摘要 |
A method of recording aligned images on two sides of a printed circuit board substrate, comprising: recording and image of an electrical circuit pattern on a first side of a printed circuit board substrate (804); forming an alignment pattern on a side of the printed circuit board substrate, wherein said alignment pattern has a known spatial relationship to said image of an electrical circuit pattern; determining a location of the alignment pattern on the printed circuit board substrate (812, 814); and recording an image of an electrical circuit pattern on a second side of the printed circuit board substrate (818) in response to the determined location of the alignment pattern (816). |