PEELABLE CIRCUIT BOARD FOIL |
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| 申请号 | PCT/US2006013995 | 申请日 | 2006-04-14 | 公开(公告)号 | WO2006130244A2 | 公开(公告)日 | 2006-12-07 |
| 申请人 | MOTOROLA INC; DUNN GREGORY J; CHELINI REMY J; DEAN TIMOTHY B; | 发明人 | DUNN GREGORY J; CHELINI REMY J; DEAN TIMOTHY B; | ||||
| 摘要 | In one embodiment, a peelable circuit board foil (200) has a metal support layer (205) and a conductive metal foil layer (210) bonded by an inorganic high temperature release structure (215) that comprises a co-deposited layer (250) and a metal oxide layer (260). The co-deposited layer comprises an admixture of nickel and one or more of boron, phosphorus, and chromium. In a second embodiment, the peelable printed circuit foil (200) has a crystallized dielectric oxide layer (405) disposed on the metal foil layer and an electrode layer (415) disposed on the crystallized dielectric oxide layer, forming a dielectric peelable circuit board foil (400) that may be adhered to a layer of a flexible or rigid circuit board, after which the metal support layer can be peeled away, leaving a capacitive structure including the metal foil layer, the crystallized dielectric oxide layer, and the electrode layer. | ||||||
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