PHOTOSENSITIVE RESIN COMPOSITION, RESIST LAMINATE, AND ARTICLES OBTAINED BY CURING SAME (5) |
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| 申请号 | EP13856834 | 申请日 | 2013-11-21 | 公开(公告)号 | EP2924505A4 | 公开(公告)日 | 2016-08-24 |
| 申请人 | NIPPON KAYAKU KK; | 发明人 | IMAIZUMI NAOKO; INAGAKI SHINYA; HONDA NAO; | ||||
| 摘要 | The purpose of the present invention is to provide the following: a photosensitive epoxy resin composition that, via photolithography, can form a high-resolution, low-stress image that has vertical side walls and resists moisture and heat, and/or a resist laminate using said photosensitive epoxy resin composition; and an article or articles obtained by curing said photosensitive epoxy resin composition and/or resist laminate. The present invention is a photosensitive resin composition containing the following: an epoxy resin (A), a polyol compound (B) having a specific structure, a cationic-polymerization photoinitiator (C), a silane compound (D) containing an epoxy group, and a reactive epoxy monomer (E) having a specific structure. The epoxy resin (A) contains the phenol derivative represented by formula (1), an epoxy resin (a) obtained via a reaction with epihalohydrin, and an epoxy resin (b) that can be represented by formula (2). | ||||||
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