子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 21 | 一种蜂窝纸内芯复合板 | CN03138933.3 | 2003-07-28 | CN1575966A | 2005-02-09 | 冷鹭浩 |
| 本发明公开了一种蜂窝纸内芯复合板，包括面板、底板、蜂窝纸内芯、内衬件、封边条，蜂窝纸内芯填充于面板与底板之间；内衬件设于面板与底板之间，并完全包覆或部分包覆于蜂窝纸内芯的周边；封边条环接于面板边缘与底板边缘之间，并与内衬件或内衬件及蜂窝纸内芯相联接。由于采用直接成型的板件作为复合板的面板和底板，以质轻的蜂窝纸内芯作为复合板的内芯，以管件或挤出型材等内衬件作为复合板的加强框架，以封边条或内衬件作为复合板的边缘，使复合板既可以设计出变化灵活的各种形状，而无须另外加工，并易于清洗，抗潮性强，又具有较高的强度和较好的美观度。本发明是一种重量轻、强度高、易于清洗，造价低且美观的环保型蜂窝纸内芯复合板。 | ||||||
| 22 | Packaging material for cell | US15023287 | 2014-09-18 | US10033021B2 | 2018-07-24 | Yohei Hashimoto; Rikiya Yamashita |
| A packaging material for a cell including a laminated article having at least a coating layer, a barrier layer, and a sealant layer in the stated order, wherein: the coating layer has at least three layers including a first, second and third coating layer, and is disposed so that the first coating layer is positioned as the outermost layer and the third coating layer is positioned on the barrier-layer-side; and the first coating layer, the second coating layer, and the third coating layer are formed from a cured product of a resin composition containing a heat-curing resin and a curing accelerator so as to sufficiently exhibit a specific hardness, whereby the thickness can be reduced, exceptional chemical resistance, moldability, and inter-layer adhesion between the barrier layer and the coating layer can be obtained, and the lead time can be reduced to enable an improvement in production efficiency. | ||||||
| 23 | Curable composition suitable for the bonding of plasticized PVC | US14390614 | 2013-04-09 | US09777202B2 | 2017-10-03 | Heinz Meier; Markus Haufe; Josef Lussi; Elyes Jendoubi; Wilfried Carl |
| A composition includes methyl methacrylate MMA, at least one elastomer or a core-shell polymer, and at least one radical former, as an adhesive, sealant or coaling for gluing, sealing or coaling substrates containing plasticized PVC. | ||||||
| 24 | Bonding resin for wood-based composites providing light coloring, low platen sticking, and water resistance | US15344179 | 2016-11-04 | US09777200B2 | 2017-10-03 | Jack Winterowd; Erik M. Parker |
| Disclosed herein are adhesives, wood-based composites incorporating the adhesives, and methods of forming wood-based composites using the adhesives. Wood-based composites formed using the adhesives demonstrate an optimal combination of characteristics desirable to the wood products industry. Specifically, the wood products formed using the adhesive demonstrate (1) a light appearance when wet; (2) relatively low moisture content after soaking in water; (3) relatively little thickness swelling after soaking in water; and (4) minimal adhesion to metal press platens during press-forming of the wood products. | ||||||
| 25 | COMPOSITE BOARDS AND PANELS | US15404546 | 2017-01-12 | US20170120558A1 | 2017-05-04 | Darko PERVAN |
| A building panel (1) including a water resistant core (5) including thermoplastic material 21 and a surface layer (4) including thermosetting resins. Also, production methods to form a board material (1′) with a dry blend of thermoplastic particles 21a in powder form and fillers in powder form and to apply a surface layer (4) with a hot-hot lamination process to a core (5) including such board material. | ||||||
| 26 | BONDING RESIN FOR WOOD-BASED COMPOSITES PROVIDING LIGHT COLORING, LOW PLATEN STICKING, AND WATER RESISTANCE | US15344179 | 2016-11-04 | US20170058161A1 | 2017-03-02 | Jack G. Winterowd; Erik M. Parker |
| Disclosed herein are adhesives, wood-based composites incorporating the adhesives, and methods of forming wood-based composites using the adhesives. Wood-based composites formed using the adhesives demonstrate an optimal combination of characteristics desirable to the wood products industry. Specifically, the wood products formed using the adhesive demonstrate (1) a light appearance when wet; (2) relatively low moisture content after soaking in water; (3) relatively little thickness swelling after soaking in water; and (4) minimal adhesion to metal press platens during press-forming of the wood products. | ||||||
| 27 | BONDING RESIN FOR WOOD-BASED COMPOSITES PROVIDING LIGHT COLORING, LOW PLATEN STICKING, AND WATER RESISTANCE | US14338606 | 2014-07-23 | US20160024354A1 | 2016-01-28 | Jack G. Winterowd; Erik M. Parker |
