| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 61 | JPS6247355B2 - | JP6634180 | 1980-05-19 | JPS6247355B2 | 1987-10-07 | UIRUBAA KURARENSU PARUMAA; FURANKU REONAADO RASUBII |
| 62 | JPS6239525B2 - | JP13580179 | 1979-10-19 | JPS6239525B2 | 1987-08-24 | KOIZUMI AKIO; NAKAZAWA HIROSHI; ENDO AKIRA |
| 63 | Step-up transformer | JP21619884 | 1984-10-17 | JPS6195504A | 1986-05-14 | OKADA SHIGERU |
| PURPOSE:To reduce leakage inductance by winding primary and secondary windings so that they are generally placed one above the other in shape, thereby raising the coupling factor. CONSTITUTION:After a secondary winding 2 and a primary winding 1 are sequentially inserted into the winding groove 5 in a lower magnetic core 3 and fixed, an upper magnetic core 4 is fixed, and the terminal of the secondary winding 2 is soldered to the copper foil terminal 7 of a terminal assembly 6, thereby constructing a step-up transformer. The respective windings 1, 2 in the winding groove 5 are constructed so that the wire width of the primary winding 1 and that of the secondary winding 2 are substantially equal. This can significantly improve the coupling factor. As a result, leakage inductance greatly decreases, and thus the step-up ratio of the step-up transformer can be raised, thereby improving the transformer efficiency. | ||||||
| 64 | Transformer | JP10960283 | 1983-06-16 | JPS60715A | 1985-01-05 | HINO TOSHIYUKI |
| PURPOSE:To contrive thinning of the title transformer by a method wherein a primary coil and a secondary coil are spirally formed on both sides of an insulated plate having a through hole in the center part, and after an insulating film has been covered, a magnetic material is formed thereon. CONSTITUTION:A through hole 1a is provided in the center part of a round and thin insulated plate 1. A spiral primary coil conductor 2 is formed by patterning on the upper surface of the round insulated plate 1, a spiral secondary coil conductor 3 is formed by patterning on the lower surface of the insulated plate 1, and then electrode parts 2a, 2b, 3a and 3b are provided. After primary lead-out wires 2c and 2d have been connected to the electrode parts 2a and 2d, and secondary lead-out wires 3c and 3d have been connected to electrode parts 3a and 3b, an insulating film 4 is formed on the whole surface. Then, a magnetic material 5 whereon powdery magnetic material bonded by binder is applied is formed on the upper surface of the insulating film 4. As a result, the thickness of the entire transformer can be reduced to 0.5mm. or thereabout. | ||||||
| 65 | Transmission device | JP7029182 | 1982-04-28 | JPS58188108A | 1983-11-02 | TAKATANI MINORU |
| PURPOSE:To obtain a transmission device having various passing bands by such an arrangement wherein a ferrite calcined body of high magnetic permeability and that of low permeability are arranged in layers and integrated together and at least one piece of conductor is embedded therein, and the magnetic permeability, thickness, size, relative arrangement, relative dimension, etc. of the calcined body are properly selected. CONSTITUTION:A transmission device is formed by such a method that a magnetic body 1 of high magnetic permeability and another magnetic body 2 of low permeability are arranged in layers and a primary winding conductor 3 starting from PS and terminating at PF and a secondary winding conductor 4 starting from SS and terminating at SF are embedded therein. In this composition, as the magnetic bodies 1 and 2, ferrite calcined bodies are used respectively. Assuming that frequency characteristics of the magnetic bodies 1 and 2 are 100k-10MHz and 1M-100MHz, it is possible to obtain a transmission device of wide band having passing bands of 100kHz-100MHz. By this arrangement, various transmission devices having desired passing or attenuation bands can be obtained. | ||||||
| 66 | Device for increasing parallel inductance of transformer | JP9767180 | 1980-07-18 | JPS5618402A | 1981-02-21 | EMIIRU MORURE; DANIERU REINE; JIYANNPIEERU SUZONI |
| 67 | Induction element | JP9075980 | 1980-07-04 | JPS5615016A | 1981-02-13 | EBUARUTO SHIYUMITSUTO; HAINTSU PUFUITSUEMAIAA |
| 68 | MAGNETIC COMPONENT | US15966241 | 2018-04-30 | US20180336986A1 | 2018-11-22 | Zhangnan XIN; Jinping ZHOU; Liangde HE |
