked network. The SPC is isolated and used in many applications. | ||||||
| 208 | Compositions comprising nonamantanes and processes for their separation | US10012709 | 2001-12-12 | US20030100808A1 | 2003-05-29 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are compositions comprising one or more nonamantanes. Specifically disclosed are compositions comprising 25 to 100 weight percent of one or more nonamantanes. Also disclosed are novel processes for the separation and isolation of nonamantane components into recoverable fractions from a feedstock containing at least a higher diamondoid component which contains one or more nonamantane components. | ||||||
| 209 | Processes for the purification of higher diamondoids and compositions comprising such diamondoids | US10017821 | 2001-12-12 | US20020193648A1 | 2002-12-19 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are processes for the recovery and purification of higher diamondoids from a hydrocarbonaceous feedstock. Specifically disclosed is a multi-step recovery process for obtaining diamondoid compositions enhanced in tetramantane components and higher diamondoid components. Also disclosed are compositions comprising at least about 10 weight percent of non-ionized tetramantane components and higher diamondoid components and at least about 0.5 weight percent of non-ionized pentamantane components and higher diamondoid components based on the total weight of diamondoid components present. | ||||||
| 210 | Compositions comprising heptamantane and processes for their separation | US10012334 | 2001-12-12 | US20020143217A1 | 2002-10-03 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are compositions comprising one or more heptamantanes. Specifically disclosed are compositions comprising 25 to 100 weight percent of one or more heptamantanes. Also disclosed are novel processes for the separation and isolation of heptamantane components into recoverable fractions from a feedstock containing at least a higher diamondoid component which contains one or more heptamantane components. | ||||||
| 211 | Compositions comprising cyclohexamantane | US10012335 | 2001-12-12 | US20020137976A1 | 2002-09-26 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are compositions comprising C26H30 hexamantane, referred to herein as peri-condensed hexamantane, fully condensed hexamantane, and cyclohexamantane. These enriched cyclohexamantane compositions comprise at least 5 percent by weight cyclohexamantane based upon the total weight of the composition. | ||||||
| 212 | Compositions comprising pentamantanes and processes for their separation | US10012333 | 2001-12-12 | US20020134301A1 | 2002-09-26 | Jeremy E. Dahl; Robert M. Carlson |
| Disclosed are compositions comprising one or more pentamantanes. Specifically disclosed are compositions comprising 10 to 100 weight percent of one or more pentamantanes. Also disclosed are novel processes for the separation and isolation of pentamantane components into recoverable fractions from a feedstock containing at least a higher diamondoid component which contains one or more pentamantane components. | ||||||
| 213 | Diamondoid-containing materials in microelectronics | US10047044 | 2002-01-14 | US20020130407A1 | 2002-09-19 | Jeremy E. Dahl; Robert M. Carlson; Shenggao Liu |
| Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, thermally conductive films in integrated circuit packaging, low-k dielectric layers in integrated circuit multilevel interconnects, thermally conductive adhesive films, thermally conductive films in thermoelectric cooling devices, passivation films for integrated circuit devices (ICs), and field emission cathodes. The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite. | ||||||
| 214 | Metabolically cleavable dendrimeric polychelants | US702693 | 1996-11-08 | US5976493A | 1999-11-02 | Lawrence Margerum; Joan Carvalho; Martha Garrity; Jere Douglas Fellmann |
| The invention provides polychelant compounds which are useful for example in diagnostic imaging procedures and which are degradable in vivo to release excretable fragments. Such compounds conveniently are of the formula (I): R.sup.1 (X.sup.1 R.sup.2 ((X.sup.2).sub.p L).sub.n).sub.m (where X.sup.1 is a linker moiety metabolically cleavable to release R.sup.1 X.sup.3.sub.m and X.sup.4 R.sup.2 ((X.sup.2).sub.p L).sub.n fragments where X.sup.3 and X.sup.4 are the cleavage residues of X.sup.1 ; R.sup.1 X.sup.3.sub.m is a biotolerable polymer, preferably a substantially monodisperse polymer and especially one with a molecular weight below 40,000 D, particularly below 30,000 D and especially below 20,000 D, for example a first to sixth generation dendrimer; X.sup.4 R.sup.2 ((X.sup.2).sub.p L).sub.n is a polychelant fragment having a molecular weight below 40,000 D, preferably below 30,000 D, especially below 20,000 D, each such moiety preferably being the same; p is 0 or 1; X.sup.2, where present, is a linker moiety metabolically cleavable to release a monochelant fragment; each L is a macrocyclic chelant moiety, wherein the macrocyclic skeleton preferably has 9 to 25 ring members and preferably is an optionally oxygen or sulphur interrupted polyazacycloalkane; R.sup.2 ((X.sup.2).sub.p).sub.n is a straight chain or branched backbone moiety, preferably providing a chain of up to 20 atoms between each L group and the X.sup.1 moiety to which it is joined and a chain of up to 25 atoms between each pair of L groups linked thereby, such chains conveniently being nitrogen and/or oxygen and/or sulphur interrupted carbon chains; each n is an integer having a value of at least 2, preferably a value of 2 to 25, especially 2 to 12; and each m is an integer having a value of at least 2, preferably a value of up to 200, especially 3 to 100, such that the total number of L groups in the polychelant of formula (I) is at least 20, preferably 50 to 200), having a molecular weight of at least 30,000 D, preferably at least 40,000 D, and especially preferably 50,000 to 150,000 D, and metal chelates and salts thereof. | ||||||
