Curable composition, cured coating film using same, and printed wiring board |
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| 申请号 | US15026071 | 申请日 | 2014-11-04 | 公开(公告)号 | US10113066B2 | 公开(公告)日 | 2018-10-30 |
| 申请人 | TAIYO INK MFG. CO., LTD.; | 发明人 | Masayuki Shimura; Yoshiyuki Furuta; Masao Yumoto; | ||||
| 摘要 | Provided are: a curable composition that shows good adhesion on a printed wiring board, particularly a flexible substrate or the like, and has a high hardness; a resist coating film of the curable composition; and a printed wiring board having a resist pattern of the resist coating film. The curable composition comprises: (A) a photobase generator; (B-1) an epoxy group-containing (meth)acrylate compound or (B-2) a carboxyl group-containing (meth)acrylate compound; (C) a photopolymerization initiator; and (D-1) a thermosetting component (excluding the (B-1) epoxy group-containing (meth)acrylate compound) or (D-2) a thermosetting component (excluding the (B-2) carboxyl group-containing (meth)acrylate compound). | ||||||
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| 说明书全文 | |||||||
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