Semiconductor device and its manufacture
专利汇可以提供Semiconductor device and its manufacture专利检索，专利查询，专利分析的服务。并且PURPOSE:To enable to increase the output power of a power transistor even if a package of the same chip and of the same external dimension is used by a method wherein when a chip is soldered, a structure in which a heat radiation block is soldered around the circumference of the chip simultaneously is adopted. CONSTITUTION:A creamy solder 3 is applied on a heating substrate 1. While a creamy solder is heated to reach a specified temperatue by being held by pneumatic tweezers a chip is placed on a creamy solder. Next a metal block 8 is set. By scrubbing performed with a wide collet 4 which contacts with ends of the block 8 an excess of solder 3 is sent under the block 8, and soldering can be finished so that the minimum thickness may be obtained. By this constitution, the output power of a power transistor can be increased by 20-30%, maintaining the same shape and the external dimension.，下面是Semiconductor device and its manufacture专利的具体信息内容。
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