| 215 | Method of assembly of molecular-sized nets and scaffolding | US711448 | 1996-09-06 | US5876830A | 1999-03-02 | Josef Michl; Thomas F. Magnera; Donald E. David; Robin M. Harrison |
| The present invention relates to methods and starting materials for forming molecular-sized grids or nets, or other structures based on such grids and nets, by creating molecular links between elementary molecular modules constrained to move in only two directions on an interface or surface by adhesion or bonding to that interface or surface. In the methods of this invention, monomers are employed as the building blocks of grids and more complex structures. Monomers are introduced onto and allowed to adhere or bond to an interface. The connector groups of adjacent adhered monomers are then polymerized with each other to form a regular grid in two dimensions above the interface. Modules that are not bound or adhered to the interface are removed prior to reaction of the connector groups to avoid undesired three-dimensional cross-linking and the formation of non-grid structures. Grids formed by the methods of this invention are useful in a variety of applications, including among others, for separations technology, as masks for forming regular surface structures (i.e., metal deposition) and as templates for three-dimensional molecular-sized structures. | ||||||
| 216 | Metal complexes of dendrimeric macromolecules, diagnostics agents that contain the latter as well as process for the production of the complexes and agents | US663233 | 1996-10-03 | US5759518A | 1998-06-02 | Heribert Schmitt-Willich; Johannes Platzek; Andreas Muhler; Thomas Frenzel |
| The invention relates to new metal complexes of dendrimeric macromolecules that contain 8 to 64 ions of an element of atomic numbers 21-129, 39, 42-44, or 57-83 and a polymeric, complexing ligand of formula I A--(X).sub.b (I) in which A, X and b have different meanings, agents that contain these compounds as well as the use of the latter in diagnosis. The invention further relates to a process for the production of the complexes and agents. | ||||||
| 217 | Method for making polymers with intrinsic light-absorbing properties | US55793 | 1993-04-30 | US5578676A | 1996-11-26 | Tony Flaim; James Lamb, III; Kimberly A. Moeckli; Terry Brewer |
| A composition and a method for forming an anti-reflective layer for DUV microlithographic processes is disclosed. The compositions of the present invention includes a polymer dissolved in a suitable solvent. The polymers are polysulfone and polyurea polymers which possess inherent light absorbing properties at deep ultraviolet wavelengths. In accordance with the method of the present invention, these compositions are applied to a substrate to form an anti-reflective coating, and thereafter a photoresist material that is compatible with the anti-reflective coating is applied. | ||||||
| 218 | Photolithographic article utilizing polymers with light-absorbing properties for anti-reflective coating | US55916 | 1993-04-30 | US5368989A | 1994-11-29 | Tony D. Flaim; James E. Lamb, III; Kimberly A. Moeckli; Terry Brewer |
| A composition and a method for forming an anti-reflective layer for DUV microlithographic processes is disclosed. The compositions of the present invention includes a polymer dissolved in a suitable solvent. The polymers are polysulfone and polyurea polymers which possess inherent light absorbing properties at deep ultraviolet wavelengths. In accordance with the method of the present invention, these compositions are applied to a substrate to form an anti-reflective coating, and thereafter a photoresist material that is compatible with the anti-reflective coating is applied. | ||||||
| 219 | Self-doped zwitterionic aniline polymers | US636915 | 1991-01-02 | US5342912A | 1994-08-30 | Fred Wudl; Alan Heeger |
| A self-doped conducting polymer having along its backbone a .pi.-electron conjugated system which comprises a plurality of monomer units, between about 0.01 and 100 mole % of the units having covalently linked thereto at least one Bronsted acid group. The conductive zwitterionic polymer is also provided, as are monomers useful in the preparation of the polymer and electrodes comprising the polymer. | ||||||
| 220 | Polymers with intrinsic light-absorbing properties for anti-reflective coating applications in deep ultraviolet microlithography | US835715 | 1992-02-12 | US5234990A | 1993-08-10 | Tony Flaim; James Lamb, III; Kimberly A. Moeckli; Terry Brewer |
| A composition and a method for forming an anti-reflective layer for DUV microlithographic processes is disclosed. The compositions of the present invention includes a polymer dissolved in a suitable solvent. The polymers are polysulfone and polyurea polymers which possess inherent light absorbing properties at deep ultraviolet wavelengths. In accordance with the method of the present invention, these compositions are applied to a substrate to form an anti-reflective coating, and thereafter a photoresist material that is compatible with the anti-reflective coating is applied. | ||||||
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