Copper-containing electroconductive coating
专利汇可以提供Copper-containing electroconductive coating专利检索，专利查询，专利分析的服务。并且PURPOSE: The titled coating that contains as an electroconductive filler a copper powder which has been prepared by treating a copper powder with an organic carboxylic acid and further treating with an antioxidant, thus being suitable for use as a paste for integrated circuits and an electroconductive adhesive, because it causes scarce reduction in electroconductivity and reduced formation of vergigris.
CONSTITUTION: The objective coating is obtained by adding, to a coating base as an electroconductive filler, an antioxidative copper powder which has been prepared by treating a copper powder with an organic carboxylic acid such as a hydroxycarboxylic acid and then treating the product with, e.g., 0.1W5wt% of an antioxidant selected from phosphoric esters, phosphatidic acid derivatives, alkylimidazole, organic carboxylic acid salt of alkylimidazole, nitrogen silane coupling, sulfur silane coupling agent, phenotiazine, thionine and stearylpropylenediamine.
EFFECT: It gives films of high resistances to humidity and heat.
COPYRIGHT: (C)1985,JPO&Japio，下面是Copper-containing electroconductive coating专利的具体信息内容。
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