LIQUID HIGH SOLIDS BINDER COMPOSITION

申请号 US15822102 申请日 2017-11-24 公开(公告)号 US20180142099A1 公开(公告)日 2018-05-24
申请人 Knauf Insulation SPRL; Knauf Insulation, Inc.; 发明人 Gert MUELLER;
摘要 The invention described herein pertains to formaldehyde free, thermosetting liquid high solids binder compositions having rapid cure times on thermal curing and slow cure times at ambient temperatures so that the uncured binder compositions and products which comprise the uncured binder compositions have improved shelf lives.
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