| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 21 | Reed switch | JP2001127224 | 2001-04-25 | JP2002324466A | 2002-11-08 | OKANO HIROBUMI; SHIMOYAMA KEIJI |
| PROBLEM TO BE SOLVED: To mold a vessel without damage and reduce the by molding a reed switch with a hot-melt resin at a low temperature and at a small injection pressure. SOLUTION: At least a vessel 1a of a reed switch is molded 3 using a hot- melt resin. COPYRIGHT: (C)2003,JPO | ||||||
| 22 | Reed switch mounting structure in the eddy current type indicating instrument | JP10497188 | 1988-08-10 | JPH079101Y2 | 1995-03-06 | 幸雄 松原 |
| 23 | JPH0227567U - | JP10497188 | 1988-08-10 | JPH0227567U | 1990-02-22 | |
| 24 | JPS5115218B1 - | JP4809970 | 1970-06-05 | JPS5115218B1 | 1976-05-15 | |
| 25 | REED SWITCH RELAY | EP14885668 | 2014-03-11 | EP3118881A4 | 2018-01-03 | GONG SHUGANG |
| A reed switch relay comprises a PCB base (1) and a control assembly (2) electrically connected to the PCB base. The control assembly is mounted on the PCB base by a surface mount technology. The control assembly comprises a hollow coil (21) mounted on the PCB base, a reed switch (22) mounted in the hollow coil, and a shield layer (23) sleeving the outer surface of the hollow coil, the reed switch comprises pins, the shield layer is connected with the pins of the reed switch. In the reed relay, the control assembly is mounted on the PCB base though a surface mount technology, which ensures position tolerance and precision of the reed switch, implements full mechanization of product production, increases productivity, and satisfies requirements of mass production, thereby increasing economic benefits. | ||||||
| 26 | REED SWITCH GLASS TUBE | EP11855688 | 2011-11-30 | EP2664590A4 | 2017-12-27 | MASHIMA RYOTA; KOBAYASHI MASAHIRO; KASHIWADANI KEN |
| There is provided a reed switch glass tube (10) capable of preventing, for example, chipping and cracking of end parts (1) thereof by forming a compressive stress layer (22) having a length (A) from an end face (11) within a range of 0.1 mm to 0.6 mm on an outer circumference surface (12) of the end part (1) of the glass tube. | ||||||
| 27 | PROCEDE DE FABRICATION D'UN MODULE DE COMMUTATION FAIBLE COURANT ET DISPOSITIF OBTENU PAR LEDIT PROCEDE | EP07821540.7 | 2007-10-18 | EP2087499A1 | 2009-08-12 | GIACOMIN, FABRICE |
| The invention relates to a method for production of a low current switch module, comprising the following steps: precutting a fine conductor path of several conducting circuits connected by connector tracks in the same sheet, positioning the contact relay and other optional electronic components on the precut conductor path, electrically and mechanically connecting said contact relay and the optional electronic components on the conductor track, encapsulating the unit comprising the conductor path, contact relay, the optional components, the pins and electrical connectors thereof and cutting certain connector tracks such as to separate said circuits. | ||||||
| 28 | INVERTED BOARD MOUNTED ELECTROMECHANICAL DEVICE | EP01935293.9 | 2001-05-10 | EP1269505B1 | 2005-10-26 | MARTICH, Mark, E. |
| A new board mounted electromechanical device (103) is provided that mounts to a relay substrate (122) to form a low profile reed relay (100). The reed relay (103) is electrically connected to the electrical contacts (128) via a signal traces (130) and additional electrical traces (130) located on the same side of the relay substrate (122) which connect to the relay"s signal and shielding. Additional traces (130) on both sides of the signal traces of the reed relay (103) provide a co-planar waveguide to maintain the desired impedance of the signal path. The reed relay (103) is mounted in an inverted manner into a cut-out (134) in the main circuit board (132) so that the other portion of the need relay (103) itself is sits within the cut-out (134) in the main circuit board (132). As a result, the need relay component (103) is recessed below the surface of the main circuit board (132) resulting in an overall low profile circuit board. | ||||||
