Chips with hermetically sealed but openable chambers专利检索- 利用能量或化学作用处理专利检索查询-专利查询网

Chips with hermetically sealed but openable chambers
申请号	US15237965	申请日	2016-08-16	公开(公告)号	US10005271B2	公开(公告)日	2018-06-26
申请人	Raymond Miller Karam; Thomas Wynne; Anthony Thomas Chobot;			发明人	Raymond Miller Karam; Thomas Wynne; Anthony Thomas Chobot;
摘要	Embodiments generally relate to chips containing one or more hermetically sealed chambers that may be dismantled under controlled conditions using a release technique. In one embodiment a chip comprises a first hermetic seal bonding first and second elements to create a first chamber and a second hermetic seal bonding third and fourth elements to create a second chamber encompassing the first chamber. The first hermetic seal may be broken open independently of the second hermetic seal by the application of a mechanical or thermal technique.
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