101 |
MULTILAYERED HEAT-RECOVERABLE ARTICLE, WIRE SPLICE, WIRE HARNESS, AND METHOD FOR PRODUCING ADHESIVE FOR MULTILAYERED HEAT-RECOVERABLE ARTICLE |
US14890479 |
2015-03-24 |
US20160089847A1 |
2016-03-31 |
Ryota FUKUMOTO; Satoshi YAMASAKI; Yasutaka EMOTO |
An object of the present invention is to provide a multilayered heat-recoverable article in which an adhesive layer easily flows during heat shrinkage to ensure adhesiveness with an adherend and does not flow out from a base material layer after heat shrinkage, and a wire splice and a wire harness that include a tube formed by thermally shrinking such a multilayered heat-recoverable article. The multilayered heat-recoverable article (1) according to the present invention includes a cylindrical base material layer (10), and an adhesive layer (11) formed on an inner circumferential surface of the base material layer. The adhesive layer (11) is formed of a resin composition that contains a polyamide as a main component and that does not substantially contain an inorganic filler. The resin composition is cross-linked by irradiation with ionizing radiation. A shear viscosity of the adhesive layer (11) at 150° C. is 300 Pa·s or more at a shear rate of 0.01 s−1 and 200 Pa·s or less at a shear rate of 100 s−1. The wire splice and the wire harness according to the present invention includes a tube formed by thermally shrinking the multilayered heat-recoverable article (1). |
102 |
HIGH LIMITING OXYGEN INDEX ELECTRICAL INSULATION LAMINATES |
US14726725 |
2015-06-01 |
US20150360452A1 |
2015-12-17 |
JEAN CLAUDE DUART; SERGE REBOUILLAT; RADOSLAW SZEWCZYK; ROGER CURTIS WICKS |
Laminate structure suitable as electrical insulation comprising a mica-aramid layer of 35-55 wt % mica, 20-60 wt % binder, and 5 to 25 wt % aramid floc, the mica distributed uniformly in the mica-aramid layer; and an aramid layer comprising 35-75 wt % binder and 25-65 wt % aramid floc, the aramid layer being essentially free of mica; wherein the mica-aramid layer has a limiting oxygen index (LOI) of 37% or greater, and the aramid layer has a LOI of 30% or less and having a tensile strength and elongation greater than the mica-aramid layer; and the mica-aramid layer being homogeneously and continuously bound to the aramid layer; the laminate structure having a thickness of at least 0.10 mm, a LOI greater than 32%, and when exposed to a flame to determine LOI, the laminate burns as one piece. |
103 |
INSULATION FILM AND METHOD FOR MAKING INSULATION FILM |
US14649093 |
2013-11-21 |
US20150314575A1 |
2015-11-05 |
Hong Chuan Liao; Chris Benson; Yong Liang; Tom Carlson |
The present invention provides an insulation film, comprising a film upper layer (101) and a film lower layer (103), wherein both of the film upper layer (101) and film lower layer (103) are made of a PC or PET material, the PC or PET material contains a flame retardant to meet the flame retardance thereof; a film intermediate layer (102) located between the film upper layer and the film lower layer, the film intermediate layer (102) is made of a PC or PET material, the PC or PET material does not contain a flame retardant or contains a small amount of halogen-free flame retardant; an upper surface of the film intermediate layer (102) is bound together with a lower surface of the film upper layer (101), a lower surface of the film intermediate layer (102) is bound together with an upper surface of the film lower layer (103). |
104 |
Polyamide film coated with vinylidene chloride copolymer mixture and method for producing the same |
US12743724 |
2008-11-28 |
US09115256B2 |
2015-08-25 |
Hideki Kuwata; Takayoshi Okuzu |
Disclosed is a polyamide film coated with a vinylidene chloride copolymer mixture, wherein: on at least one side of a biaxially stretched polyamide film, a vinylidene chloride copolymer mixture layer in which no thermal crosslinking agent is copolymerized is formed by coating without through an intermediary of a primer layer; the vinylidene chloride copolymer mixture is a mixture including two or more vinylidene chloride copolymers; and one of the vinylidene chloride copolymers has a crystal melting point of 170° C. or higher and 210° C. or lower and is contained in an amount of 25 to 45 parts by mass in relation to 100 parts by mass of the vinylidene chloride copolymer mixture. |
105 |
INSULATION WATERPROOF MEMBER AND INSULATION WATERPROOFING METHOD |
US14381455 |
2013-03-01 |
US20150096786A1 |
2015-04-09 |
Kengo Takasu |
