Assembling method for electronic circuit device
专利汇可以提供Assembling method for electronic circuit device专利检索，专利查询，专利分析的服务。并且PURPOSE:To enable to extract the block of carriers, which contain a plurality of ICs and become independent electrically, to measure characteristics under the state in which a plurality of ICs are made to be contained and to simplify treatment by cutting a ceramic package along a terminal row in the specific direction. CONSTITUTION:IC Chips are sealed through resin molding or capping 9, and a ceramic-carrier substrate is divided into longitudinal rectangular forms as shown in the figure by being broken along the through-holes of vertical (Y direction) wiring terminals from the arrow A in the figure. Accordingly, the ceramic- carrier substrate 1a divided in to longitudinal forms contains a plurality of ICs, but all of wiring for plating conduction are mutually separated electrically through the cutting of ceramics in the Y direction. The longitudinal ceramic- carriers are set to a socket for measuring characteristics by using a proper jig, characteristics are measured at each IC, and ICs to be selected are determined.，下面是Assembling method for electronic circuit device专利的具体信息内容。
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