专利汇可以提供DOHERTY POWER AMPLIFIER COMBINER WITH TUNABLE IMPEDANCE TERMINATION CIRCUIT专利检索,专利查询,专利分析的服务。并且Doherty power amplifier combiner with tunable impedance termination circuit. A signal combiner can include a balun transformer circuit having a first coil and a second coil. The first coil can be implemented between a first port and a second port. The second coil can be implemented between a third port and a fourth port. The first port and the third port can be coupled by a first capacitor. The second port and fourth port can be coupled by a second capacitor. The first port can be configured to receive a first signal. The fourth port can be configured to receive a second signal. The second port can be configured to yield a combination of the first signal and the second signal. The signal combiner can include a termination circuit that couples the third port to a ground. The termination circuit can include a tunable impedance circuit.,下面是DOHERTY POWER AMPLIFIER COMBINER WITH TUNABLE IMPEDANCE TERMINATION CIRCUIT专利的具体信息内容。
What is claimed is:
This application claims priority to U.S. Provisional Application No. 62/036,854 filed Aug. 13, 2014, entitled TUNABLE WIDE-BAND HYBRID-BASED DOHERTY COMBINER WITH WIDE-BAND HARMONIC REJECTION, the disclosure of which is hereby expressly incorporated by reference herein in its entirety.
1. Field
The present disclosure generally relates to radio-frequency (RF) signal combiners.
2. Description of the Related Art
Multi-mode/multi-band (MMMB) power amplifier modules (PAMs) useful for 4G LTE (Long Term Evolution) applications preferably operate in back-off to satisfy high peak-to-average-power ratio (PAPR) specifications while maintaining high power-added efficiency (PAE). Compared to envelope tracking PAMs for efficiency enhancement under back-off, Doherty PAMs are capable of meeting high efficiency with high linearity under back-off with much reduced system complexity and reduced calibration and digital pre-distortion (DPD) specifications. However, typical Doherty power amplifier architectures are bandwidth limited due to the narrowband nature of existing Doherty power combiners.
In accordance with some implementations, the present disclosure relates to a signal combiner including a balun transformer circuit having a first coil and a second coil. The first coil is implemented between a first port and a second port. The second coil is implemented between a third port and a fourth port. The first port and the third port are coupled by a first capacitor. The second port and the fourth port are coupled by a second capacitor. The first port is configured to receive a first signal. The fourth port is configured to receive a second signal. The second port is configured to yield a combination of the first signal and the second signal. The signal combiner further includes a termination circuit that couples the third port to a ground. The termination circuit includes a tunable impedance element.
In some embodiments, the signal combiner can further include a controller configured receive a band select signal and to tune the tunable impedance circuit based on the band select signal. In some embodiments, the controller can be further configured to tune at least one of the first capacitor or the second capacitor.
In some embodiments, the first port can be configured to receive a carrier-amplified signal from a Doherty power amplifier (PA) and the fourth port can be configured to receive a peaking-amplified signal from the Doherty PA. In some embodiments, the tunable impedance circuit includes a plurality of capacitors. Each one of the plurality of capacitors can have a capacitance approximately equal to a multiplicative inverse of two times pi times a respective operating frequency of the Doherty PA times a characteristic impedance of a load coupled to the Doherty PA. In some embodiments, the signal combiner can include a controller configured to receive a band select signal indicative of an operating frequency and to tune the tunable impedance circuit to have a capacitance approximately equal to a multiplicative inverse of two times pi times the operating frequency times a characteristic impedance of a load coupled to the Doherty PA. In some embodiments, the controller can be further configured to tune the first capacitor and the second capacitor to have a capacitance approximately equal to half the capacitance of the tunable impedance circuit.
