Device and method for fabrication of semiconductor device
专利汇可以提供Device and method for fabrication of semiconductor device专利检索，专利查询，专利分析的服务。并且PURPOSE: To reduce the manufacture cost by enabling one unit to attain both mount ing and bonding operations sequentially which are needed for the fabrication of semiconductor pellets.
CONSTITUTION: Pellet 16 arranged on an adhesive tape, etc., is positioned under nozzle 11 constituting the mount-bonding unit and then vacuum-adsorbed inside the inverted pyramid at the tip of nozzle 11. Next, nozzle 11 is raised and the arm holding this is turned around to carry pellet 16 to the mount position of the frame; and nozzle 11 is lowered and pellet 16 is pressed onto the mount by capillary 13. The vacuum of pipe tap 12 is filled with nitrogen gas, ball 15 is generated at the tip of bonding wire 14 penetrating through capillary, and pressure is applied onto capillary 13, thereby anchoring ball 15 and pellet 16 together. Next, nozzle 11 is raised together with capillary 13, wire 14 is cut off by a hydrogen torch, and this operation is repeated, thereby attaining the mount bonding
COPYRIGHT: (C)1979,JPO&Japio，下面是Device and method for fabrication of semiconductor device专利的具体信息内容。
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