Positive selective nickel alignment system专利检索-晶片卡盘电子零件及设备专利检索查询-专利查询网

Positive selective nickel alignment system

阅读：483发布：2023-05-06

专利汇可以提供Positive selective nickel alignment system专利检索，专利查询，专利分析的服务。并且An alignment assembly for masking and a process for depositing a metallic coating on selected areas on the back side of a semiconductor wafer. The assembly and process involves a distinctive alignment chuck having a pattern of grooves therein and a mask aligned with the chuck. In the method, a photomask for the back side of the wafer is aligned with the grooves in the chuck, a wafer nested face down in the chuck, and the mask moved into contact with the back side of the wafer. The front side of the wafer has a pattern of ridges that nest in the chuck grooves to align the wafer in the chuck. A photoresist layer on the back side of the wafer is subjected to an ultraviolet light through the photomask. Unexposed areas of photoresist are removed to expose selected areas on the back side of the wafer on which a metallic coating can be deposited.，下面是Positive selective nickel alignment system专利的具体信息内容。

权利要求

1. Apparatus for automatically aligning a semiconductor wafer back side photomask that is complementary to and in precise registration with a plurality of emitter mesas on the front side of the wafer, said apparatus comprising: an alignment chuck having a face for receiving the front side of a circular semiconductor wafer having a plurality of emitter mesas on its front side and a grid pattern of intersecting ridges between and spaced from the emitter mesas; a pattern of intersecting ridges on said chuck face corresponding to said grid pattern on said wafer and forming a plurality of recesses in said chuck face corresponding to said emitter mesas; a pattern of intersecting grooves in said chuck ridges corresponding to said wafer ridges, said chuck grooves having a V-shaped cross section with a depth and width slightly greater than the height and width of the wafer ridges, whereby said wafer ridges and emitter mesas can nest within said chuck grooves and recesses, respectively, and automatically align said wafer with said chuck; a generally circular outer periphery on said pattern of chuck ridges of a diameter slightly less than the diameter of said wafer so as to avoid engagement with peripheral portions of said wafer which may not have well-defined ridges; a support that is movable into and out of a predetermined position that is adjacent said chuck; means for automatically guiding said movable support into said predetermined position adjacent said chuck; a wafer back side photomask that is complementary to said wafer front side; means fixing said photomask to said movable support whereby movement of said support into said predetermined position moves said photomask into contact with the back side of a wafer whose front side is nested in said chuck grooves and recesses; and said photomask precisely aligned with said chuck grooves when said support is in said predetermined position, and thereby automatically precisely aligned with a wafer front side nested in said chuck grooves and recesses.

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Positive selective nickel alignment system

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