| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 181 | Electro-conductive pressure-sensitive adhesive tape, an electronic member, and a pressure-sensitive adhesive | US14553532 | 2014-11-25 | US09982170B2 | 2018-05-29 | Shu Sasaki; Jyunichi Nakayama; Rie Yuto; Yoshio Terada |
| An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 μm or more to about 50 μm or less and at least one further peak top existing in a particle size range from about 1 μm or more to about 12 μm or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3. | ||||||
| 182 | Adhesion Promoting System, and Ink Compositions Thereof | US15325372 | 2015-07-09 | US20170183517A1 | 2017-06-29 | Mahesh SUBRAMANIYAM; Michael MICHALCZYK |
| The present invention relates to adhesion promoting composition comprising: (a) an organotitanate adhesion promoter; and (b) at least one surface active agent; and (c) optionally comprises at least one solvent; wherein the surface active agent comprises a compound selected from the group comprising a surfactant and a polymeric surfactant; wherein the adhesion promoting composition imparts adhesion on a polymer film even if: (i) quality of the film substrate has degraded, (ii) the film substrate has inconsistent surface treatments across the films. In second aspect, the present invention relates to ink compositions comprising the adhesion promoting composition.In third aspect, the present invention relates to a method for improving the adhesion of an ink composition to a substrate, wherein the ink composition comprises adhesion promoting composition.In fourth aspect, the present invention relates to a substrate having improved adhesion of an ink composition, wherein the ink composition comprises adhesion promoting composition. | ||||||
| 183 | Heat-expandable microspheres, process for producing the same, and application thereof | US14366200 | 2013-01-21 | US09663626B2 | 2017-05-30 | Naoya Tayagaki; Yasuyuki Nomura |
| Heat-expandable microspheres with high encapsulation efficiency of a blowing agent and good heat-expansion performance, a process for reproducibly producing the heat-expandable microspheres and application thereof are provided. The heat-expandable microspheres comprise essentially a thermoplastic resin shell and a blowing agent encapsulated therein, and contain not more than 500 ppm of silicon, not more than 350 ppm of aluminum and not more than 600 ppm of the total of the silicon and aluminum. The heat-expandable microspheres retain at least 70% of the blowing agent encapsulated therein at the temperature which is the average of their expansion-initiation temperature and maximum expansion temperature. | ||||||
| 184 | Method for Coating Surfaces by Enzymatic Reaction | US15129468 | 2015-03-31 | US20170121558A1 | 2017-05-04 | Oliver Ingolf Strube; Wolfgang Bremser; Arne Alexander Rüdiger |
| The invention relates to a method for coating surfaces by enzymatic reaction of a biopolymer, wherein the method comprises the following steps: a) applying an enzyme to the surface of a substrate, and b) contacting the enzyme with the biopolymer to be deposited, wherein the enzyme cleaves the biopolymer, wherein the cleavage gives rise to at least two cleavage products of the biopolymer having different solubility in a solvent, and at least one cleavage product of the biopolymer having relatively low solubility is deposited on the surface of the substrate, and to a coated article obtainable by the method and to a coating composition comprising a biopolymer and at least one component selected from the group comprising binders, fillers, pigments and/or additives, and optionally a solvent. | ||||||
| 185 | Light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and preparation methods thereof | US14128629 | 2013-04-24 | US09216434B2 | 2015-12-22 | Ren-Liang Xiao; Chang-Hou Zhao; Cheng-Gui Liu; Xian-Fei Wan; Chang-Wu Yang; Hua-Guo Yin |
| Preparation methods of an anisotropic conductive adhesive film are provided. One of the preparation methods includes heating a solid-state light-curing resin, a solid-state thermosetting resin and a solid-state elastomer to form a mixture. A liquid-state light curing active monomer and plasticizer are added to the mixture. A leveling agent, antioxidant and insulating nanoparticles are added separately to the mixture. Conductive particles are added to the mixture. A light curing agent, latent heat curing agent and coupling agent are added to the mixture to produce a light-beat dual curing anisotropic conductive adhesive. The conductive adhesive is coated on a plastic film base material to form a semi-finished product. The semi-finished product is cured and dried to form a cured conductive adhesive layer, so that an anisotropic conductive adhesive film is produced. The anisotropic conductive adhesive layer is cut, and the anisotropic conductive adhesive film is rolled. | ||||||
