ASSEMBLY FOR THE FULL-SURFACE ADHESIVE BONDING OF SUBSTANTIALLY CONGRUENT ADHESIVE-BONDING SURFACES OF A FIRST AND A SECOND JOINING PARTNER
专利汇可以提供ASSEMBLY FOR THE FULL-SURFACE ADHESIVE BONDING OF SUBSTANTIALLY CONGRUENT ADHESIVE-BONDING SURFACES OF A FIRST AND A SECOND JOINING PARTNER专利检索，专利查询，专利分析的服务。并且The invention relates to an assembly for the full-surface adhesive bonding of substantially congruent adhesive-bonding surfaces of a first and a second joining partner, comprising: the first joining partner (1); the second joining partner (2); a glue layer (3), which consists of polar, flowable glue and which is applied to the adhesive-bonding surface (1a) of the first joining partner (1); means (8) for holding the second joining partner (2) over the adhesive-bonding surface (1a) of the first joining partner (1) in such a way that the adhesive-bonding surface (2a) of the second joining partner (2) faces the glue layer (3) on the first joining partner (1) and is spaced apart by means of an air gap (5) and the distance between the first joining partner (1) and the second joining partner (2) defined by the air gap (5) is dimensioned in such a way that a capillary volume is formed; means (7) for producing an electric field (10) in order to obtain a local charge displacement (11) on and/or in the second joining partner (1) by means of electrical influence, the charge displacement (11) being suitable for attracting the polar glue in such a way that the glue wets the adhesive-bonding surface (2a) of the second joining partner (2) first in the region of the local charge displacement (11), wherein the means for producing an electric field comprise an electrode (7), which is arranged on the side of the second joining partner (2) facing away from the adhesive-bonding surface (2a) and is electrically insulated from the second joining partner (2).，下面是ASSEMBLY FOR THE FULL-SURFACE ADHESIVE BONDING OF SUBSTANTIALLY CONGRUENT ADHESIVE-BONDING SURFACES OF A FIRST AND A SECOND JOINING PARTNER专利的具体信息内容。
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