BONDING MATERIAL AND BONDING METHOD USING SAME |
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| 申请号 | US15506823 | 申请日 | 2015-08-31 | 公开(公告)号 | US20170252874A1 | 公开(公告)日 | 2017-09-07 |
| 申请人 | Dowa Electronics Materials Co., Ltd.; | 发明人 | Keiichi Endoh; Hiromasa Miyoshi; Kimikazu Motomura; Satoru Kurita; | ||||
| 摘要 | There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3% by weight or less of carbon and having an average particle diameter of 0.1 to 1 μm, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80% by weight to 95% by weight, and the content of the alcohol solvent is in the range of from 5% by weight to 20% by weight. | ||||||
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| 说明书全文 | |||||||
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