ELECTROCONDUCTIVE FILM AND METHOD FOR PRODUCING SAME |
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| 申请号 | US15552282 | 申请日 | 2015-12-16 | 公开(公告)号 | US20180077798A1 | 公开(公告)日 | 2018-03-15 |
| 申请人 | DOWA ELECTRONICS MATERIALS CO., LTD.; | 发明人 | Hidefumi FUJITA; Shuji KANEDA; Daisuke ITOH; | ||||
| 摘要 | To provide a copper electroconductive film formed on a paper substrate, the copper electroconductive film being considerably improved in weather resistance and electroconductivity. The problem can be achieved by an electroconductive film formed by pressing a sintered electroconductive film formed by sintering copper particles in a coating film containing copper powder on a paper substrate along with the substrate, the electroconductive film having an area ratio of copper occupying on a cross section of the electroconductive film in parallel to a thickness direction thereof of 82.0% or more. The electroconductive film can be produced by pressing, for example, by roll press to from 90 to 190° C., after light sintering. | ||||||
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| 说明书全文 | |||||||
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