| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 141 | METHOD FOR DETECTING A FAULT IN AN HVAC SYSTEM | PCT/US2005046214 | 2005-12-21 | WO2006073815A3 | 2009-04-16 | KANG PENGJU; FARZAD MOHSEN; FINN ALAN; SADEGH PAYMAN |
| A bypass factor of an evaporator is used to indicate when an air filter of an HVAC is clogged. The bypass factor represents the amount of air that is bypassed without direct contact with the evaporator. As the air filter clogs, the bypass factor decreases. The bypass factor can also be used for early detection of clogging of the air filter. A first bypass factor is calculated by using the temperature measurements, and a second bypass factor is calculated by using the airflow rate of the air. The difference between the two bypass factors determines the error. An increase in the error indicates that the air filter is clogged. A coefficient of performance of the evaporator can also be calculated to detect if the air filter is clogged. A decrease in the coefficient of performance indicates that the air filter is clogged. | ||||||
| 142 | SYSTEMS AND METHODS FOR COOLING ELECTRONICS COMPONENTS EMPLOYING VAPOR COMPRESSION REFRIGERATION | PCT/EP2006065425 | 2006-08-17 | WO2007023130A2 | 2007-03-01 | KEARNEY DANIEL; MARNELL MARK ANTHONY; PORTER DONALD WAYNE |
| Systems and Methods of cooling heat generating electronics components are provided employing vapor compression refrigeration. In one embodiment, the vapor compression refrigeration system includes a condenser, at least one expansion structure, at least one evaporator, and a compressor coupled in fluid communication to define a refrigerant flow path, and allow the flow of refrigerant therethrough. The at least one evaporator is coupled to the at least one heat generating electronics component to facilitate removal of heat produced by the electronics component. At least a portion of the at least one expansion structure is coated with a polytetrafluorethylene in the refrigerant flow path for inhibiting accumulation of material thereon. The polytetrafluorethylene coating has a thickness sufficient to inhibit accumulation of material in a pressure drop area of the expansion structure without significantly changing a pressure drop characteristic of the pressure drop area. | ||||||
| 143 | 制冷循环装置 | CN201420321403.1 | 2014-06-17 | CN204027110U | 2014-12-17 | 加藤央平; 冈崎多佳志; 伊东大辅; 宇贺神裕树; 前山英明; 铃木康巨 |
| 制冷循环装置(100)具有：制冷剂回路，至少具有压缩机(1)、冷凝器、膨胀装置(3)及蒸发器，将乙烯类氢氟碳化合物或包括乙烯类氢氟碳化合物的混合物作为制冷剂使用；控制装置(52)，控制压缩机(1)的转速及膨胀装置(3)的开度；堵塞量检测装置(存储装置51及计算装置53)，检测膨胀装置(3)的堵塞量；聚合量推定装置(过滤器3a、3b)，用于使膨胀装置(3)发生堵塞的物质中的由所述制冷剂的聚合生成的生成物所占的量的计算。 | ||||||
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