子分类：
| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 一种电子产品高效复合散热片的制备方法 | CN201610690050.6 | 2016-08-19 | CN106311581A | 2017-01-11 | 不公告发明人 |
| 本发明公开了一种电子产品高效复合散热片的制备方法，该方法采用剥离液剥离石墨烯，配合研磨或搅拌，可降低对研磨或搅拌速度的要求，无需对石墨片层超高速剪切即可实现对石墨烯的剥离，通过氮掺杂可简单、有效地提高石墨烯中碳与碳间的结构完整性，且使用的有机或无机固相氮源具有成本低及易取得的优点，可有效降低制造成本。 | ||||||
| 2 | 用于保护银和银合金表面防失去光泽的方法 | CN201180011268.X | 2011-02-23 | CN102906307B | 2015-04-15 | D·纳都西 |
| 一种用于保护银和银合金表面防失去光泽的方法，其特征在于：起初使待处理表面在有机溶剂中清洗预处理，将这样清洗的表面浸渍在能够确保形成薄层氧化银的酸溶液中，将这样氧化的表面浸渍在至少一种化学式为CH3(CH2)nSH的硫醇的溶液中，其中n为10到16之间，-在包含水蒸气的环境中在至少50℃的温度下，使所述硫醇分子与事先氧化的银表面化学反应。 | ||||||
| 3 | 镀银电路的改良涂层 | CN200480009810.8 | 2004-03-15 | CN1774304A | 2006-05-17 | 罗纳德·雷德林; 大卫·安杰洛内; 史蒂芬·A·卡斯塔尔迪; 莱诺雷·托斯卡诺 |
| 本发明公开了一种提高金属表面可焊性的方法，其中该金属表面在焊接前以浸渍或化学银镀层来镀敷，此后浸渍银镀层用碱性聚合物涂料处理，该碱性聚合物涂料包含水性乙烯基聚合物、水性丙烯酸聚合物、抗菌剂和苯并三唑或苯并咪唑化合物，以产生耐电迁移的沉积物，该沉积物在表面上提供防锈及防蚀涂层。 | ||||||
| 4 | 一种耐污自清洁流量控制阀的制造方法 | CN201511003694.5 | 2015-12-29 | CN105586511A | 2016-05-18 | 顾云昌 |
| 本发明公开了一种耐污自清洁流量控制阀的制造方法，所述控制阀的阀体是采用低压铸造工艺制得的，其包括如下步骤：1）熔炼合金溶液：将高纯净度耐腐蚀性镍基合金锭放入高温熔炼炉内熔炼成合金溶液，所述高纯净度耐腐蚀性镍基合金锭包括的化学元素及各元素的质量百分比为：铬15%-20%、铜5%-8%、镁2%-4%、钛1%-3%、钼0.5%-2.5%、锰0.2%-0.8%、铝0.1%-0.6%，其余为镍；2）模具预热；3）低压铸造成型；4）喷涂纳米二氧化钛溶液。通过上述方式，本发明工艺简单易控，制得的控制阀阀体表面及内在质量高，耐腐蚀性能好，尤其是具有自清洁性能。 | ||||||
| 5 | 金属多孔材料的孔径调节方法及金属多孔材料的孔结构 | CN201110448049.X | 2011-12-28 | CN102560175B | 2014-09-03 | 高麟; 汪涛; 李波 |
| 本发明公开了一种通过化学热处理实现孔径调节的金属多孔材料的孔径调节方法。为此，本发明的金属多孔材料的孔径调节方法具体是通过将至少一种元素渗入材料的孔表面而使其平均孔径缩小至一定范围内。当元素渗入金属多孔材料的孔表面后，引起金属多孔材料的孔洞表层发生晶格畸变膨胀或形成新相层，从而使金属多孔材料上的原有孔洞缩小，以达到调节孔径的目的。因此，本发明这种孔径调节方法比现有孔径调节方法更加方便，且可控性更好。除此以外，本发明还要提供一种金属多孔材料的孔结构，该孔结构能够使金属多孔材料达到要求的孔径大小。为此，本发明的金属多孔材料的孔结构包括分布于材料表面的孔洞，所述孔洞的孔表面设置有渗层。 | ||||||
| 6 | 用于保护银和银合金表面防失去光泽的方法 | CN201180011268.X | 2011-02-23 | CN102906307A | 2013-01-30 | D·纳都西 |
| 一种用于保护银和银合金表面防失去光泽的方法，其特征在于：起初使待处理表面在有机溶剂中清洗预处理，将这样清洗的表面浸渍在能够确保形成薄层氧化银的酸溶液中，将这样氧化的表面浸渍在至少一种化学式为CH3(CH2)nSH的硫醇的溶液中，其中n为10到16之间，在包含水蒸气的环境中在至少50℃的温度下，使所述硫醇分子与事先氧化的银表面化学反应。 | ||||||
| 7 | 金属多孔材料的孔径调节方法及金属多孔材料的孔结构 | CN201110448049.X | 2011-12-28 | CN102560175A | 2012-07-11 | 高麟; 贺跃辉; 汪涛; 李波 |
| 本发明公开了一种通过化学热处理实现孔径调节的金属多孔材料的孔径调节方法。为此，本发明的金属多孔材料的孔径调节方法具体是通过将至少一种元素渗入材料的孔表面而使其平均孔径缩小至一定范围内。当元素渗入金属多孔材料的孔表面后，引起金属多孔材料的孔洞表层发生晶格畸变膨胀或形成新相层，从而使金属多孔材料上的原有孔洞缩小，以达到调节孔径的目的。因此，本发明这种孔径调节方法比现有孔径调节方法更加方便，且可控性更好。除此以外，本发明还要提供一种金属多孔材料的孔结构，该孔结构能够使金属多孔材料达到要求的孔径大小。为此，本发明的金属多孔材料的孔结构包括分布于材料表面的孔洞，所述孔洞的孔表面设置有渗层。 | ||||||
| 8 | 镀银电路的改良涂层 | CN200480009810.8 | 2004-03-15 | CN100371089C | 2008-02-27 | 罗纳德·雷德林; 大卫·安杰洛内; 史蒂芬·A·卡斯塔尔迪; 莱诺雷·托斯卡诺 |
| 本发明公开了一种提高金属表面可焊性的方法，其中该金属表面在焊接前以浸渍或化学银镀层来镀敷，此后浸渍银镀层用碱性聚合物涂料处理，该碱性聚合物涂料包含水性乙烯基聚合物、水性丙烯酸聚合物、抗菌剂和苯并三唑或苯并咪唑化合物，以产生耐电迁移的沉积物，该沉积物在表面上提供防锈及防蚀涂层。 | ||||||
| 9 | PROCESS FOR COATING OF ARTICLES | US15736776 | 2016-06-17 | US20180169696A1 | 2018-06-21 | Yingnan WANG; Zhuonan MIAO; Ching Tom KONG; Woon Ming LAU; Sui Kong HARK; Ka Wai WONG |
| A process of providing an antibacterial coating to the surface of an article including the steps of applying a layer of an antibacterial precursor layer to the surface of an article to which an antibacterial coating is to be applied, wherein said antibacterial precursor layer is a precursor from which the coating is to be formed; and directing a neutral molecular hydrogen flux from a neutral molecular hydrogen flux emission source towards the surface of the article. Upon impact of neutral hydrogen molecules on molecules at or on the surface of an article, the bonds of the antibacterial precursor layer are selectively ruptured, and wherein the selectively ruptured bonds cross-link with themselves or with other chemical moieties at said surface or a combination thereof, resulting an antibacterial coating being formed on the surface of the article. | ||||||