| Disclosed herein are adhesives, wood-based composites incorporating the adhesives, and methods of forming wood-based composites using the adhesives. Wood-based composites formed using the adhesives demonstrate an optimal combination of characteristics desirable to the wood products industry. Specifically, the wood products formed using the adhesive demonstrate (1) a light appearance when wet; (2) relatively low moisture content after soaking in water; (3) relatively little thickness swelling after soaking in water; and (4) minimal adhesion to metal press platens during press-forming of the wood products. | ||||||
| 28 | FIBER-REINFORCED POLYISOCYANURATE COMPONENT AND A METHOD FOR PRODUCTION THEREOF | US14352103 | 2012-10-15 | US20150125703A1 | 2015-05-07 | Stefan Lindner; Klaus Franken; Dirk Passmann; Peter Nordmann |
| The present invention relates to fibre-composite components that are produced by impregnating fibres with a reaction resin mixture of polyisocyanates, polyols, trimersation catalysts and optionally additives, and to a method for production thereof. | ||||||
| 29 | METHOD AND DEVICE FOR FABRICATING FLEXIBLE DISPLAY DEVICE | US14353722 | 2013-12-16 | US20150075706A1 | 2015-03-19 | Hongfei Cheng; Yuxin Zhang |
| A method for fabricating a flexible display device is provided. The method comprises: attaching a first flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate; fabricating other parts of the flexible display device on the first flexible substrate; aging the conductive adhesive layer; peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device. | ||||||
| 30 | Thermosetting resin composition for high speed transmission circuit board | US10934851 | 2004-09-03 | US07255925B2 | 2007-08-14 | Hyuk-Sung Chung; Bong-Jin Jeon; Hyun-Cheol Kim; Eun-Hae Koo |
| The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer. | ||||||
| 31 | Thermosetting resin composition for high speed transmission circuit board | US10934851 | 2004-09-03 | US20050080183A1 | 2005-04-14 | Hyuk-Sung Chung; Bong-Jin Jeon; Hyun-Cheol Kim; Eun-Hae Koo |
| The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer. | ||||||
| 32 | Fabrication tool and method for parallel processor structure and package | US97603 | 1993-07-27 | US5403420A | 1995-04-04 | Thomas P. Gall; James R. Loomis; David B. Stone; Cheryl L. Tytran; James Wilcox |
| Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. The planar circuitization, as data lines, address lines, and control lines of a logic chip or a memory chip are on the individual printed circuit boards and cards, which are connected through the circuitized flex, and communicate with other layers of flex through Z-axis circuitization (vias and through holes) in the laminate. | ||||||
| 33 | Method and device for fabricating flexible display device | US14353722 | 2013-12-16 | US09873241B2 | 2018-01-23 | Hongfei Cheng; Yuxin Zhang |
| A method for fabricating a flexible display device is provided. The method comprises: attaching a first flexible substrate of the flexible display device onto a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive rigid substrate; fabricating other parts of the flexible display device on the first flexible substrate; aging the conductive adhesive layer; peeling off the flexible substrate from the conductive rigid substrate so as to obtain the flexible display device. | ||||||
| 34 | Melamine resin decorative sheet and method of refurbishing finished surface | US14382719 | 2013-03-06 | US09707740B2 | 2017-07-18 | Kousuke Arai |
| A melamine resin decorative sheet of the present invention includes a laminate structure of a surface layer and a core layer, in which the surface layer is configured of a surface layer material composed of a surface layer base material which carries a resin containing a melamine resin on a first surface side that serves as a design surface and which carries a solid content of a thermoplastic emulsion resin on a second surface side that contacts with the core layer, and in which the core layer is configured of a heat dissipative material layer. | ||||||
| 35 | PANEL WITH PAINT READY SURFACE | US15249380 | 2016-08-27 | US20160361910A1 | 2016-12-15 | George T. FRANCK, III; Alvin S. BARTOLOME; Patrick G. JARVIS-SHEAN |
| In a preferred embodiment, a composite panel with a smooth outer surface, ready for painting with or without addition of primer, may be created by constructing a panel layup assembly upon a mold, the panel layup assembly including a composite panel having a core and a resin formulation, and a release film between the mold and the composite panel, where a smooth release surface of the release film is in contact with the composite panel upon construction; initiating curing of the composite panel at a first temperature within a lowermost ten percent of a curing temperature range of the resin formulation; continuing curing of the composite panel at a second temperature above the lowermost ten percent of the curing temperature range; and completing curing of the composite panel at a third temperature below the second temperature. | ||||||
