专利汇可以提供Semiconductor device专利检索,专利查询,专利分析的服务。并且PURPOSE: To eliminate a cumbersome working when a semiconductor device is assembled, by constituting the device with a first bonding layer, which fixes a die pad tape to a supporting body and fixes a semiconductor pellet arranged on one surface thereof to the supporting body, and a second bonding layer, which fixes the supporting body arranged on the other surface to leads.
CONSTITUTION: A semiconductor pellet 4 is directly bonded and fixed to a first bonding layer 11 on the upper surface of a supporting body 10 for a die pad tape. Meanwhile, a second bonding layer 12 at the lower surface of the supporting body is bonded to leads 2 of a lead frame. An electrode 7 is connected to each lead 2 with each bonding wire 6. These parts are made to form a unitary body with a packaging resin 8. The die pad tape is arbitrarily cut in correspondence with the shape and the size of the semiconductor pellet and can be provided for the semiconductor-pellet mounting part of the lead frame. The device is effective for the efficiency in design and manufacture and the cost down of the pellet and the lead frame. Since paste-state die bonding agent is not required, workability in assembling the device is improved.
COPYRIGHT: (C)1988,JPO&Japio,下面是Semiconductor device专利的具体信息内容。
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