In some embodiments, the first port can be configured to receive a peaking-amplified signal from a Doherty power amplifier (PA) and the fourth port can be configured to receive a carrier-amplified signal from the Doherty PA. In some embodiments, the tunable impedance circuit can include a plurality of inductors. Each one of the plurality of inductors can have an inductance approximately equal to a characteristic impedance of a load coupled to the Doherty PA divided by two times pi times a respective operating frequency of the Doherty PA. In some embodiments, the signal combiner can include a controller configured to receive a band select signal indicative of an operating frequency and to tune the tunable impedance circuit to have an inductance approximately equal to a characteristic impedance of a load coupled to the Doherty PA divided by two times pi times the operating frequency.
In some embodiments, the tunable impedance matching circuit can include a plurality of impedance elements connected in parallel, each one of the plurality of impedance elements including an impedance and a switch connected in series.
In some embodiments, the termination circuit can further include a harmonic rejection circuit configured to reduce the strength of one or more harmonics at the second port. In some embodiments, the harmonic rejection circuit can include a plurality of resonant elements connected in series, each one of the plurality of resonant elements including an inductor and a capacitor connected in parallel. In some embodiments, each one of the plurality of resonant elements can have a resonant frequency approximately equal to a multiple of an operating frequency of the signal combiner. In some embodiments, each one of the plurality of resonant elements can have a resonant frequency approximately equal to twice a respective operating frequency of the signal combiner. In some embodiments, the harmonic rejection circuit is implemented between the third port and the tunable impedance circuit.
In some implementations, the present disclosure relates to a power amplifier module including a packaging substrate configured to receive a plurality of components. The power amplification module includes a signal combiner implemented on the packaging substrate. The signal combiner includes a balun transformer circuit having a first coil and a second coil. The first coil is implemented between a first port and a second port. The second coil is implemented between a third port and a fourth port. The first port and the third port are coupled by a first capacitor. The second port and the fourth port coupled by a second capacitor. The first port is configured to receive a first signal. The fourth port is configured to receive a second signal. The second port is configured to yield a combination of the first signal and the second signal. The signal combiner further includes a termination circuit that couples the third port to a ground. The termination circuit includes a tunable impedance circuit.
In some embodiments, the PA module can further include a controller implemented on the packaging substrate, the controller configured to receive a band select signal and tune the tunable impedance circuit based on the band select signal.
In some implementations, the present disclosure relates to a wireless device including a transceiver configured to generate a radio-frequency (RF) signal. The wireless device includes a power amplifier (PA) module in communication with the transceiver. The PA module includes an input circuit configured to receive the RF signal and split the RF signal into a first portion and a second portion. The PA module further includes a Doherty PA having a carrier amplification path coupled to the input circuit to receive the first portion and a peaking amplification path coupled to the input circuit to receive the second portion. The PA module further includes an output circuit coupled to the Doherty amplifier circuit. The output circuit includes a balun transformer circuit having a first coil and a second coil. The first coil is implemented between a first port and a second port. The second coil is implemented between a third port and a fourth port. The first port and the third port are coupled by a first capacitor. The second port and the fourth port are coupled by a second capacitor. The first port is configured to receive a first signal via the carrier amplification path. The fourth port is configured to receive a second signal via the peaking amplification path. The second port is configured to yield a combination of the first signal and the second signal as an amplified RF signal. The PA module further includes a termination circuit that couples the third port to a ground. The termination circuit includes a tunable impedance circuit. The wireless device further includes an antenna in communication with the PA module. The antenna is configured to facilitate transmission of the amplified RF signal.
In some embodiments, the wireless device can further include a controller configured to receive a band select signal and to tune the tunable impedance circuit based on the band select signal.
The present disclosure relates to U.S. patent application Ser. No. 14/797,261, entitled CIRCUITS, DEVICES AND METHODS RELATED TO COMBINERS FOR DOHERTY POWER AMPLIFIERS, filed on Jul. 13, 2015, and hereby incorporated by reference herein in its entirety.
The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the claimed invention.
