COPPER POWDER AND COPPER PASTE, CONDUCTIVE COATING MATERIAL, AND CONDUCTIVE SHEET USING SAME |
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| 申请号 | US15560750 | 申请日 | 2015-03-26 | 公开(公告)号 | US20180051176A1 | 公开(公告)日 | 2018-02-22 |
| 申请人 | SUMITOMO METAL MINING CO., LTD.; | 发明人 | Hiroshi Okada; Yu Yamashita; | ||||
| 摘要 | Provided is a copper powder that has an increased number of points of contact between copper powder particles, that ensures excellent conductivity, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The copper powder is configured from flat plate-shaped copper particles that form a dendritic shape having a linearly grown main trunk and a plurality of branches branching from the main trunk. The main trunk and the branches have an average cross-sectional thickness of more than 1.0 μm but no more than 5.0 μm. The copper powder has a flat plate shape that is configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 μm. | ||||||
| 权利要求 | |||||||
| 说明书全文 | |||||||
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