| 序号 | 专利名 | 申请号 | 申请日 | 公开（公告）号 | 公开（公告）日 | 发明人 |
|---|---|---|---|---|---|---|
| 1 | 具有隔离式双壳结构的声衰减耳罩 | CN200780050539.6 | 2007-12-04 | CN101595738A | 2009-12-02 | 杜宇; 本间贤治; 迈克·A·沃德雷 |
| 公开了一种用于与声衰减头戴式耳机一起使用的具有双壳结构的耳罩组件。该耳罩组件包括安装在弹性外密封环上的杯形外壳以及安装在弹性内密封环上的杯形内壳。外壳和内壳通过两个密封环与佩戴者的耳朵周围的头表面形成邻接。两个壳在结构上是刚性的。通过将内壳与外壳隔离而使声衰减性能最大化。两个密封环通过软质柔性材料的薄表层互连，该薄表层用作外壳与内壳之间的振动隔离/解耦装置。 | ||||||
| 2 | 带有泵致动器的发音器 | CN00803413.3 | 2000-01-28 | CN1339237A | 2002-03-06 | 奥斯卡·肖尔; 汉斯-约切恩·雷达 |
| 本发明的目的是提供一种发音器,用于通过声音吸收消除干涉并用于再现信号、讲话和音乐。该声音优选地通过微型和纳米机械气泵(12)产生,该气泵的输出流量被致动器(16)根据所需的声音信号控制,并通过声道(11)输出;辅助通道(11′)作用在封闭的缓冲容积(15)上。至于传统的扩音器壳体,缓冲容积(15)的功能是在声道(11)和通道(11′)的无效偶极之外形成单极辐射器。在气泵(12)具有高压力比的情况下,所需的缓冲容积相应地小。产生声音的容积流量在声道(11)内通过微机械的流量表(18)测量,并可以根据理想值和实际值的比较而予以调节。最后,具有高流动阻力的孔(19)在缓冲容积(15)平衡气压波动和漂移误差。 | ||||||
| 3 | 阻抗匹配式同轴扬声器 | CN93223061.X | 1993-08-28 | CN2165591Y | 1994-05-18 | 黄伟棉 |
| 一种阻抗匹配式同轴扬声器，由前、后导磁板、磁体、场心柱、低音音圈、定心支片、盘架、压边、高中音支架、高中音振膜、压电陶瓷片、高中音耦合感应固定线圈、低音振膜等组成。由于在低音扬声器的场心柱上安装了高中音耦合感应固定线圈，并且利用压电陶瓷片与高中音耦合感应固定线圈并联相接，组成谐振系统。故本实用新型能在音频内全面工作。高、中、低音能在同一轴点上发声，起到消除相位失真的最佳效果。 | ||||||
| 4 | 复合阻抗扬声器 | CN93220186.5 | 1993-07-16 | CN2166569Y | 1994-05-25 | 卢广声 |
| 复合阻抗扬声器。本实用新型由支架、磁体、磁极芯、音圈、定心支片、纸盆、接线架组成，其特点是音圈设有二组或二组以上阻值不同的阻抗，使一个扬声器可兼有多种用途，一物多用，从而有利于减少产品零件及体积，降低材料成本，广泛适用于需用多个功率相近且又不同时工作的扬声器的产品，如电话机、音响、门铃、玩具等。 | ||||||
| 5 | 机电位移传感器 | CN85205208 | 1985-11-28 | CN85205208U | 1986-10-01 | 王百勤; 何和生 |
| 机电位移传感器是一种能直接测量位移的量测仪表。该传感器利用电桥、悬臂梁弹性变形等原理，在保持原机械式表功能的基础上，在表内装有一套电测装置，并采用可调的弹簧构架系统使机、电量化(校正)系数达到一致的效果，而使同量程的传感器满量程输出量非常一致。且机和电测读值完全对应，不需换算。为改善性能提高精度，复位弹簧与测杆平行，悬臂梁与测杆之间成50°～90°的夹角α。本机电位移传感器互换性通用性好，读数对应性重复性好，可互相校核、测读方便。 | ||||||
| 6 | Microphone apparatus | EP91303141.5 | 1991-04-09 | EP0452103A3 | 1992-07-08 | Ohkubo, Masashi, c/o SONY CORPORATION; Sasaki, Tooru, c/o SONY CORPORATION; Katsumata, Yasushi, c/o SONY CORPORATION; Kimura, Akira, c/o SONY CORPORATION |
A microphone apparatus having a microphone for producing a desired audio signal, and an adaptive signal processing section which is supplied as a reference signal with a vibration detected signal from a vibration detecting circuit for producing the vibration detected signal in response to a vibration of a vibration generating source whose vibration is picked up by the microphone and becomes an undesired noise signal, or a control signal for controlling a drive source of a driving unit of a recording apparatus for recording an output signal from the microphone and which reduces a noise signal contained in the audio signal. |
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| 7 | VOICE ENHANCEMENT METHODS AND SYSTEMS | PCT/US2014/016980 | 2014-02-18 | WO2014209434A1 | 2014-12-31 | TRAMMELL, Lloyd |
A computer implemented method for improving audio, comprising processing audio with a combination of wave adjustment tool WAT and a collection of preset settings for adjusting specific harmonic content to specific genres of music. The preset is selected from the group comprising different genres (styles or types) of music; auto-preset; and generic preset. The auto preset value is determined by the metadata which is commonly included in an audio file. In the event there is no match between the preset genre names and the one in the metadata, then the selected preset will be "Generic." This particular genre preset is designed for optimal sound across many genres, making it generic. |
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| 8 | SOUND-ATTENUATING EARMUFF HAVING ISOLATED DOUBLE-SHELL STRUCTURE | PCT/US2007086381 | 2007-12-04 | WO2008070662A3 | 2008-10-09 | DU YU; HOMMA KENJI; VAUDREY MICHAEL A |