| 36 | Bonding resin for wood-based composites providing light coloring, low platen sticking, and water resistance | US14338606 | 2014-07-23 | US09518185B2 | 2016-12-13 | Jack G. Winterowd; Erik M. Parker |
| Disclosed herein are adhesives, wood-based composites incorporating the adhesives, and methods of forming wood-based composites using the adhesives. In some embodiments, an adhesive emulsion includes a continuous phase having an aqueous, alkaline solution that includes a melamine/urea/formaldehyde (“MUF”) resin, and a dispersed phase that includes a multifunctional aromatic isocyanate component. The solution including the MUF resin has a percent solids content of about 1.0% to about 90.0%, and the MUF resin and the multifunctional aromatic isocyanate component are present in a ratio of about 92:8 to about 40:60 on a solids mass basis. Wood-based composites formed using the adhesives demonstrate an optimal combination of characteristics desirable to the wood products industry. | ||||||
| 37 | FAST CURING ADHESIVE USEFUL FOR BONDING TO GLASS | US15217101 | 2016-07-22 | US20160333237A1 | 2016-11-17 | Huide D. Zhu; Daniel P. Sophiea; Matthew B. Feldpausch |
| A composition comprising: a one part adhesive composition comprising a) one or more isocyanate components; b) one or more catalysts for the reaction of isocyanate groups with active hydrogen containing groups; c) one or more fillers which do not enhance the formation of voids during curing; d) one or more fillers having basic character; and a cure accelerator comprising: e) one or more liquid carriers; f) water; and g) one or more paste forming agents. The one part adhesive composition may be used alone where ambient temperature and humidities afford reasonably rapid cure rates. The cure accelerator may be used when temperatures and/or humidities are sufficiently low such that the cure rate of the adhesive alone is not acceptable for a particular use. | ||||||
| 38 | Fast curing adhesive useful for bonding to glass | US14435311 | 2013-03-04 | US09428678B2 | 2016-08-30 | Huide D. Zhu; Daniel P. Sophiea; Matthew B. Feldpausch |
| A composition comprising: a one part adhesive composition comprising a) one or more isocyanate functional components; b) one or more catalysts for the reaction of isocyanate groups with active hydrogen containing groups; c) one or more fillers which do not enhance the formation of voids during curing; d) one or more fillers having basic character; and a cure accelerator comprising: e) one or more liquid carriers; f) water; and g) one or more paste forming agents. The one part adhesive composition may be used alone where ambient temperature and humidities afford reasonably rapid cure rates. The cure accelerator may be used when temperatures and/or humidities are sufficiently low such that the cure rate of the adhesive alone is not acceptable for a particular use. | ||||||
| 39 | Fiber-reinforced polyisocyanurate component and a method for production thereof | US14352103 | 2012-10-15 | US09334379B2 | 2016-05-10 | Stefan Lindner; Klaus Franken; Dirk Passmann; Peter Nordmann |
| The present invention relates to fiber-composite components that are produced by impregnating fibers with a reaction resin mixture of polyisocyanates, polyols, trimerization catalysts and optionally additives, and to a method for production thereof. | ||||||
| 40 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | US13581009 | 2010-08-13 | US09265145B2 | 2016-02-16 | Kouji Morita; Hikari Murai; Shin Takanezawa; Yasuo Inoue; Kazunaga Sakai |
| The invention provides a varnish produced through reaction between a compound having an amino group and a resin having a functional group capable of reacting with an amino group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the amino group of the compound in a solvent, and also a varnish produced through reaction between a compound having a phenolic hydroxyl group and a resin having a functional group capable of reacting with a phenolic hydroxyl group, and having a polycyclic structure, wherein a portion of a plurality of the functional group of the resin is caused to react with the phenolic hydroxyl group of the compound in the solvent. The invention also provides a prepreg, a resin-coated film, a metal-foil-clad laminate, and a printed wiring board produced by use of any of the varnishes. | ||||||
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