| There is disclosed a magnetic component which includes a first magnetic pole extending in a first direction and having an air gap provided therein, a second magnetic pole extending in the first direction, a cover plate extending in a second direction perpendicular to the first direction and connected with an end of the first magnetic pole and an end of the second magnetic pole, a protrusion formed on and at least partially surrounding the first magnetic pole, and a winding wound around the first magnetic pole at the air gap and having a lead supported by the protrusions such that a clearance is formed between the winding and the first magnetic pole. | ||||||
| 69 | Magnetic devices and methods for manufacture using flex circuits | US14702522 | 2015-05-01 | US09959967B2 | 2018-05-01 | Check F. Lee |
| Magnetic devices, and associated methods of manufacture, using flex circuits. Conductive flex circuit traces, or combinations of such traces with conductive printed circuit board or other substrate traces, form windings around toroidal ferromagnetic cores. Bending the flex circuit into a partial loop or a full loop forms partial or full windings respectively. Bonding or flow soldering electrically connects the windings together and to a printed circuit board or other substrate. The methods yield transformers with high conversion efficiency, are compatible with conventional printed circuit boards and readily available high-volume assembly equipment, and avoid the higher cost of manually made windings. | ||||||
| 70 | ARRAY OF INTERLEAVED 8-SHAPED TRANSFORMERS WITH HIGH ISOLATION BETWEEN ADJACENT ELEMENTS | US14530068 | 2014-10-31 | US20160125995A1 | 2016-05-05 | Miena ARMANIOUS; Darryl JESSIE; Thomas Andrew MYERS |
| An apparatus configured to isolate a direct current component voltage of a first circuit from a direct current component voltage of a second circuit in which the apparatus includes a first conductor and a second conductor. The first conductor has a first portion disposed to substantially enclose a first area, a second portion disposed within the first area, a third portion disposed to substantially enclose a second area, and a fourth portion disposed within the second area, the second area lacking an intersection with the first area. The second conductor is configured to be magnetically coupled to the first conductor and has a fifth portion disposed between the first portion and the second portion and a sixth portion disposed between the third portion and the fourth portion. | ||||||
| 71 | IMPROVED STRUCTURE OF SMD (SURFACE MOUNT DEVICE) TYPE SIGNAL TRANSFORMER | US14161709 | 2014-01-23 | US20150206649A1 | 2015-07-23 | KUAN-HSIUNG WEI |
| An improved structure of an SMD (Surface Mount Device) includes a magnetic core and a plurality of conductive wire. The magnetic core has two ends each forming a connection portion and the connection portion has a side forming at least four soldering sections. The conductive wires are wound around the magnetic core and two ends of each of the conductive wires are respectively soldered to the soldering sections. The conductive wires are subjected to a mechanized automatic winding operation. The magnetic core is an SMD core. With such an arrangement, the volume of the signal transformer can be greatly reduced. Further, an advantage of human-labor-free manufacture can be achieved with the mechanized winding operation and also, the quality of the signal transformer is made more stable to increase the throughput. Advantages including stable electric characteristics, fully automatized manufacture, and high throughput, can be achieved. | ||||||
| 72 | VERTICAL-COUPLING TRANSFORMER WITH AN AIR-GAP STRUCTURE | US13778191 | 2013-02-27 | US20140240072A1 | 2014-08-28 | Je-Hsiung Lan; Chi Shun Lo; Jonghae Kim; John H. Hong |
| In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure. | ||||||
| 73 | TRANSFORMER INCLUDING A CONTACTLESS SIGNAL CONNECTION | US14129852 | 2012-06-14 | US20140145811A1 | 2014-05-29 | Carl-Gustaf Carlin |
| An improved transformer for use in a power tool, wherein the power tool includes a stationary body and a shaft which is movable relative to the body. The transformer includes a stator which is fixed relative to the body, and at least one stator winding. The transformer also includes a rotor which is movable with the shaft, and at least one rotor winding. A magnetic field is shared by the at least one stator and rotor windings, and is used for creating a contactless signal connection between the body and an at least one sensor of the shaft. The stator and the rotor are arranged in a mutual geometrical relationship such that the contactless signal connection is provided for different positions in both an axial direction and a rotational direction of the shaft. | ||||||