Described herein are circuits, systems, and methods for addressing the issue of maintaining high PAE under linearity requirements of 4G LTE standards for a MMMB PAM by proposing a wideband tunable hybrid based combiner for a Doherty power amplifier architecture. Load modulation using Doherty power amplifier is another method of maintaining high efficiency under power back-off. In this approach, two parallel PAMs are used, a carrier amplifier and a peaking amplifier. The peaking amplifier modulates the load seen by the carrier amplifier and thus allows the carrier amplifier to remain in high efficiency, saturated operation even at back-off. This load modulation can be achieved using impedance matching networks having an impedance matched to a specific frequency. Thus for a MMMB PAM without a tunable impedance circuit, several Doherty PAMs (each of which requires two amplifiers) can be used to cover several bands, which may make implementation costly and/or impractical.
The example PA 100 is shown to include an input port (RF_IN) for receiving an RF signal to be amplified. Such an input RF signal can be partially amplified by a pre-driver amplifier 102 before being divided into a carrier amplification path 110 and a peaking amplification path 130. Such a division can be achieved by a divider 104.
In
In
The hybrid circuit of
Thus, in
In the example of
In some embodiments, it can be shown that such a specific termination can be implemented as a capacitance (e.g., capacitor) whose reactance is equal in magnitude to characteristic impedance of the system. Accordingly, such a capacitance can be expressed as C=1/(2 π f Z0), where f is the operating frequency of the Doherty PA and Z0 is a characteristic impedance of a load coupled to the Doherty PA.
In some implementations, the capacitance of the third capacitor 323 is approximately equal to a multiplicative inverse of two times pi times an operating frequency of the Doherty PA times a characteristic impedance of a load coupled to the Doherty PA, e.g., C=1/(2 π f Z0), where f is the operating frequency of the Doherty PA and Z0 is a characteristic impedance of a load coupled to the Doherty PA.
It can be shown that an alternative configuration with an inductive termination of L=Z0/(2 π f) can provide Doherty combiner functionality in a similar manner. Port positions of carrier and peaking amplifier can be swapped in this case.
In some implementations, the inductance of the inductor 423 is approximately equal to a characteristic impedance of a load coupled to the Doherty PA divided by two times pi times an operating frequency of the Doherty PA, e.g., multiplicative inverse of two times pi times an operating frequency of the Doherty PA times a characteristic impedance of a load coupled to the Doherty PA, e.g., L=Z0/(2 π f), where f is the operating frequency of the Doherty PA and Z0 is a characteristic impedance of a load coupled to the Doherty PA.
A signal combiner may be used for multiple modes or multiple operating frequencies as part of a multi-mode/multi-band (MMMB) power amplifier module (PAM). Thus, in some implementations, rather than a single capacitor or single inductor (as shown in
The signal combiner 500 is controlled by a controller 520 configured to receive a band select signal indicative of a current operating frequency of the system of which the signal combiner 500 is a part. The controller 520 is further configured to tune the tunable impedance circuit 523 based on the band select signal. In some implementations, the controller 520 is further configured to tune at least one of the first capacitor 521 or the second capacitor 522.
In some implementations, the first port 511 is configured to receive a carrier-amplified signal from a Doherty PA (e.g., via the first input port 531) and the fourth port 514 is configured to receive a peaking-amplified signal from the Doherty PA (e.g., via the second input port 532). Thus, the controller 520 can be configured to tune the tunable impedance circuit 523 to have a capacitance approximately equal to a multiplicative inverse of two times pi times the operating frequency (as indicated by the band select signal) times a characteristic impedance of a load coupled to the Doherty PA. The controller 520 can further tune the first capacitor 521 and/or the second capacitor 522 to have a capacitance approximately equal to half the capacitance of the tunable impedance circuit 523.
In some implementations, the first port 511 is configured to receive a peaking-amplified signal from a Doherty PA (e.g., via the first input port 531) and the fourth port 514 is configured to receive a carrier-amplified signal from the Doherty PA (e.g., via the second input port 532). Thus, the controller 520 can be configured to tune the tunable impedance circuit 523 to have an inductance approximately equal to a characteristic impedance of a load coupled to the Doherty PA divided by two times pi times the operating frequency (as indicated by the band select signal).