| 10 | Patterning methods and products | US13555931 | 2012-07-23 | US09738062B2 | 2017-08-22 | Manfred Buck; Piotr Cyganik |
| The present invention provides a process for producing a surface-modified layer system comprising a substrate (2) and a self-assembled monolayer (SAM) (1) anchored to its surface. The SAM (1) is comprised by aryl or rigid alicyclic moiety species. The process comprises providing a polymorphic SAM (1) anchored to the substrate (2), and thermally treating (4) the SAM to change from a first to a second structural form thereof. The invention also provides a thermolithographic form of process in which the thermal treatment (4) is used to transfer a pattern (3) to the SAM (1), which is then developed. | ||||||
| 11 | Method for adjusting pore size of porous metal material and pore structure of porous metal material | US14368435 | 2011-12-31 | US20140352848A1 | 2014-12-04 | Lin Gao; Yuehui He; Tao Wang; Bo Li |
| Disclosed are a method for adjusting the pore size of a porous metal material and the pore structure of a porous metal material. The method comprises: permeating at least one element into the surface of the pores of the material to generate a permeated layer on the surface of the pores, so that the average pore size of the porous material is reduced to within a certain range, thus obtaining a pore structure of the porous metal material having the pores distributed on the surface of the material and the permeated layer provided on the surface of the pores. | ||||||
| 12 | Sensor chips | US11327660 | 2006-01-06 | US07759114B2 | 2010-07-20 | Lisandra Lorraine Martin; Daniel Luke Johnson |
| A method for selectively orienting molecules on a surface of a solid support. The method includes the steps of: (a) attaching a linker molecule to the surface of the solid support, the linker molecule including a head group that is capable of binding to the solid support, and a tail group that is capable of chelating to a metal ion; (b) subsequently treating the solid support with a solution containing the metal ion; (c) attaching a metal ion chelating tag to the molecules to form tagged molecules; and (d) capturing the tagged molecules on the solid support by contacting it with the tagged molecules to form a monolayer of molecules on the surface of the solid support in which a majority of the molecules are held in the same orientation with respect to the surface. The invention also provides a sensor chip formed using the methods of the invention. | ||||||
| 13 | Method for improving the adhesion of polymeric adhesives to nickel surfaces | US431545 | 1995-05-01 | US5532024A | 1996-07-02 | Steven F. Arndt; Luis J. Matienzo; Irving Memis; James Spalik; Tien Y. Wu |
| The present invention provides a novel method for improving the adhesion of polymers, particularly adhesives, to nickel surfaces. The method involves contacting the nickel surface with a hydrogen peroxide solution having a temperature of at least about 40.degree. C. for a time sufficient to form a wettable oxide surface having a water contact angle of less than about 10.degree.. | ||||||
| 14 | 変色から銀と銀合金の表面を保護するための方法 | JP2012554436 | 2011-02-23 | JP5651855B2 | 2015-01-14 | ナルドゥッチ，ダリオ |
| 15 | Silver member having protective layer | JP26277498 | 1998-09-17 | JPH11158655A | 1999-06-15 | MINAMITANI TAKANORI; YOSHINO NOBUYUKI |
| PROBLEM TO BE SOLVED: To provide a silver member having a structure by which the sulfidization resistance is improved while maintaining the original color tone of silver. SOLUTION: A protective film by the plasma polymerization of gaseous hydrocarbons is provided on the surface of a silver member 5, and further a protective layer obtained by laminating a film consisting of the oxide or nitride of at least one kind of element selected from groups IIa, IIIa, IVa, Va, IIb, IIIb and IVb elements and a hard carbon film having the hardness and low friction coefficient corresponding to diamond is furnished thereon. COPYRIGHT: (C)1999,JPO | ||||||
