序号 专利名 申请号 申请日 公开(公告)号 公开(公告)日 发明人
61 JPS49102245A - JP14461773 1973-12-27 JPS49102245A 1974-09-27
1430399 Retractive switches BOWMAR INSTRUMENT CORP 20 Dec 1973 [2 Jan 1973] 59172/73 Heading H1N A keyboard switch assembly comprises pushbuttons 22 each of which actuates a resilient, conductive switch device 14 from a rest position to a deflected position in which it interconnects co-planar conductors such as 30-3, 32, Fig. 5, carried by, for example by being printed on, an insulating board 12, at least one other conductor being provided on the board spaced from and co-planar with the first-mentioned conductors and extending under the switch device but having no electrical connection therewith in either of its positions. As shown, the switch device is a snap-acting dome of, for example, square, triangular or circular shape and formed with dimples or projections 64, 66 on its periphery and at the centre thereof respectively, which form contact portions for engaging the conductors. The switching devices are located in apertures 74 in an insulating sheet 16 superimposed on the board 12 and over which is laid a flexible insulating cover sheet 18. The assembly is completed by a cover member 20 which is apertured at 76 for retention and location of the push-buttons. The latter have X-shaped projections 78 which act through the sheet 18 on the switching devices. The conductors and parts thereof which are not engaged by a particular switching device may be covered with an insulating layer (56), Fig. 7 (not shown), and the contact portions of the conductors may be plated with gold on nickel. Fig. 11 shows a modification in which an insulating sheet 82 extends between the sheet 16 and board 12 and has apertures such as 86, 88 which expose the contact portions of the conductors for engagement by the dimples 641, 66 of the switching device 141.
62 NANOELECTROMECHANICAL DEVICES WITH METAL-TO-METAL CONTACTS US15945792 2018-04-05 US20180294108A1 2018-10-11 Kwame Amponsah
Nanoelectromechanical systems (NEMS) devices/switches and methods for implementing and fabricating the same with conducting contacts are provided. A nanoelectromechanical system (NEMS) switch can include a substrate; a source cantilever formed over the substrate and configured to move relative to the substrate; a drain electrode and at least one gate electrode formed over the substrate; wherein the source cantilever, drain and gate electrodes comprises a metal layer affixed to a support layer, at least a portion of the metal layer at the contact area extending past the support layer; and an interlayer sandwiched between the support layer and substrate.
63 Low-travel key mechanisms using butterfly hinges US15342715 2016-11-03 US09916945B2 2018-03-13 James J. Niu; Keith J. Hendren; Craig C. Leong; Thomas W. Wilson, Jr.; Bruce E. Berg; John M. Brock
A key mechanism including one or more butterfly hinges. Each butterfly hinge may include a double wing design operative to move between a depressed position and non-depressed position. Hinged coupling mechanisms couple respective arms of the wings together. Additionally or alternatively, a key mechanism can include one or more half-butterfly hinges. Each half-butterfly hinge includes a double wing design operative to move between a depressed position and non-depressed position. A hinged coupling mechanism couples one set of corresponding arms of the wings together, while the other set of corresponding arms are not coupled together.
64 METHOD FOR MANUFACTURING LIGHTING BUTTON KEY US15331756 2016-10-21 US20170330703A1 2017-11-16 Young Ju Lee; Chang Hyeon Noh; Hye Kyung Kim; Dae Ig Jung; Keon Soo Jin; Hak Soo Kim; Won Jo Joo
A method for manufacturing a lighting button key is provided. The method includes forming a button body by processing a metal plate, attaching a thin film to the button body and performing double etching on a rear surface of the button body to process a symbol pattern. Additionally, the method includes press-forming the rear surface of the button body and an injection material of a transparent or translucent material into the rear surface of the button body to perform injection molding.
65 Package MEMS switch and method US14368771 2013-12-17 US09691579B2 2017-06-27 Qing Ma; Johanna Swan; Valluri Rao; Feras Eid
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.
66 PACKAGE MEMS SWITCH AND METHOD US14368771 2013-12-17 US20160020051A1 2016-01-21 Qing Ma; Johanna Swan; Valluri Rao; Feras Eid
An electronic device and methods including a switch formed in a chip package are shown. An electronic device and methods including a switch formed in a polymer based dielectric are shown. Examples of switches shown include microelectromechanical system (MEMS) structures, such as cantilever switches and/or shunt switches.