An insulating waterproof member for insulating and waterproofing a connector of a cable, the insulating waterproof member including: a sealing material for covering the connector, and a protective sheet for covering the connecting portion with the sealing material interposed therebetween, the protective sheet having an adhesive layer on a surface on a sealing material side, wherein the protective sheet includes a body portion for covering the connector and an extending portion that extends in a first direction from the body portion, and the extending portion allows pressure to be imparted to the sealing material and the body portion that cover the connector in a first region at a first end side of the body portion in a second direction that intersects the first direction, in a second region at a second end side of the body portion, and in a third region between the first region and the second region. |
106 |
Polyimides and fluoropolymer bonding layer with improved copper heat seal strength |
US13392942 |
2010-08-31 |
US08816217B2 |
2014-08-26 |
Haibin Zheng; Gregory Douglas Clements; Blair Gordon Jones; Manish Maheshwari; Toshinori Mizuguchi |
Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superior internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described. |
107 |
ARTICLES AND METHODS OF MAKING THE SAME |
US14181787 |
2014-02-17 |
US20140162079A1 |
2014-06-12 |
Muthu Subramanian; Jinder Jow; Stephen Y. Cheng; Thiam Aik Lim |
The invention provides an article comprising a first layer and a second layer, and wherein the first layer is formed from a first composition comprising an ethylene/α-olefin/diene interpolymer, an isoprene rubber (synthetic), a natural rubber, a butadiene rubber, a styrene butadiene rubber, a chloroprene rubber, a nitrile rubber, a hydrogenated nitrile rubber, a chlorinated polyethylene, a chlorosulfonated polyethylene, an ethylene/propylene rubber, an ethylene/diene copolymer, a fluoro rubber, a polyurethane, a silicone rubber, or a combination thereof; and wherein the second layer is formed from a second composition comprising a butyl rubber, a halobutyl rubber, polyvinylidene chloride, a brominated polymer derived from a copolymer of isobutylene and p-methyl styrene, a nitrile rubber, a chloroprene rubber, a chlorosulfonated polyethylene, a chlorinated polyethylene, a polyurethane, a fluoro rubber, or a combination thereof. |
108 |
Fabrication of high gradient insulators by stack compression |
US13429081 |
2012-03-23 |
US08709572B2 |
2014-04-29 |
John Richardson Harris; Dave Sanders; Steven Anthony Hawkins; Marcelo Noroña |
Individual layers of a high gradient insulator (HGI) are first pre-cut to their final dimensions. The pre-cut layers are then stacked to form an assembly that is subsequently pressed into an HGI unit with the desired dimension. The individual layers are stacked, and alignment is maintained, using a sacrificial alignment tube that is removed after the stack is hot pressed. The HGI's are used as high voltage vacuum insulators in energy storage and transmission structures or devices, e.g. in particle accelerators and pulsed power systems. |
109 |
High Temperature Insulating Tape and Wire or Cable Sheathed Therewith |
US14134386 |
2013-12-19 |
US20140102758A1 |
2014-04-17 |
Antonio Pagliuca; Philip Hammond |
A composite coating includes a first layer, a second layer, and a fluoropolymer film disposed on the second layer. The first layer includes a polymer matrix with mica particles dispersed throughout, while the second layer includes a polyether ether ketone (PEEK). |
110 |
ELECTRICAL INSULATION PAPER, METHODS OF MANUFACTURE, AND ARTICLES MANUFACTURED THEREFROM |
US13827796 |
2013-03-14 |
US20130260123A1 |
2013-10-03 |
John R. Krahn; Erich Otto Teutsch; Dennis Lockyer; Thomas Adjei |
Fibrous substrates containing polyetherimides and other synthetic fibers are disclosed, along with methods of preparing electrical insulation paper and articles comprising the fibrous substrates. |
111 |
Laminate |
US12412469 |
2009-03-27 |
US08530014B2 |
2013-09-10 |
Takeshi Shimono; Kenji Ichikawa; Takeshi Inaba; Yukinori Kamiya; Shingo Sakakibara; Shigehito Sagisaka; Takahiro Kitahara |
The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units. |
112 |
COVERING MATERIAL, SUPERCONDUCTING ELECTRIC WIRE AND ELECTRICAL DEVICE |
US13543304 |
2012-07-06 |
US20130023419A1 |
2013-01-24 |
Kiichiro MATSUSHITA; Hiroomi HANAI; Kazunori HAYASHI; Jun FUJIKI; Akihiro OOHASHI; Kayoko TAKAYANAGI; Kazumasa MUKOBATA; Yoshinori TANAKA |
