Apparatus for preparing semiconductor device
专利汇可以提供Apparatus for preparing semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE: To enhance not only the measuring reliability of characteristics but also molding accuracy, by holding the lead of a semiconductor device, wherein the lead is allowed to straightly protrude from the side surface of the package thereof, between a pair of measuring terminals to measure characteristics and molding said lead one at a time.
CONSTITUTION: A semiconductor device 1 is successively sent in one at a time to measure characteristics at stations B, C. That is, the package 4 of the semiconductor device 1 is mounted on a support stand 23 and the straight lead 5 allowed to protrude from the side surface of the package 4 is grasped from above and below by a pair of measuring terminals 24, 25 to measure characteristics. Only the lead 5 of a good product is fed to a molding unit 28 to be molded into a mounting structure one at a time and the presence of electrostatic breakdown inferiority is detected by an electrostatic breakdown inferiority detection part 29 to immediately tape only the good product. By this method, since the contact state of the time of molding become well, characteristics can be measured with high accuracy and the highly accurate molding of the lead becomes possible.
COPYRIGHT: (C)1989,JPO&Japio，下面是Apparatus for preparing semiconductor device专利的具体信息内容。
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