Semiconductor integrated circuit packaging device and manufacture thereof
专利汇可以提供Semiconductor integrated circuit packaging device and manufacture thereof专利检索，专利查询，专利分析的服务。并且PURPOSE: To obtain a film carrier which enables a pad pitch to be small and enables a semiconductor integrated circuit having a high speed operation characteristic to be packaged, by forming a through-hole to connect the conductive layer on the top surface side of a film with the one on the under surface side of the film, etching from both surface sides of the film.
CONSTITUTION: Two sensitizing films are stuck on the both surfaces of a film 2 and dry film patterns 9a, 9b are formed through an exposure and a development. Then, recessed parts 10a, 10b are formed by etching and the dry film patterns 9a, 9b are peeled and removed. Further, metal thin films 3a, 3b of a two layers structure are formed by a sputtering method and on the upper layer thereof resist patterns 7a, 7b are formed. Thereafter, a copper plating layer 4a is formed selectively on the surface of the exposed metal thin film 3a by electrodeposition. Further, a through-hole 11 and a device hole 5 are formed by etching. Thereafter, the patterns 7a, 7b are removed and a dry film 8 is newly stuck on the under surface. Then, a copper layer 4b is formed selectively on the surface of the metal thin film 3b by the electric field plating method. Finally, the resist pattern 8 is removed and the metal thin film exposed on the under surface is removed by etching. Thereby, the film carrier having the through-hole 11 is completed.
COPYRIGHT: (C)1991,JPO&Japio，下面是Semiconductor integrated circuit packaging device and manufacture thereof专利的具体信息内容。
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