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Clad material for electronic components

阅读:849发布:2023-01-28

专利汇可以提供Clad material for electronic components专利检索,专利查询,专利分析的服务。并且PURPOSE:To make a clad material for electronic components which has low expansibility and high adhesiveness, thermal conductivity and electrical conductivity, by preparing a Fe-Ni-alloy plate as base material, cladding one side of the plate with Cu and the other side with Al, and making the percentage by volume of Al more than that of Cu when preventing the bending of this plate. CONSTITUTION:A clad material is made by rolling, pressing and sticking Al 3 on one side and Cu 2 on the other side of a Fe-Ni-alloy plate 1. Then, epoxy resin as an insulating layer 5 is pressed and sticked by heating on the Al side 3 of the clad and an electrolytic copper foil 6 is pressed and sticked by heating on the epoxy resin to make a surface mounting substrate. After the surface Cu foil of this composite substrate is patterned by etching and a circuit is formed on it, an IC element 8 is mounted on it and connected with a bonding wire 7 to make a semiconductor device. In this way it is possible to obtain a cladding material for electronic components which has low expansibility, high adhesiveness with isolation material, also high electrical conductivity and thermal conductivity.,下面是Clad material for electronic components专利的具体信息内容。

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