| 186 | Method of applying a conductive adhesive | US14652050 | 2013-12-13 | US20150322298A1 | 2015-11-12 | Helge Kristiansen; Keith Redford; Tore Helland; Jakob Gakkestad; Ottar Opland |
| A method of applying a conductive adhesive comprising: using a conductive adhesive 18 made up of conductive beads 12 in an adhesive matrix 8, the conductive beads comprising a polymer core and a conductive coating and having a maximum dimension of 100 μm or less; and depositing droplets of the adhesive 18 on a substrate via a nozzle 20. | ||||||
| 187 | CONDUCTIVE MICROPARTICLES | US14651788 | 2014-01-14 | US20150318067A1 | 2015-11-05 | Itaru Asano; Ayano Ohno; Hiroshi Takezaki |
| Conductive microparticles, each are composed of a polymer microparticle and a conductive layer formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement of 1-100 MPa. Especially when the conductive microparticles have a shape recovery ratio (SR) of 0.1-13% under a load of 9.8 mN, a particle size distribution index of 1-3 and a particle size of 0.1-100 μm, the conductive microparticles can exhibit excellent conduction reliability in applications such as conductive adhesives for flexible boards. | ||||||
| 188 | Conductive Resilient Hollow Microsphere, Adhesive Composition, and Adhesive Articles | US14441486 | 2012-11-16 | US20150307753A1 | 2015-10-29 | WeiDe Liu; Badri Veeraraghavan; Cecil V. Francis; Yiwen Chu; Jing Fang |
| A conductive resilient hollow microsphere comprises a conductive layer enclosing a resilient polymeric hollow microsphere. An adhesive composition includes an insulating adhesive component and a plurality of the conductive resilient hollow microspheres. Adhesive articles including the adhesive composition are also disclosed. Methods of making the same are also disclosed. | ||||||
| 189 | Black Polyimide Battery Label | US14429183 | 2012-09-25 | US20150249233A1 | 2015-09-03 | Yihua Wang; Jun Zhang; Xin-Hui Zhang |
| A battery label having a black appearance and exhibiting flame retardancy properties is described. | ||||||
| 190 | ANISOTROPIC CONDUCTIVE ADHESIVE AND CONNECTION STRUCTURE | US14430440 | 2013-09-17 | US20150197672A1 | 2015-07-16 | Hidetsugu Namiki; Shiyuki Kanisawa; Akira Ishigami |
| An anisotropic conductive adhesive includes: a conductive particle including a resin particle and a conductive metal layer that is formed on a surface of the resin particle; a thermally conductive particle that is a metal particle or an insulation coated particle, wherein the metal particle has an average particle size that is smaller than an average particle size of the conductive particle, and the insulation coated particle has an average particle size that is smaller than the average particle size of the conductive particle and includes a metal particle and an insulating layer that is formed on a surface of the metal particle; and an adhesive component in which the conductive particle and the thermally conductive particle are dispersed. | ||||||
| 191 | ELECTRO-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE TAPE, AN ELECTRONIC MEMBER, AND A PRESSURE-SENSITIVE ADHESIVE | US14553532 | 2014-11-25 | US20150147556A1 | 2015-05-28 | Shu SASAKI; Jyunichi NAKAYAMA; Rie YUTO; Yoshio TERADA |
| An electro-conductive pressure-sensitive adhesive tape comprises a pressure-sensitive adhesive layer containing a resin component and an electro-conductive particle. The electro-conductive particle has at least one peak top existing in a particle size range from about 15 μm or more to about 50 μm or less and at least one further peak top existing in a particle size range from about 1 μm or more to about 12 μm or less in a particle size distribution curve thereof. The electro-conductive particle is contained in the pressure-sensitive adhesive layer in an amount of 40 mass % or more but 80 mass % or less, and has a true density in a level of larger than zero but smaller than 8 g/cm3. | ||||||
