Device for bonding piece on tape
专利汇可以提供Device for bonding piece on tape专利检索，专利查询，专利分析的服务。并且PURPOSE: To surely and quickly bond a wafer without damaging it, by intermittently moving a tape, only the top of which is coated with a bonding agent and by using a Bernoulli's chuck to place the wafer on the tape and lifting up the tape by a bonding mechanism synchronously with the placing of the wafer.
CONSTITUTION: A tape 14, only the top of which is coated with a bonding agent, is intermittently moved by four pairs of rollers 15 which are provided in a tape moving mechanism and located on the obverse and reverse sides of the tape. A surface A surrounded by the rollers 15 is in a wafer bonding position. A wafer feed stage 18, on which a wafer 19 is placed, is provided near the tape 14. When the tape 14 is at rest, the wafer 19 is sucked by a Bernoulli's chuck 24 which constitutes a wafer conveying mechanism 22. After that, the arm 23 of the mechanism 22 is swung to transfer the wafer 19 to the position A. A bonding mechnaism 16 provided below the position A is operated synchronously with the transfer of the wafer to lift up the tape 14 by an upper rubber pusher 17 and fix the wafer 19.
COPYRIGHT: (C)1980,JPO&Japio，下面是Device for bonding piece on tape专利的具体信息内容。
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