| 16 | 金属多孔材料の孔径調節方法および金属多孔材料の孔構造 | JP2014549291 | 2011-12-31 | JP2015503674A | 2015-02-02 | 高麟; 賀躍輝; 汪涛; 李波 |
| 多孔金属材料の孔表面から少なくとも1種類の元素を浸透させることで孔表面に浸透層を形成し、該材料の平均孔径を所定の範囲内に縮小させる金属多孔材料の孔径調節方法、および該孔径調節方法により得られる、材料表面に分布している穴と穴表面に設けられている浸透層とを含む孔構造を有する金属多孔材料。 | ||||||
| 17 | Silver member having protective layer | JP26277498 | 1998-09-17 | JP2992276B2 | 1999-12-20 | MINAMITANI TAKANORI; YOSHINO NOBUYUKI |
| PROBLEM TO BE SOLVED: To provide a silver member having a structure by which the sulfidization resistance is improved while maintaining the original color tone of silver. SOLUTION: A protective film by the plasma polymerization of gaseous hydrocarbons is provided on the surface of a silver member 5, and further a protective layer obtained by laminating a film consisting of the oxide or nitride of at least one kind of element selected from groups IIa, IIIa, IVa, Va, IIb, IIIb and IVb elements and a hard carbon film having the hardness and low friction coefficient corresponding to diamond is furnished thereon. | ||||||
| 18 | Method for adjusting pore size of porous metal material and pore structure of porous metal material | US14368435 | 2011-12-31 | US09644254B2 | 2017-05-09 | Lin Gao; Yuehui He; Tao Wang; Bo Li |
| Disclosed are a method for adjusting the pore size of a porous metal material and the pore structure of a porous metal material. The method comprises: permeating at least one element into the surface of the pores of the material to generate a permeated layer on the surface of the pores, so that the average pore size of the porous material is reduced to within a certain range, thus obtaining a pore structure of the porous metal material having the pores distributed on the surface of the material and the permeated layer provided on the surface of the pores. | ||||||
| 19 | PATTERNING METHODS AND PRODUCTS | US13555931 | 2012-07-23 | US20130171433A1 | 2013-07-04 | Manfred Buck; Piotr Cyganik |
| The present invention provides a process for producing a surface-modified layer system comprising a substrate (2) and a self-assembled monolayer (SAM) (1) anchored to its surface. The SAM (1) is comprised by aryl or rigid alicyclic moiety species. The process comprises providing a polymorphic SAM (1) anchored to the substrate (2), and thermally treating (4) the SAM to change from a first to a second structural form thereof. The invention also provides a thermolithographic form of process in which the thermal treatment (4) is used to transfer a pattern (3) to the SAM (1), which is then developed. | ||||||
| 20 | Method for protecting silver and silver alloy surfaces against tarnishing | US13578241 | 2011-02-23 | US20120305141A1 | 2012-12-06 | Dario Narducci |
| A method for protecting silver and silver alloy surfaces against tarnishing, characterized by initially subjecting the surface to be treated to cleaning pre-treatment in organic solvents; immersing the cleaned surface in an acid solution able to ensure formation of a thin layer of silver oxide; immersing the oxidized surface in a solution of at least one thiol of formula CH3(CH2)nSH where n is between 10 and 16; and chemically reacting the molecules of said thiol with the previously oxidized silver surface, in an environment containing water vapor at a temperature of at least 50° C. | ||||||
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