| 192 | Adhesive Containing Microparticles | US14117381 | 2012-05-11 | US20150056291A1 | 2015-02-26 | Anne Marie Wibaux; Peter Johnson |
| Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use. | ||||||
| 193 | ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD FOR MANUFACTURING SAME, LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME | US14515648 | 2014-10-16 | US20150034989A1 | 2015-02-05 | Hidetsugu NAMIKI; Shiyuki KANISAWA; Hideaki UMAKOSHI; Masaharu AOKI; Akira ISHIGAMI |
| an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal alloy including silver, gold and hafnium formed on the surface of a resin particle as a core by sputtering method. The light reflective metal layer is preferably formed having a composition ratio of a silver of at least 50% by weight to at most 80% by weight: a gold of at least 10% by weight to at most 45%: a hafnium of at least 10% by weight to at most 40% by weight, and a total ratio does not exceed 100% by weight. | ||||||
| 194 | Anisotropic Conductive Adhesive with Reduced Migration | US14054529 | 2013-10-15 | US20140353540A1 | 2014-12-04 | S. Kumar Khanna |
| Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field. | ||||||
| 195 | ADHESIVE HAVING ADHESIVE CAPSULE AND ORGANIC LIGHT EMITTING DISPLAY DEVICE COMPRISING ADHESIVE LAYER FORMED BY THE ADHESIVE | US13954944 | 2013-07-30 | US20140306187A1 | 2014-10-16 | Jae-Hyun Kim; Myung-Soo Huh |
| An adhesive includes a polymer matrix, and a plurality of adhesive capsules in the polymer matrix, wherein each of the adhesive capsules includes a shell, configured to shatter under pressure, and an adhesive polymer in the shell. | ||||||
| 196 | ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND SEMICONDUCTOR DEVICE CONNECTED BY THE SAME | US14229003 | 2014-03-28 | US20140291869A1 | 2014-10-02 | Kyoung Soo PARK; Soon Young KWON; Ji Yeon KIM; Young Woo PARK; Jae Sun HAN; Ja Young HWANG |
| An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×105/d2 to 10.0×105/d2 (particles) per square millimeter (mm2) (where d is a diameter of the conductive particles in μm). | ||||||
| 197 | ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD FOR MANUFACTURING SAME, AND LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME | US14246618 | 2014-04-07 | US20140217450A1 | 2014-08-07 | Akira ISHIGAMI; Shiyuki KANISAWA; Hidetsugu NAMIKI; Hideaki UMAKOSHI; Masaharu AOKI |
| An anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance is provided. The anisotropic conductive adhesive includes light reflective conductive particles in an insulating adhesive resin. The light reflective conductive particle includes a light reflective metal layer made of a metal having at least 60% of reflectance at a peak wavelength of 460 nm formed on the surface of a resin particle as a core, and a coating layer made of a silver alloy formed on the surface of the light reflective metal layer. The light reflective metal layer is preferably formed by a plating method. | ||||||
| 198 | KIND OF LIGHT-HEAT DUAL CURING ANISOTROPIC CONDUCTIVE ADHESIVE ANISOTROPIC CONDUCTIVE FILM AND THEIR PREPARATION METHODS | US14128629 | 2013-04-24 | US20140193599A1 | 2014-07-10 | Ren-Liang Xiao; Chang-Hou Zhao; Cheng-Cui Liu; Xian-Fei Wan; Chang-Wu Yang; Hua-Guo Yin |
| A kind of light-heat dual curing anisotropic conductive adhesive includes light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the components are counted according to weight percentage. The present invention also discloses a kind of light-heat dual curing anisotropic conductive film (ACF) and its preparation methods. Ultraviolet light curing method is applied to produce ACF can avoid using solvent to protect the natural environment. When using ACF, heat curing method is then applied to guarantee the quality of banding and the reliability. | ||||||
| 199 | ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE | US14098347 | 2013-12-05 | US20140091296A1 | 2014-04-03 | Hyun Jee YOO; Yoon Gyung CHO; Seung Min LEE; Suk Ky CHANG; Jung Sup SHIM |
| Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided. | ||||||
| 200 | Black Polyimide Battery Label | US13972088 | 2013-08-21 | US20140087232A1 | 2014-03-27 | Yihua WANG; Jun ZHANG; XinHui ZHANG |
| A battery label having a black appearance and exhibiting flame retardancy properties is described. | ||||||
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