Manufacture of semiconductor device
专利汇可以提供Manufacture of semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE: To obtain a semiconductor device, in which the active elements of a plurality of semiconductor elements can be aligned at equal intervals, by a method wherein the device is provided with a hole to insert the semiconductor elements and conductors extending to the hole inner surface, the semiconductor elements are inserted in the hole and the conductors and the electrodes of the semiconductor elements are connected to one another conforming to the positions of the conductors.
CONSTITUTION: A film consisting of copper is pasted all over the whole surface of a thin film 9, which is provided with a hole to insert semiconductor elements 2 in its central part and is stable thermally and chemically, including the hole 9b as well and conductor circuits 10 are formed with good accuracy at positions where become equal with the positions of electrodes 4 on one semiconductor element 2 using a photoetching technique or the like and also, at such positions that when a plurality of semiconductor elements 2 are mounted, the intervals between active elements 3 on all the elements 2 become equal with one another. On the other hand, bump electrodes 11 are formed on the electrodes 4 on the elements 2 to contrive so that the circuits 10 are easy to bond to the electrodes 3. In this case, as the point 10a of each conductor circuit is made in such a way as to conform to each bump electrode 11, the film 9 and the elements 2 can be aligned to each other by aligning the points 10a of the conductor circuits and the bump electrodes 11 to one another and no variability is generated in a connection length.
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