Acoustically absorbent mounting method for optical modulator
阅读：633发布：2022-03-12
专利汇可以提供Acoustically absorbent mounting method for optical modulator专利检索，专利查询，专利分析的服务。并且Acoustical ringing which results from piezoelectric effects in an electro-optical modulator is suppressed by mounting the modulator crystal between massive, acoustically absorbent, support members which also provide an electric circuit interface for applying electric signals to the modulator. Solder provides such an absorbent mounting for a lithium tantalate electrooptical modulator crystal. Both solder support members are applied during the same heating interval and permitted to cool simultaneously. In one embodiment the solder application is accomplished in a first step wherein mounds of solder are applied adjacent to the crystal at a first temperature and in a second step wherein additional solder is applied at a lower temperature between the crystal and the solder mounds.，下面是Acoustically absorbent mounting method for optical modulator专利的具体信息内容。
2. The method in accordance with claim 1 in which the member has films of conductive material adhering to said faces, and in the step of applying damping conductive material, the time of said heating when said damping material is applied into actual contact with said member, through said films, is limited to a time interval sufficient to apply said damping material without losing modulation-controlling electrical continuity from the damping material through said films to said member.
3. A method for mounting an electro-optical modulator member to reduce at least selected piezoelectric effects upon the modulation function of the member, said method comprising the steps of mounting contacts in spaced relation on a horizontal substrate, positioning the member on the substrate between the contacts, heating the member, contacts, and substrate to a predetermined temperature, flowing solder with a melting point below said temperature into connecting relationship between the member and the contacts, detecting and removing manually interfacial imperfections between said member and said solder in said relationship, and cooling the solder at both sides of the member simultaneously.
4. The method for applying electrical connections to predetermined faces of an electro-optical modulator member, said method comprising the steps of heating to a first predetermined temperature a substrate having a pair of contact areas thereon spaced to accommodate said member, applying a first solder material to said contact areas, said solder material having a melting temperature such that it can be mounded but does not flow freely at said first temperature, cooling said substrate, contact areas, and solder to a second temperature at which said solder material is solid, positioning said member between said contact areas, applying a second solder material to said contact areas between said member and said fIrst solder material to fill spaces between said first solder material and said member, said second solder material having a melting temperature below said second temperature so that it flows freely at said second temperature, and cooling said member, substrate, contact areas, and solder materials to a temperature at which said second solder material is solid for bonding said member to said contact areas through said solder materials.
5. The method in accordance with claim 4 in which the predetermined faces of the member are on opposite sides thereof and such faces have films of conductive material adhering thereto, said step of applying said first solder material includes the substep of mounding such solder material to form a dam to retain the subsequently applied second solder material adjacent to said films and to form a total solder material volume which is much greater than the volume of said member and substantially equally disposed adjacent said faces, tapering down in thickness away from such faces, and the step of applying the second solder material includes the substep of microscopically observing the application to detect and remove interfacial imperfections between said films on each of said faces and said second solder material to provide a substantially homogeneous interface across said faces, said second temperature is maintained for a time interval sufficient to apply said second solder material without losing modulation-controlling electrical continuity from the solder material through said films into said member.
6. A method for mounting an electro-optical modulator member on a substrate to reduce at least selected piezoelectric effects upon the modulation function of the member, said method comprising the steps of applying electrical contact films to predetermined opposite faces of a wafer of piezoelectric electro-optical material, applying electric contact films to predetermined spaced areas on a surface of said substrate member, cutting at least one of said electro-optical modulator members from said wafer to form a rod-like modulator member having electrical contact films on two opposite faces thereof and extending longitudinally along such member, heating the member to a predetermined temperature, applying electrically conductive material of high acoustical damping constant into contact with said faces of said member to cover substantially the full extent of said faces, at least a portion of said material having a melting point such that the material can be shaped at said temperature, shaping said material into a mounded configuration having a roughly triangular cross section, and cooling the material at said faces simultaneously.
7. The method in accordance with claim 1 in which the member has films of conductive material adhering to said faces, and in the step of applying damping conductive material, the time of said heating when said damping material is applied into actual contact with said member, through said films, is limited to a time interval of suitable duration to avoid vaporization of said films.
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