A method for bonding a pellicle, and a bonding apparatus used in this method |
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| 申请号 | EP14192204.7 | 申请日 | 2014-11-07 | 公开(公告)号 | EP2871521A3 | 公开(公告)日 | 2015-06-24 |
| 申请人 | SHIN-ETSU CHEMICAL CO., LTD; | 发明人 | Yuichi, Hamada; | ||||
| 摘要 | Here is proposed a method for bonding a pellicle to a stencil such as mask plate, which is characteristic in that the stencilbonding agglutinant layer of the pellicle is warmed under load while the pellicle is being bonded to the stencil, preferably at a temperature in a range of 35 through 80 degrees C, and the load is increased stepwise and with intermittent removal of the load. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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