| 29 | A LEAD-LESS SURFACE MOUNT REED RELAY | EP01973107.4 | 2001-09-18 | EP1325505A2 | 2003-07-09 | BEIGEL, John; SAMUEL, Gunther; BOYINGTON, john, Jr. |
| A reed relay or reed sensor device (102) that is substantially lead-less and has minimal inductance can be manufactured as an individual unit or as a plurality of units. The reed relay or reed sensor device (102) comprises a substrate (110) that path has a plurality of contacts (130, 132, 134) on the exterior of the device connected to contacts on the interior of the device capable of maintaining a signal pathway to the internal components of the device. The internal components further comprise a reed switch (100), an electrical shield (148), a coil bobbin, and a coil of electrical wire (120) which when energized is capable of effectuating switching in the reed relay. | ||||||
| 30 | Electromechanical switching device package with controlled impedance environment | EP99119173.5 | 1999-10-06 | EP1037236A3 | 2001-01-17 | Martich,Mark E. |
A reed switch package (100) is disclosed that includes a reed switch (111) with at least one electrical signal path (106). A cylindrical ground shield (110) is provided about the reed switch (11A). Ground terminals (108) are connected to opposing sides of the ground shield (110) so that the ground terminals (108) are on opposing sides of the signal terminal (106) and lie in the same plane. The reed switch (111) resides on a support substrate (222). An electrically conductive signal via (134) extends through the main body (212) and connects to the signal terminal (106). Ground vias (134) extend through the main body (212) and respectively connect to the ground terminals (108). The grounds vias (134) are on opposing sides of the signal via (134) and lie in the same plane as the signal via (14). The signal and ground via (134) exit at the bottom of the main body (212) and are connected to a circuit via solder balls (224) to provide a compact surface mount package with a controlled impedance environment. |
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| 31 | 電磁継電器 | JP2017045836 | 2017-03-10 | JP2018152171A | 2018-09-27 | 田中 良樹; 小野 勉; 今田 淳; 戸來 賢一; 鈴木 雄太 |
| 【課題】電磁継電器を製造するためのコストを抑制しつつ、リフロー加熱処理時の筐体内の圧力の上昇を抑制することができる電磁継電器を実現する。 【解決手段】本発明の一形態に係る電磁継電器1は、電磁継電器本体3が搭載されるベース部4と、電磁継電器本体3を覆うカバー部5と、を有する筐体2を備え、筐体2の内部の圧力が予め設定された圧力以下の場合に当該筐体2が密閉状態とされる電磁継電器であって、筐体2の内部の圧力が予め設定された圧力以下の場合にカバー部5とベース部4とは突き合わされ、カバー部5とベース部4との突き合わせ部から電磁継電器1の外部まで連通する連通路5eを備える。 【選択図】図1 |
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| 32 | リードスイッチリレー | JP2016556943 | 2014-03-11 | JP6392368B2 | 2018-09-19 | ▲ゴン▼ 蜀剛 |
| 33 | リードスイッチリレー及び集積回路基板 | JP2016556923 | 2014-03-11 | JP6363725B2 | 2018-07-25 | ▲ゴン▼ 蜀剛 |
| 34 | リードスイッチリレー | JP2016556943 | 2014-03-11 | JP2017509122A | 2017-03-30 | 蜀剛 ▲ごん▼ |
| リードスイッチリレーであって、PCB台座(1)と、PCB台座に電気接続され、表面パッキングプロセスによりPCB台座に実装される制御アセンブリー(2)と、を含み、制御アセンブリーは、PCB台座に設けられる空芯コイル(21)と、空芯コイル内に設けられるリードスイッチ(22)と、空芯コイルの外周表面にセットされる遮蔽層(23)と、を含み、リードスイッチには、ピンがあり、遮蔽層は、リードスイッチのピンに電気接続される。リードスイッチリレーは、表面パッキングプロセスにより、制御アセンブリーとPCB台座に対する組み立てを行って、リードスイッチの位置公差と精度を保証し、製品生産の完全機械化を実現し、生産効率を向上させ、大規模生産のニーズを満たし、更に経済的効果を向上させた。【選択図】図2 | ||||||
| 35 | Low cross-sectional profile current drive relay for an integrated circuit tester | JP2001554361 | 2001-01-16 | JP2003521090A | 2003-07-08 | ヴォールファース・ポール・デイナ; エリス・トラヴィス・スコット; ヘイル・ロバート・アール |
| (57)【要約】 リレー（７０）が、ガラス管（７２）中に入っている接点（７３）を有している。 その管（７２）を囲繞するコイル（７６）とスイッチ（６６）がリレー（７０）の二つの端子（７７）の間で並列接続されている。 電流源が電流をコイル（７６）とスイッチ（６６）に供給する。 スイッチ（６６）が開成されたときには、ほとんどすべての電流がコイル（７６）を通して流れ、コイル（７６）が十分な量の磁束を生成してリレー接点（７３）を閉じる。 スイッチ（６６）が閉成されたときには、コイル（７６）から十分な量の電流を分流し、それが生成する磁束を接点（７３）を閉成しておくのに必要なレベルよりも少なくする。 コイル（７６）がほとんど小数の巻回しか必要としないような大きさに電流源が構成され、それによって、リレー（７０）を比較的に扁平にすることができる。 コイル（７６）は、管（７２）を囲繞する絶縁基板（１２８）に埋め込められた導体（１４０）によって構成される。 | ||||||