67 LOW-TRAVEL KEY MECHANISMS USING BUTTERFLY HINGES US14499209 2014-09-28 US20150243457A1 2015-08-27 James J. Niu; Keith J. Hendren; Craig C. Leong; Thomas W. Wilson, JR.; John M. Brock
A key mechanism including one or more butterfly hinges. Each butterfly hinge may include a double wing design operative to move between a depressed position and non-depressed position. Hinged coupling mechanisms couple respective arms of the wings together. Additionally or alternatively, a key mechanism can include one or more half-butterfly hinges. Each half-butterfly hinge includes a double wing design operative to move between a depressed position and non-depressed position. A hinged coupling mechanism couples one set of corresponding arms of the wings together, while the other set of corresponding arms are not coupled together.
68 Keypad for electronic device and method for manufacturing the keypad US12882316 2010-09-15 US08507816B2 2013-08-13 Yoon-Hee Lee; Seung-Chang Baek; Young-Ki Kim; Yong-Wook Hwang; Jun-Young Lee; Sung-Wook Kang
A keypad for an electronic device having metallic texture has rigidity and elasticity equivalent to those of stainless steel. The keypad is manufactured and includes a metal alloy board, a keypad body manufactured by primarily thermal-treating the metal alloy board to a rigidity enough to be molded and molding the primarily thermal-treated metal alloy board with a press, a button portion formed by secondarily thermal-treating the keypad body to cure the keypad body and etching the secondarily thermal-treated keypad body by means of etching processing, and urethane rubber and a silicon pad attached to a back surface of the keypad body which has undergone anodizing processing and various colorations.
69 Transparent conductive film, method for production thereof and touch panel therewith US13030629 2011-02-18 US08467006B2 2013-06-18 Tomotake Nashiki; Hideo Sugawara
A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat layer interposed between the transparent film substrate and the transparent conductor layer; wherein: the transparent conductor layer is patterned; and a non-patterned portion not having the transparent conductor layer has the at least one undercoat layer.
70 Transparent conductive film, method for production thereof and touch panel therewith US12015006 2008-01-16 US08462278B2 2013-06-11 Tomotake Nashiki; Hideo Sugawara
A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat layer interposed between the transparent film substrate and the transparent conductor layer; wherein: the transparent conductor layer is patterned; and a non-patterned portion not having the transparent conductor layer has the at least one undercoat layer.
71 Legend highlighting US12814113 2010-06-11 US08451146B2 2013-05-28 Peter H. Mahowald; Omar Sze Leung
A method for manufacturing keycap includes applying a first coating layer on a surface of a keycap layer, applying a second coating layer on top of the first coating layer, etching at least a portion of the first coating layer to a first depth to form a first etched area, and etching at least a portion of the first etched area to a second depth to form a second etched area.
72 Method of fabricating a keypad structure having an engraved pattern, keypad structure, and keypad semi-structure US13161510 2011-06-16 US20120211342A1 2012-08-23 Ko-Ju Chen
A method of fabricating a keypad structure having an engraved pattern, in which a keycap layer including a hard coating as a top layer is provided. The keycap layer is punched to form at least a keycap component utilized to assembly a keypad semi-product. The keypad semi-product is kept in a storage place. A pattern is provided. After a demand of the pattern is confirmed, the keypad semi-product is fetched and the hard coating is partially removed to form the confirmed pattern to complete a keypad structure. A keypad structure and a keypad semi-structure are also provided.
73 KEYPAD ASSEMBLY AND MATHOD FOR MAKING THE SAME US12631914 2009-12-07 US20100175976A1 2010-07-15 HSU-TANG CHEN; WEN-TE LAI; HSIANG-JUNG SU; LIANG XIONG; KAI-MING GUO; YOU-LI LIU; JIAN-HUA WU; ZHAO-LONG ZHENG
A keypad assembly, comprising: a main body made of metal, the main body defining a plurality of slots and the slots enclosing a plurality of pressing buttons thereon, each pressing button defining at least one symbol slot, the main body having a contact surface and a operating surface; and a light-transmissive filling member, the filling member defining a plurality of protruding strips and the protruding strips enclosing a plurality of button areas thereon, each button area having at least one symbol block protruding therefrom, the filling member bonding to the contact surface with the protruding strips and the symbol blocks respectively engaging in the corresponding slots and the symbol slots. A method for making the present keypad assembly is also described.
74 TRANSPARENT CONDUCTIVE FILM, METHOD FOR PRODUCTION THEREOF AND TOUCH PANEL THEREWITH US12015006 2008-01-16 US20080176042A1 2008-07-24 Tomotake NASHIKI; Hideo SUGAWARA
A transparent conductive film includes: a transparent film substrate; a transparent conductor layer provided on one or both sides of the transparent film substrate; and at least one undercoat layer interposed between the transparent film substrate and the transparent conductor layer; wherein: the transparent conductor layer is patterned; and a non-patterned portion not having the transparent conductor layer has the at least one undercoat layer.
