专利汇可以提供Supporting mechanism of wafer专利检索,专利查询,专利分析的服务。并且PURPOSE: To enable to perform smooth parallel positioning work of the wafer by a method wherein a wafer chuck is elastically supported in a chuck support being enabled inclining motion by a spring member, and a lock mechanism is provided to constitute a wafer supporting part.
CONSTITUTION: When the chuck support 33 comes up, the support 33 moves to incline bending a plate spring as to make the surface of a wafer 20 to come in contact with respective leveling pads 30. Accordingly the wafer 20 is so regulated as the surface thereof is made to coincide with the standard face. When a pressure sensing element 36 detects that upward pressing force reached at the prescribed value, a detected signal therefrom is inputted to a control circuit 37, the circuit 37 supplies a current to electromagnets 52, and the electromagnets 52 absorb a lock plate 51. As a result, the wafer chuck 38 is locked in that condition, and thereafter although the wafer 20 is removed from the pads 30, the wafer 20 can be held in the condition as it is. After then by making the support 33 with the chuck 38 and the wafer 20 to come down in parallel, the position of the surface of the wafer 20 can be set up precisely.
COPYRIGHT: (C)1981,JPO&Japio,下面是Supporting mechanism of wafer专利的具体信息内容。
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