Compositions containing hollow microsperes专利检索- 基于有1个或多个不饱和脂族基的化合物的均聚物或共聚物的粘合剂其中每个不饱和脂族基只有1个碳-碳双键并且至少有1个是以卤素为终端;基于此种聚合物衍生物的粘合剂专利检索查询-专利查询网

Compositions containing hollow microsperes
申请号	US85185292	申请日	1992-03-16	公开(公告)号	US5317038A	公开(公告)日	1994-05-31
申请人	OATEY CO;			发明人	NATON PAUL E;
摘要	A composition is described with comprises a mixture of (A) from about 5% to about 60% by weight of at least one water-insoluble polymer; (B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and (C) from about 20% to about 70% of at least one volatile organic liquid which is a solvent for the polymer of (A). The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low VOC compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
权利要求
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