75 Keyboard structure US11079989 2005-02-25 US07145092B2 2006-12-05 Marko Tuhkala
A keyboard is disclosed comprising a rigid base member including at least a first surface; the base member including electrical circuitry structures, which structures define a plurality of connection zones on the first surface; the first surface of the base member including a plurality of grooves in order to connect at least some connection zones; a plurality of flexible, resilient domes covering said base member and being aligned with the connection zones on the first surface of the base member; the underside of each of said domes including a conductive surface that is capable of completing an electrical connection at said connection zone when said dome is deflected downwardly against said circuitry structures; wherein each connection zone communicates with at least one of said grooves in such a manner that the air present under said dome is forced into one of said grooves when said dome is deflected downwardly.
76 KEYBOARD STRUCTURE US11079989 2005-02-25 US20060191780A1 2006-08-31 Marko Tuhkala
A keyboard is disclosed comprising a rigid base member including at least a first surface; the base member including electrical circuitry structures, which structures define a plurality of connection zones on the first surface; the first surface of the base member including a plurality of grooves in order to connect at least some connection zones; a plurality of flexible, resilient domes covering said base member and being aligned with the connection zones on the first surface of the base member; the underside of each of said domes including a conductive surface that is capable of completing an electrical connection at said connection zone when said dome is deflected downwardly against said circuitry structures; wherein each connection zone communicates with at least one of said grooves in such a manner that the air present under said dome is forced into one of said grooves when said dome is deflected downwardly.
77 Metallic keys US09427622 1999-10-27 US06321441B1 2001-11-27 Brian Davidson; Jeff Mabbot
A method of forming a key comprising the steps of: depositing an electroless metallic layer on an upper surface of a substrate; removing the metallic layer from selected portions to expose the substrate, said exposed portions of the substrate defining the image of an indicia; depositing a second metallic layer on the remaining portions of the first metallic layer by electrolysis; and coupling a lower surface of the substrate to an element for actuating a switch. A device for tactile actuation by a user, having an element, for activating a switch, coupled to a body supporting a metallic layer for tactile actuation by a user, wherein the metallic layer extends over an upper surface of the body and wherein at least one aperture extends through the metallic layer to said upper surface thereby defining at least one visible indicia.
78 Metallic keys US09884107 2001-06-20 US20010032779A1 2001-10-25 Brian Davidson; Jeff Mabbot
A method of forming a key comprising the steps of: depositing an electroless metallic layer on an upper surface of a substrate; removing the metallic layer from selected portions to expose the substrate, said exposed portions of the substrate defining the image of an indicia; depositing a second metallic layer on the remaining portions of the first metallic layer by electrolysis; and coupling a lower surface of the substrate to an element for actuating a switch. A device for tactile actuation by a user, having an element, for activating a switch, coupled to a body supporting a metallic layer for tactile actuation by a user, wherein the metallic layer extends over an upper surface of the body and wherein at least one aperture extends through the metallic layer to said upper surface thereby defining at least one visible indicia.
79 Keyboard with metal cover and improved switches US879284 1986-06-27 US4771139A 1988-09-13 Gregory L. DeSmet
An improved keyboard is provided with a flexible metal cover, normally closed switches, and multiple throw switches. The metal cover is made flexible in the area of each key or switch by the provision of grooves in the metal surrounding each flexible portion. The normally closed and multiple throw switches include pellets which transmit the actuating force on a key or switch through a substrate on which a switch is mounted. The device may be configured in such a way that the pellet will push the normally closed contacts of a switch out of contact, or the pellet or pellets may mechanically link a stacked set of switches in order to provided ganged, multiple throw operation.
80 Touch selection pad and method of manufacture US40239 1987-04-20 US4731694A 1988-03-15 Gunther Grabner; Dietrich Stephani
A touch selection pad contains a matrix of tactile sensors each of which contains a composite material with a pressure and direction-dependent electric conductivity and a dielectric material forming a capacitor. These are provided with column electrodes and row electrodes. When touched, each of the sensors creates a series circuit comprising a resistor formed of the composite material and a capacitor formed from the dielectric having a capacitance of preferably at least 50 pF. In this matrix of tactile sensors, the pressure-dependent resistance together with the associated fixed capacity serves as the measuring variable. The touch pad due to the small spacing between the sensors has a high resolution. It can be produced in a simple manner by sequentially depositing layers on a metalized carrier by means of a thin-film technique. The row and column electrodes can be etched out of a metalized plastic cover layer and a metalized carrier, respectively, by micro structuring techniques.
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