Provided is a covering material, in which the covering material is a covering material for covering a superconducting wire, a tensile strength at break thereof at −196° C. is 12.0 N/3 mm or more, and a tensile elongation at break thereof at −196° C. is 12% or more. The covering material preferably includes a backing made of a polyimide resin. The covering material preferably includes a viscoelastic layer formed on one surface of the backing. |
113 |
COMPOSITE INSULATING FILM |
US13464395 |
2012-05-04 |
US20120286620A1 |
2012-11-15 |
Thomas James Murray; Mark Gerard Winkeler; Heta S. Rawal |
Provided is a flexible and self-supporting insulating film including a base polymer layer and a partially cured poly(amide)imide layer applied to the base polymer layer. The composite insulating film may be used as slot liner to provide insulation to the components of the electric motor. The partially cured poly(amide)imide layer of the composite insulation film maybe further cured by the heat generated by the operation of the electric motor. |
114 |
POLYIMIDES AND FLUOROPOLYMER BONDING LAYER WITH IMPROVED COPPER HEAT SEAL STRENGTH |
US13392942 |
2010-08-31 |
US20120152591A1 |
2012-06-21 |
Haibin Zheng |
Multilayer polyimide-fluoropolymer insulation structures exhibiting excellent copper heat seal strength and superi- or internal adhesion strength comprise a layer of polyimide having first and second major surfaces and at least a first fluoropolymer layer wherein the first fluoropolymer layer comprises fluoropolymer, metal oxide and ammonium salt. Protected wire or cable using the multilayer insulation structures, are also described. |
115 |
DRY MICA TAPE AND INSULATION COILS MANUFACTURED THEREWITH |
US13205857 |
2011-08-09 |
US20120038239A1 |
2012-02-16 |
Kenji IKEDA; Hisashi Morooka; Motonobu Ilzuka; Yoshihiro Haraguchi; Naohiro Hiruta; Shoichi Maruyama |
A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor. |
116 |
Prepreg and its application products for low thermal expansion and low dielectric tangent |
US12353357 |
2009-01-14 |
US08115105B2 |
2012-02-14 |
Satoru Amou; Hiroshi Shimizu; Akinori Hanawa |
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed. |
117 |
POLYAMIDE FILM COATED WITH VINYLIDENE CHLORIDE COPOLYMER MIXTURE AND METHOD FOR PRODUCING THE SAME |
US12743724 |
2008-11-28 |
US20100279110A1 |
2010-11-04 |
Hideki Kuwata; Takayoshi Okuzu |
Disclosed is a polyamide film coated with a vinylidene chloride copolymer mixture, wherein: on at least one side of a biaxially stretched polyamide film, a vinylidene chloride copolymer mixture layer in which no thermal crosslinking agent is copolymerized is formed by coating without through an intermediary of a primer layer; the vinylidene chloride copolymer mixture is a mixture including two or more vinylidene chloride copolymers; and one of the vinylidene chloride copolymers has a crystal melting point of 170° C. or higher and 210° C. or lower and is contained in an amount of 25 to 45 parts by mass in relation to 100 parts by mass of the vinylidene chloride copolymer mixture. |
118 |
SEEDING RESINS FOR ENHANCING THE CRYSTALLINITY OF POLYMERIC SUBSTRUCTURES |
US12779380 |
2010-05-13 |
US20100213413A1 |
2010-08-26 |
James D. B. Smith; Gary Stevens; John W. Wood |
The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures. |
119 |
BIAXIALLY ORIENTED POLYESTER FILM FOR AUTOMOBILE DRIVING MOTORS, AND ELECTRICALLY INSULATING MEMBER THEREFROM |
US12601952 |
2008-05-29 |
US20100173140A1 |
2010-07-08 |
Mitsuo Tojo |
An object of the invention is to provide a biaxially oriented polyester film for automobile driving motors, which has, in addition to high-temperature dimensional stability, high hydrolysis resistance required for an insulating film of an automobile driving motor, and also exhibits excellent delamination characteristics. |
120 |
Sulfonated aliphatic-aromatic copolyetheresters |
US10209369 |
2002-07-30 |
US07625994B2 |
2009-12-01 |
Richard Allen Hayes |
A sulfonated aliphatic-aromatic copolyetherester that comprises the polymerization product of 80.0 to 20.0 mole percent of an aromatic dicarboxylic acid or an ester thereof based on the total moles of dicarboxylic acid or ester thereof, 20.0 to 80.0 mole percent of an aliphatic dicarboxylic acid or an ester thereof based on the total moles of dicarboxylic acid or ester thereof, 0.1 to 10.0 mole percent of a sulfonate component, 99.9 to 91.0 mole percent of a first glycol selected from the group consisting of ethylene glycol, 1,3-propanediol and 1,4-butanediol based on the total moles of glycol, 0.1 to 4.0 mole percent of a poly(alkylene ether) glycol based on the total moles of glycol, 0 to 5.0 mole percent of an other glycol based on the total moles of glycol, and 0 to 5.0 mole percent of a polyfunctional branching agent. |