| 36 | High insulating stud and printed circuit board having the same | JP2000193400 | 2000-06-27 | JP2002008759A | 2002-01-11 | SHIMIZU HIROYUKI; UCHIDA MINORU; CHIKAMATSU SEI |
| PROBLEM TO BE SOLVED: To provide a high insulating stud capable of increasing the mounting density while ensuring high insulating characteristic and high pressure tightness, reducing the stray capacitance, and preventing fracture of a glass tube enclosing a reed switch, and to provide a printed circuit board mounted with the same. SOLUTION: This high insulating stud comprises a first pillar conductive terminal having a first height, a second pillar conductive terminal arranged with an interval to the first conductive terminal and having a second height lower than the height of the first conductive terminal, and an insulating seating, the top of the first conductive terminal has a first groove upwardly opened, and a second groove intersecting the first groove and shallower than the first groove, and the top of the second conductive terminal has a third groove upwardly opened in parallel with the first groove, with a bottom of a height approximately the same as the bottom of the first groove. COPYRIGHT: (C)2002,JPO | ||||||
| 37 | Electromechanical switching device package equipped with controlled impedance environment | JP28783199 | 1999-10-08 | JP2000268692A | 2000-09-29 | MARTICH MARK E |
| PROBLEM TO BE SOLVED: To provide a reed switch package including a reed switch equipped with at least one electrical signal path. SOLUTION: A cylindrical ground shield 110 is provided around a reed switch. Ground terminals 108 are connected to both sides of the ground shield 110, and therefore the ground terminals 108 are on both sides of and in the same plane as signal terminals 106. The reed switch 111 is on a support substrate. A conductive signal path is connected to the signal terminals 106 through a main body. Ground paths are connected to the ground terminals 108, respectively, through the main body. The ground paths are on both sides of and in the same plane as the signal path. The signal path and the grounding paths go out of the main body at its lower part and connected to a circuit by means of solder balls, thus providing a small-sized surface-mounted package equipped with a controlled impedance environment. | ||||||
| 38 | Method for forming reed relay and coil bobbin | JP18592096 | 1996-07-16 | JPH1031950A | 1998-02-03 | ENDO TOMOHISA; MOTOYAMA TSUTOMU |
| PROBLEM TO BE SOLVED: To provide a reed relay of such a structure that an electrostatic shield cylinder is interposed between a reed switch and a coil, with which it is possible to increase the coil occupation volume, heighten the magnetomotive force, and reduce the cost. SOLUTION: A reed relay concerned includes a coil bobbin 5 equipped with an electrostatic shield cylinder 6 made of metal and a flange 51 made of resin installed at each end of the shield cylinder 6, wherein the coil bobbin 5 is structured so that the two ends of the cylinder 6 are insert molded in the flanges 51, and a coil 2 is wound on the cylinder portion exposed between the flanges 51 either directly or with an insulative film interposed, and a reed switch 7 is inserted through the cylinder 6 which is left open in the central section of the flange part 51. | ||||||
| 39 | Reed relay and switch matrix device using the same | JP8709891 | 1991-09-27 | JP2544121Y2 | 1997-08-13 | 秀行 乘松 |
| 40 | Reed relay and Suitsuchi matrix device using the same | JP8709891 | 1991-09-27 | JPH0531078U | 1993-04-23 | 秀行 乘松 |
| (57)【要約】 【目的】複数測定器と複数ＤＵＴとの接続切替えを、簡単な構成でかつ簡易に行う。 【構成】第１ガード・パイプ１５はリード・スイッチ１
１の一方端から接点部近傍までを被覆し、第２ガード・ パイプ１６は第１ガード・パイプと絶縁状態で、リード・スイッチの他方端から少なくとも前記第１ガード・パイプの先端部位までを被覆している。 リード・リレーがオン状態であるときは、ガード接続用スイッチｓｗ１もオン状態となり、第１，第２ガード・パイプ１５，１６ がリード・リレーの信号ラインと同一電位となる。 一方、リード・リレーがオフ状態であるときは、ガード接続用スイッチ１１もオフ状態となる。 この場合には、通常、該リード・リレーの両端電圧は異なり、第１，第２ の各ガード・パイプ１５，１６によりリード・スイッチの測定器側とＤＵＴ側との信号ラインのガードが行われる。 |
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