Alpha ray-shielding adhesive film
专利汇可以提供Alpha ray-shielding adhesive film专利检索，专利查询，专利分析的服务。并且PURPOSE: To produce the titled film which gives semiconductor devices having high reliability, by providing a heat-fusible adhesive layer composed of a polyimide precursor on one side of a polyimide film.
CONSTITUTION: A polyimide film (e.g. one obtd. by casting a soln. of a polyimide precursor such as polyamic acid obd. by the reaction of an arom. tetracarboxylic acid dianhydride with a diamine component in an org. polar solvent, into a film and heat-treating it to imidate it) is used. A heat-fusible adhesive layer composed of a polyimide precursor having a degree of imidation of 20W80% (pref. a soln. of a polyimide precursor similar to that used in said polyimide film formation, particularly pref. a soln. of a silicone-modified polyimide precursor) is provided on one side of said polyimide film to produce the titled film. This film can be simply bonded to the surface of a semiconductor element by utilizing heat fusibility and can effectively attenuate and absorb alpha rays radiated from a sealing material so that semiconductors having high reliability can be produced.
COPYRIGHT: (C)1985,JPO&Japio，下面是Alpha ray-shielding adhesive film专利的具体信息内容。
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