Wire tension applying device专利检索- 线的拉紧专利检索查询-专利查询网

Wire tension applying device
申请号	JP4362483	申请日	1983-03-16	公开(公告)号	JPS59172362A	公开(公告)日	1984-09-29
申请人	Tokyo Seikou Kk;			发明人	TOYOKAWA TETSUO;
摘要	PURPOSE:To apply tension of arbitrary level to a wire by extending a wire between the peripheral surfaces of a pair of rotatable taper drums opposed on the large-diameter side and on small-diameter side mutually in such a manner as to sequentially wind round the drums from the small-diameter side to the large-diameter side to provide tension on the wire. CONSTITUTION:A wire (a) drawn out from a wire draw-out drum 1 is sequentially wound round between the peripheral surfaces of taper tension producing drums 2, 3 from the small-diameter side to the large-diameter side with abberation, and the wire is let out from the drum 3 to be wound round a winding drum 4. When the wire (a) is sequentially taken up on the drum 4, if there is no slippage between the drums 2, 3, tension is produced only with expansion deformation caused by tensile stress. As tension is naturally produced, the performance of the wire (a) is not deteriorated. The leading-out position of the wire (a) may be changed to obtain arbitrary tension.
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