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Cooling device for electronic apparatus

阅读:397发布:2021-03-07

专利汇可以提供Cooling device for electronic apparatus专利检索,专利查询,专利分析的服务。并且PURPOSE:To reduce and uniformize temperature distribution by colliding cooling fluid as jet with an IC chip and an LSI package from small holes, which are at the positions corresponding to the IC chip and the LSI chip and that have the open area corresponding to the calorific power of each IC chip. CONSTITUTION:A small high-performance calculator loads a plurality of substrates 1 on which a plurality of IC chips 2 and a plurality of LSI packages 7 are arranged, the calculator is provided with a fan 13 which supplies cooling fluid between the substrates 1, a jet cooling device 16 which has an air supplying duct 30 at the top and an air exit at the bottom. The substrate 1 is provided with a small fan 3, the jet cooling device 16 can be loaded and unloaded and when the group of the IC chips 2 are generating less heat, the device 16 is removed. The LSI package 7 is provided with a heat releasing fin 27 and the air supplying duct 30 is formed by bending in a series of U-shapes or in a shape of teeth of a comb. At the tooth-shaped part, a plurality of the small holes 6 are provided and the cooling fluid is collided with each LSI package 7 and the group of the IC chips 2 from the small holes 6 as jet 4.,下面是Cooling device for electronic apparatus专利的具体信息内容。

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