Sealing method for ic chip
专利汇可以提供Sealing method for ic chip专利检索，专利查询，专利分析的服务。并且PURPOSE:To prevent the exfoliation of transfer molds as well as to miniaturize a clock by a method wherein a through hole is provided within the scope of sealing on the circuit substrate, whereon IC chips are adhered mold resin is poured in from the fixed surface of the IC chips and the reverse side and the IC chips are covered and sealed. CONSTITUTION:The IC chip 2 is adhered on the circuit substrate 1 in such manner that it is in continuity with each pattern using a wire 3. Through holes 1a and 1b are opened on the substrate located in the scope of molded sealing of the IC chip, molded resin is poured in from the adhered surface of the IC chip and the reverse surface through the penetrated holes, the IC chip is covered and at the same time, the penetrated holes are closed. Accordingly, the strength for exfoliation is increased and miniaturization and thinning of the clock can be accomplished.，下面是Sealing method for ic chip专利的具体信息内容。
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