| An earmuff assembly with a double-shell structure is disclosed for use with a sound-attenuating circumaural headset. The earmuff assembly comprises a cup-shaped outer shell mounted on a resilient outer sealing ring and a cup-shaped inner shell mounted on a resilient inner sealing ring. By means of the two sealing rings the outer and the inner shells are brought into abutment with the head surface around an ear of a wearer. Both shells are structurally rigid. The sound attenuation performance is maximized by isolating the inner shell from the outer shell. The two sealing rings are interconnected through a thin skin layer of soft compliant materials, which acts as a vibration isolating/decoupling means between the outer shell and the inner shell. | ||||||
| 9 | 아파트 방송 시스템의 세대별 스피커용 우회 접속장치 | KR1020200030697 | 2020-03-12 | KR102261742B1 | 2021-06-07 | |
| 10 | SIGNAL QUALITY DETERMINING DEVICE AND METHOD | EP96908056.3 | 1996-03-13 | EP0815705B1 | 1998-09-30 | BEERENDS, John, Gerard |
| A device for determining the quality of an ouput signal to be generated by a signal processing circuit with respect to a reference signal is provided with a first series circuit for receiving the output signal and with a second series circuit for receiving the reference signal and generates an objective quality signal by means of a combining circuit coupled to the two series circuits. The poor correlation between said objective quality signal and a subjective quality signal to be assessed by human observers can be considerably improved by reducing, in a differential arrangement, present in the combining circuit, for determining the difference between the two series circuit signals, said difference by a certain value, preferably as a function of a series circuit signal, and the poor correlation can be further improved by disposing a scaling circuit between the two series circuits for scaling at least one series circuit signal, it is furthermore also possible to scale the quality signal as a function of said scaling arrangement. | ||||||
| 11 | Microphone apparatus | EP91303141.5 | 1991-04-09 | EP0452103B1 | 1995-09-27 | Ohkubo, Masashi, c/o SONY CORPORATION; Sasaki, Tooru, c/o SONY CORPORATION; Katsumata, Yasushi, c/o SONY CORPORATION; Kimura, Akira, c/o SONY CORPORATION |
| 12 | Semiconductor device | JP2006303837 | 2006-11-09 | JP2007199049A | 2007-08-09 | SAKAKIBARA SHINGO; SAITO HIROSHI |
| <P>PROBLEM TO BE SOLVED: To load stably on a circuit board, while being miniaturized without changing the size of a semiconductor sensor chip, in a semiconductor device wherein the semiconductor sensor chip having a diaphragm is fixed on the board. <P>SOLUTION: This semiconductor device is characterized as follows: the approximately planar substrate 3 having the semiconductor sensor chip 5 fixed on the upper surface 3a is constituted in the sealed state with a resin layer 21, while exposing a plurality of external connection leads 13 and mounting leads 17 to the outside; the plurality of external connection leads 13 are connected electrically to the semiconductor sensor chip 5, and arranged in one row in parallel on the adjacent side to the semiconductor sensor chip 5; and the mounting leads 17 are arranged on positions on the opposite side to the plurality of external connection leads 13 through the semiconductor sensor chip 5. <P>COPYRIGHT: (C)2007,JPO&INPIT | ||||||
| 13 | JPS552798B2 - | JP8450877 | 1977-07-14 | JPS552798B2 | 1980-01-22 | |
| 14 | JPS5438491B1 - | JP7469069 | 1969-09-22 | JPS5438491B1 | 1979-11-21 | |
| 15 | Electroacoustic transducer | JP14359378 | 1978-11-22 | JPS5482186A | 1979-06-30 | JIYON KURISUTOFUAA GURIINUTSUD |
| 16 | JPS5351700Y2 - | JP13983076 | 1976-10-18 | JPS5351700Y2 | 1978-12-11 | |
| 17 | JPS5356817U - | JP13983376 | 1976-10-18 | JPS5356817U | 1978-05-15 | |
| 18 | JPS5356815U - | JP13983176 | 1976-10-18 | JPS5356815U | 1978-05-15 | |
| 19 | JPS5356814U - | JP13983076 | 1976-10-18 | JPS5356814U | 1978-05-15 | |
| 20 | JPS5247474Y2 - | JP8474073 | 1973-07-23 | JPS5247474Y2 | 1977-10-28 | |
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