Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof专利检索-牺牲阳极阳极有机发光二极管激光与光电专利检索查询-专利查询网

Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof

阅读：575发布：2022-02-16

专利汇可以提供Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof专利检索，专利查询，专利分析的服务。并且A procedure is disclosed for modifying the topography of the surface of a polymer substrate to improve the bonding capability of the surface of the polymer in respect to subsequently applied coatings such as metal films, paints and inks. The procedure involved comprises first laminating a sacrificial, anodized metal foil to the substrate surface by heat and pressure, chemically stripping away that foil and then developing preferably, by a supplemental chemical stripping treatment, a network of microscopic fissures and cracks which is believed to incipiently form in the surface by the laminating process. Thereafter the treated substrate may be activated and electrolessly plated by conventional methods, followed by an added electrolytic or electroless plating if desired, to provide a metal film of execellent adhesion. Alternatively, standard vacuum metallizing procedures may be used to provide the initial or finished metal coating. Adhesion of other, nonmetallic, coatings such as paints and inks is also improved by the process.，下面是Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof专利的具体信息内容。

权利要求

2. A PROCESS OF IMPROVING THE TOPOGRAPHY CHARACTERISTICS OF A PLASTIC SUBSTRATE SURFACE FOR THE BONDING THERETO OF A PERMANENT COATING FILM, WHICH COMPRISES THE STEPS OF INITIALLY FORMING BY HEAT AND PRESSURE A LAMINATE OF THE PLASTIC SUBSTRATE AND A SACRIFICIAL ALUMINUM METAL FOIL HAVING AN OXIDIZED SURFACE FACING THE SUBSTRATE, CHEMICALLY STRIPPING IN AN AQUEOUS ETCHANT SOLUTION ALL VISIBLE TRACES OF SAID SACRIFICIAL ALUMINUM METAL FOIL FROM THE SURFACE OF THE SUBSTRATE, AND THEN SUBJECTING THE STRIPPED SUBSTRATE TO TREATMENT IN AN AQUEOUS SOLUTION OF PHOSPHORIC ACID OR A SOLUBLE PYROPHOSPHATE EFFECTIVE IN REMOVING ALL TRACE METAL OXIDES FROM THE SURFACE OF THE SUBSTRATE AFTER THE FIRST ETCHING STEP, AND THEREAFTER RINSING AND APPLYING SAID PERMANENT COATING FILM.

3. A process as defined in claim 2, wherein said sacrificial metal foil is aluminum foil anodized in phosphoric or sulfuric acid, and said aqueous solution effective to remove trace metal oxides contains a phosphate material selected from the group consisting of phosphoric acid and the alkali metal ammonium pyrophosphates.

4. A process as defined in claim 3, wherein the concentration of said phosphate material is at least about 0.25 molar.

5. A process as defined in claim 3, wherein the supplemental etchant treatment is continued for from 3 minutes to 15 minutes at a solution temperature of from 80*F. to 180*F. with a phosphate concentration equivalent to from 4 percent to 75 percent (weight) of phosphoric acid.

6. A process as defined in claim 2, wherein said sacrificial metal foil is aluminum which has been anodized in aqueous phosphoric acid solution to produce an anodized film of at least about 200 Angstroms thick; and wherein said laminate of plastic substrate and anodized aluminum foil is contacted with a hydrochloric acid etchant solution to strip said aluminum foil therefrom, and said stripped substrate is supplementally treated in a 45 percent (weight) aqueous phosphoric acid solution at a temperature of 160*F. for 5 minutes.

7. IN THE ELECTROLESS METAL PLATING OF PLASTIC SUBSTRATE IN WHICH A LAMINATE IS INITIALLY FORMED BY BONDING AN ANODIZED ALUMINUM FOIL TO A RESIN SUBSTRATE BY HEAT AND PRESSURE, THE ALUMINUM FOIL BEING THEN CHEMICALLY STRIPPED FROM THE PLASTIC SURFACE, THE SURFACE ACTIVATED AND THEM PLATED WITH AN ADHERENT FILM BY IMMERSION IN AN ELECTROLESS METAL PLATING SOLUTION THE IMPROVEMENT WHICH COMPRISES: SUBJECTING THE PLASTIC SUBSTRATE TO FURTHER CHEMICAL TREATMENT, SUPPLEMENTAL TO THE SAID REGULAR STRIPPING STEP, TO SUBSTANTIALLY ELIMINATE TRACES OF METAL OXIDES ADHERING TO THE SURFACE, WHEREIN SAID SUPPLEMENTAL TREATMENT INVOLVES IMMERSING THE STRIPPED SUBSTRATE IN A SOLUTION OF PHOSPHORIC ACID OR SOLUBLE PYROPHOSPHATE.

8. The improvement in electroless plating of thermoset resin substrates as defined in claim 7, wherein said supplemental chemical stripping step is continued until development of a topographically complex but uniform network of distinct fissures and cracks of a depth on the order of at least 200 A appears in the substrate surface, as shown by an electron scan microphotograph of the surface of the substrate.

9. The improvement in electroless plating as defined in claim 7, wherein said supplemental chemical stripping step comprises immersing the regularly stripped resin substrate in an aqueous solution of phosphoric acid.

10. The improvement in electroless plating as defined in claim 9, wherein said supplemental chemical treatment solution contains from 4 percent to 75 percent (weight) phosphoric acid and said substrate is maintained in said solution at a temperature of from 80*F. to 180*F. for a period of 3 to 15 minutes.

11. The improvement in electroless plating as defined in claim 7, wherein said supplemental chemical stripping step comprises immersing the regularly stripped resin substrate in an aqueous solution of a soluble pyrophosphate.

12. The improvement in electroless plating as defined in claim 11, wherein said pyrophosphate is sodium, potassium or ammonium pyrophosphate at a concentration of from 10 g/1 to saturation for a period of from 3 to 15 minutes at a solution temperature of 100*F. to 180*F.

13. The improvement in electroless plating as defined in claim 7, wherein said supplemental chemical stripping step comprises immersing the regularly stripped resin substrate in an aqueous cuastic solution of an alkali metal hydroxide followed immediately by immersion of said substrate in an aqueous solution of phosphoric acid or a soluble pyrophosphate.

14. A PROCESS OF IMPROVING THE TOPOGRAPHY CHARACTERISTICS OF A POLYMERIZED PLASTIC SUBSTRATE SURFACE FOR THE BONDING THERETO OF A PERMANENT METALLIC FILM, WHICH COMPRISES THE STEP OF INITIALLY FORMING A LAMINATE OF THE PLASTIC SUBSTRATE AND A SACRIFICIAL ANODIZED ALUMINUM FOIL BY HEAT AND PRESSURE, CHEMTICALLY STRIPPING SAID FOIL FROM THE SUBSTRATE SURFACE IN AN AQUE OUS ETCHANT SOLUTION OF A STRONG ACID OR BASE TO REMOVE ALL VISIBLE TRACE OF THE METAL, SUPPLEMENTING SAID ETCHANT STEP BY SUBJECTING THE STRIPPED SUBSTRATE TO AN AQUEOUS SOLUTION OF PHOSPHORIC ACID OR A SOLUBLE PYROPHOSPHATE, AND THEREAFTER RINSING AND ELECTROLESSLY PLATING SAID PERMANENT METALLIC FILM ON SAID SUBSTRATE.

15. A process as defined in claim 14, wherein said sacrificial aluminum foil is chemically stripped from said substrAte in hydrochloric acid solution containing a fluoride ion in a concentration of at least about 0.2M.

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Method of improving the bonding capability of polymer surfaces for subsequently applied coatings, and products thereof

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