| 74 | MODULAR JACK HAVING TRANSFORMER WITH WINDING WIRES AND METHOD OF MAKING THE SAME | US13962155 | 2013-08-08 | US20140045380A1 | 2014-02-13 | HUAN CHEN |
| An electrical connector (500) includes a transformer (100) including a magnetic core (3), a first wire group (1), and a second wire group (2). The magnetic core has a left half (31), a right half (32), and an opening (30). The first and second wire groups each have four wires with different colors. Each wire has a first end, a second end, and a central portion. The central portion of the first wire group is only wound around the left half The central portion of the second wire group is only wound around the right half | ||||||
| 75 | Composite electronic device | US12832769 | 2010-07-08 | US08514539B2 | 2013-08-20 | Masao Asakawa; Tomokazu Ito; Makoto Morita; Atsushi Hitomi; Yasuhiro Hirobe; Kensaku Asakura |
| The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and spiral conductors formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of gap electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the gap electrodes, and a gap protection layer provided on at least one of the upper side and lower side of the gap, the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. The gap protection layer is made of resin including magnetic powder and carbon. | ||||||
| 76 | TRANSMISSION-LINE TRANSFORMER IN WHICH SIGNAL EFFICIENCY IS MAXIMISED | US13824012 | 2011-09-07 | US20130187745A1 | 2013-07-25 | Jong Hoon Park; Chang Kun Park |
| Provided is a transmission line transformer having increased signal efficiency. The transmission line transformer is formed on an integrated circuit (IC), wherein a first transmission line disposed in one direction. Second and third transmission lines have same length direction as the first transmission line and are spaced apart from each other in a lateral direction above or below the first transmission line. Accordingly, an area of the first transmission line and areas of the second and third transmission lines, which face each other, are increased, thereby improving a coupling factor. Also, since a secondary transmission line is divided into two regions and uses the second and third transmission lines that have narrower widths than the first transmission line, parasitic capacitance components generated between the first through third transmission lines and a semiconductor substrate may be decreased. | ||||||
| 77 | Asymmetric differential inductor | US13222231 | 2011-08-31 | US08493168B2 | 2013-07-23 | Ming-Fan Tsai; Kuan-Yu Chen; Bo-Shiang Fang; Hsin-Hung Lee |
| An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout. | ||||||
| 78 | Composite electronic device, manufacturing method thereof, and connection structure of composite electronic device | US12568911 | 2009-09-29 | US08422190B2 | 2013-04-16 | Tomokazu Ito; Yasuhiro Hirobe; Atsushi Hitomi; Yuji Terada; Kensaku Asakura; Takeshi Urano |
| The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and conductor patterns formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the electrodes, and the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. | ||||||
| 79 | Semiconductor device including an inductor that is inductively coupled to another inductor | US12662441 | 2010-04-16 | US08350357B2 | 2013-01-08 | Masayuki Furumiya; Yasutaka Nakashiba |
| A first inductor is connected to a transmission circuit. A second inductor is connected to a reception circuit, and is inductively coupled to the first inductor. At least part of the first inductor is formed with a first bonding wire. The first bonding wire has two ends connected to a first connecting terminal and a third connecting terminal. At least part of the second inductor is formed with a second bonding wire. The second bonding wire has two ends connected to a second connecting terminal and a fourth connecting terminal. | ||||||
| 80 | ASYMMETRIC DIFFERENTIAL INDUCTOR | US13222231 | 2011-08-31 | US20120299683A1 | 2012-11-29 | Ming-Fan Tsai; Kuan-Yu Chen; Bo-Shiang Fang; Hsin-Hung Lee |
| An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout. | ||||||
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