Method for surface treatment
专利汇可以提供Method for surface treatment专利检索，专利查询，专利分析的服务。并且PURPOSE:To form a treating film instantaneously on the surface of a material by covering the surface of material to be treated by gas or liquid, illuminating it by light or particles, and reacting the surface of the material with the gaseous or liquid constituent. CONSTITUTION:An Si water 1 is attached to the inner wall of a container 2 by using vacuum chuck and the like, dried O2 is flown from an inlet port 3 of said container 2, amount of exhaustion from an output port 4 is controlled, and a specified pressure is indicated by a pressure gage 6. A wall of said container 2 opposing the wafer 1 is formed by glass, transparent reinforced resin, and the like, and a spot 50 of a laser beam is illuminated on said wall. That is, the light from an Ar ion laser 51 is finely focussed by a lens 52, and is swept and illuminated on the wafer 1 by way of a y-direction mirror sweeper 53 and an x-direction mirror sweeper 54. In this way, the surface of the wafer 1 and O2 are reacted in a very short time, and the desired SiO2 film can be obtained. Steam may be used instead of O2, and the film thickness can be freely controlled by adjusting the illumination of the laser light.，下面是Method for surface treatment专利的具体信息内容。
| 标题 | 发布/更新时间 | 阅读量 |
|---|---|---|
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| 静电卡盘及半导体加工设备 | 2020-05-08 | 94 |
| 晶片的加工方法和磨削装置 | 2020-05-11 | 779 |
| 磨削磨具的修锐方法和修锐用晶片 | 2020-05-11 | 629 |
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