In some implementations, the tunable impedance circuit 623 is part of a system including a Doherty PA configured to operate at one or more operating frequencies. Thus, the impedances 610a-610d can include a plurality of capacitors, each one of the plurality of capacitors having a capacitance approximately equal to a multiplicative inverse of two times pi times a respective operating frequency of a Doherty PA times a characteristic impedance of a load coupled to the Doherty PA. The impedances 610a-610d can alternatively (or additionally) include a plurality of inductors, each one of the plurality of inductors having an inductance approximately equal to a characteristic impedance of a load coupled to the Doherty PA divided by two times pi times a respective operating frequency of the Doherty PA.
The harmonic rejection circuit 724 is configured to reduce the strength of one or more harmonics at the second port 512 (and, consequently the output port 533). When the first input port 531 is configured to receive a carrier-amplified signal and the second input port 532 is configured to receive a peaking-amplified signal, the carrier-amplified signal and the peaking-amplified signal may include unwanted harmonics of the RF signal that is being amplified. The harmonic rejection circuit 724 is configured to reduce the strength of these harmonics at the output port 533.
In some implementations, a device and/or a circuit having one or more features described herein can be included in an RF electronic device such as a wireless device. Such a device and/or a circuit can be implemented directly in the wireless device, in a modular form as described herein, or in some combination thereof. In some embodiments, such a wireless device can include, for example, a cellular phone, a smart-phone, a hand-held wireless device with or without phone functionality, a wireless tablet, etc.
Referring to
The baseband sub-system 1008 is shown to be connected to a user interface 1002 to facilitate various input and output of voice and/or data provided to and received from the user. The baseband sub-system 1008 can also be connected to a memory 1004 that is configured to store data and/or instructions to facilitate the operation of the wireless device, and/or to provide storage of information for the user.
In the example wireless device 1000, outputs of the PAs 100a-100d are shown to be matched (via respective match circuits 1020a-1020d) and routed to their respective diplexers 1012a-1012d. Such amplified and filtered signals can be routed to an antenna 1016 (or multiple antennas) through an antenna switch 1014 for transmission. In some embodiments, the diplexers 1012a-1012d can allow transmit and receive operations to be performed simultaneously using a common antenna (e.g., 1016). In
A number of other wireless device configurations can utilize one or more features described herein. For example, a wireless device does not need to be a multi-band device. In another example, a wireless device can include additional antennas such as diversity antenna, and additional connectivity features such as Wi-Fi, Bluetooth, and GPS.
Unless the context clearly requires otherwise, throughout the description and the claims, the words “comprise,” “comprising,” and the like are to be construed in an inclusive sense, as opposed to an exclusive or exhaustive sense; that is to say, in the sense of “including, but not limited to.” The word “coupled”, as generally used herein, refers to two or more elements that may be either directly connected, or connected by way of one or more intermediate elements. Additionally, the words “herein,” “above,” “below,” and words of similar import, when used in this application, shall refer to this application as a whole and not to any particular portions of this application. Where the context permits, words in the above Description using the singular or plural number may also include the plural or singular number respectively. The word “or” in reference to a list of two or more items, that word covers all of the following interpretations of the word: any of the items in the list, all of the items in the list, and any combination of the items in the list.
The above detailed description of embodiments of the invention is not intended to be exhaustive or to limit the invention to the precise form disclosed above. While specific embodiments of, and examples for, the invention are described above for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize. For example, while processes or blocks are presented in a given order, alternative embodiments may perform routines having steps, or employ systems having blocks, in a different order, and some processes or blocks may be deleted, moved, added, subdivided, combined, and/or modified. Each of these processes or blocks may be implemented in a variety of different ways. Also, while processes or blocks are at times shown as being performed in series, these processes or blocks may instead be performed in parallel, or may be performed at different times.
The teachings of the invention provided herein can be applied to other systems, not necessarily the system described above. The elements and acts of the various embodiments described above can be combined to provide further embodiments.
While some embodiments of the inventions have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the disclosure. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the disclosure. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the disclosure.
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